公开(公告)号：US07732258B2

公开(公告)日：2010-06-08

申请号：US12222854

申请日：2008-08-18

申请人： Tae-Hun Kim

发明人： Tae-Hun Kim

IPC分类号： H01L21/58 ,  H01L21/60

CPC分类号： H01L23/49541 ,  H01L21/4821 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10S438/94 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame and a method of fabricating a semiconductor package including the lead frame, where the lead frame includes a die pad, a tie bar supporting the die pad, and a plurality of leads. The leads may include inner and outer leads arranged along an outer periphery of the die pad, with each of the inner and outer leads having tip terminals. The lead frame may include a connecting bar connected to tip terminals of each of the inner leads. In the method, a bonding pad of a semiconductor chip is mounted on the die pad and connected via a conductive wire to the inner leads of the lead frame. The semiconductor chip, wire and inner leads may be subjected to a molding process, and the connecting bar which connects the tip terminals of the inner leads may be cut so as to independently separate each of the inner leads from the die pad.

摘要翻译： 引线框架和制造包括引线框架的半导体封装的方法，其中引线框架包括管芯焊盘，支撑管芯焊盘的连接杆和多个引线。 引线可以包括沿着芯片焊盘的外周布置的内引线和外引线，其中每个内引线和外引线都具有尖端。 引线框可以包括连接到每个内引线的尖端的连接杆。 在该方法中，半导体芯片的焊盘安装在芯片焊盘上，并通过导线连接到引线框架的内引线。 可以对半导体芯片，导线和内部引线进行模制处理，并且可以切割连接内部引线的末端的连接杆，以便将每个内部引线与芯片焊盘独立地分开。

公开(公告)号：USD615957S1

公开(公告)日：2010-05-18

申请号：US29342147

申请日：2009-08-19

申请人： Tai-Hyung Ju ,  Kyung-Hoon Lee ,  Sang-Sung Woo ,  Bum-Ho Chun ,  Tae-Hun Kim

设计人： Tai-Hyung Ju ,  Kyung-Hoon Lee ,  Sang-Sung Woo ,  Bum-Ho Chun ,  Tae-Hun Kim

公开(公告)号：US20090272974A1

公开(公告)日：2009-11-05

申请号：US12453144

申请日：2009-04-30

申请人： Sung-Yong Park ,  Tae-Je Cho ,  Tae-Hun Kim ,  Jong-Kook Kim ,  Byeong-Yeon Cho

发明人： Sung-Yong Park ,  Tae-Je Cho ,  Tae-Hun Kim ,  Jong-Kook Kim ,  Byeong-Yeon Cho

IPC分类号： H01L23/58 ,  H05K1/16

CPC分类号： H01L25/0657 ,  G01R31/31723 ,  G01R31/31813 ,  H01L22/32 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/49 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2224/45099 ,  H01L2924/00012

摘要： An interposer chip may include an insulating substrate, conductive patterns, and a test pattern. The conductive patterns may be formed on the insulating substrate. Further, the conductive patterns may be electrically connected to conductive wires. The test pattern may be connected to the conductive patterns. A test current for testing an electrical connection between the conductive patterns and the conductive wires may flow through the test pattern. Thus, the interposer chip may have the test pattern connected to the conductive patterns, so that the test current may flow to the test pattern through the conductive wires and the conductive patterns. As a result, an electrical connection between the conductive wires and the conductive patterns may be identified based on the test current supplied to the test pattern.

摘要翻译： 插入器芯片可以包括绝缘基板，导电图案和测试图案。 导电图案可以形成在绝缘基板上。 此外，导电图案可以电连接到导电线。 测试图案可以连接到导电图案。 用于测试导电图案和导线之间的电连接的测试电流可以流过测试图案。 因此，插入器芯片可以具有连接到导电图案的测试图案，使得测试电流可以通过导线和导电图案流到测试图案。 结果，可以基于提供给测试图案的测试电流来识别导线和导电图案之间的电连接。

公开(公告)号：US20090094562A1

公开(公告)日：2009-04-09

申请号：US12245692

申请日：2008-10-03

申请人： Kye-Sook Jeong ,  Byung-Nam Roh ,  Min-Tak Lim ,  Kyung-Lack Kim ,  Tae-Hun Kim

发明人： Kye-Sook Jeong ,  Byung-Nam Roh ,  Min-Tak Lim ,  Kyung-Lack Kim ,  Tae-Hun Kim

IPC分类号： G06F3/033

CPC分类号： G06F3/04883 ,  G06F3/0486 ,  H04M1/72544 ,  H04M1/72583 ,  H04M2250/22

摘要： A mobile terminal comprising a display module to display a tag and to display a menu screen image related to the tag at one portion of a background image as the tag is dragged, the menu screen image being displayed according to a dragging direction and a dragging distance; an input unit to detect a touch input with respect to the display module or the tag to determine the dragging direction and the dragging distance; and a controller to expose or hide the menu screen image according to the dragging direction the dragging distance of the inputted touch.

摘要翻译： 一种移动终端，包括显示模块，用于显示标签，并且在拖放所述标签时，在背景图像的一部分显示与所述标签相关的菜单屏幕图像，所述菜单屏幕图像根据拖动方向和拖动距离进行显示 ; 输入单元，用于检测相对于所述显示模块或所述标签的触摸输入，以确定所述拖动方向和所述拖动距离; 以及控制器，根据拖动方向来显示或隐藏菜单屏幕图像，该输入触摸的拖动距离。

公开(公告)号：US20090067143A1

公开(公告)日：2009-03-12

申请号：US12206355

申请日：2008-09-08

申请人： Jung-Do Lee ,  Hak-Kyoon Byun ,  Tae-Hun Kim ,  Sang-Uk Han ,  Seon-Hyang You

发明人： Jung-Do Lee ,  Hak-Kyoon Byun ,  Tae-Hun Kim ,  Sang-Uk Han ,  Seon-Hyang You

IPC分类号： H05K1/18 ,  H05K13/00

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/181 ,  Y10T29/49169 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device includes a lower electronic part including a lower substrate, a lower chip structure disposed on the lower substrate, and a lower molding layer covering the lower chip structure and having a recessed region in an upper surface of the lower molding layer, and an upper electronic part including an upper substrate disposed on the lower electronic part, and an upper chip structure projecting from the upper substrate, wherein the recessed region of the lower molding layer receives the upper chip structure.

摘要翻译： 电子设备包括下电子部件，其包括下基板，设置在下基板上的下芯片结构，以及覆盖下芯片结构的下成型层，并且在下成型层的上表面具有凹部， 上部电子部件，其包括设置在下部电子部件上的上部基板和从上部基板突出的上部芯片结构，其中下部成型层的凹部区域接收上部芯片结构。

公开(公告)号：US20090057845A1

公开(公告)日：2009-03-05

申请号：US12204029

申请日：2008-09-04

申请人： Ji-Sun Hong ,  Seung-Kon Mok ,  Tae-Hun Kim

发明人： Ji-Sun Hong ,  Seung-Kon Mok ,  Tae-Hun Kim

IPC分类号： H01L23/48 ,  H01L21/304 ,  B26D7/08

CPC分类号： H01L21/02076 ,  H01L23/544 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/5446 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10T83/242 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An apparatus to saw a wafer and having a nozzle to remove burrs in scribe lanes, a method of sawing a wafer, and a semiconductor package fabricated by the same. The apparatus includes a blade to cut scribe lanes of the wafer and a burr removing nozzle disposed spaced apart from the blade. The burr removing nozzle removes metal burrs generated adjacent to the blade during cutting the wafer.

摘要翻译： 观察晶片并具有喷嘴以除去划线中的毛刺的装置，锯切晶片的方法以及由其制造的半导体封装。 该设备包括用于切割晶片的划线的刀片和与刀片间隔开设置的毛刺去除喷嘴。 毛刺去除喷嘴在切割晶片期间去除与刀片相邻产生的金属毛刺。

公开(公告)号：US20080311705A1

公开(公告)日：2008-12-18

申请号：US12222854

申请日：2008-08-18

申请人： Tae-Hun Kim

发明人： Tae-Hun Kim

IPC分类号： H01L21/00

CPC分类号： H01L23/49541 ,  H01L21/4821 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10S438/94 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame and a method of fabricating a semiconductor package including the lead frame, where the lead frame includes a die pad, a tie bar supporting the die pad, and a plurality of leads. The leads may include inner and outer leads arranged along an outer periphery of the die pad, with each of the inner and outer leads having tip terminals. The lead frame may include a connecting bar connected to tip terminals of each of the inner leads. In the method, a bonding pad of a semiconductor chip is mounted on the die pad and connected via a conductive wire to the inner leads of the lead frame. The semiconductor chip, wire and inner leads may be subjected to a molding process, and the connecting bar which connects the tip terminals of the inner leads may be cut so as to independently separate each of the inner leads from the die pad.

摘要翻译： 引线框架和制造包括引线框架的半导体封装的方法，其中引线框架包括管芯焊盘，支撑管芯焊盘的连接杆和多个引线。 引线可以包括沿着芯片焊盘的外周布置的内引线和外引线，其中每个内引线和外引线都具有尖端。 引线框可以包括连接到每个内引线的尖端的连接杆。 在该方法中，半导体芯片的焊盘安装在芯片焊盘上，并通过导线连接到引线框架的内引线。 可以对半导体芯片，线和内引线进行模制处理，并且可以切割连接内引线的末端的连接杆，以便将每个内引线与管芯焊盘独立地分开。

公开(公告)号：US20070114677A1

公开(公告)日：2007-05-24

申请号：US11434143

申请日：2006-05-16

申请人： Heung-Kyu Kwon ,  Tae-Hun Kim ,  Sung-Yong Park

发明人： Heung-Kyu Kwon ,  Tae-Hun Kim ,  Sung-Yong Park

IPC分类号： H01L23/28

CPC分类号： H01L23/49816 ,  H01L21/4871 ,  H01L23/3128 ,  H01L23/36 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package may include a heat sink. The heat sink may be disposed above and spaced apart from a substrate, which may support a semiconductor chip. The heat sink may have a hole. A liquid molding compound may be provided through the hole of the heat sink to form an encapsulant. The encapsulant may seal the semiconductor chip, leaving an upper portion of the heat sink exposed. A tape supporting the heat sink may be provided on the substrate. The tape may be removed after the encapsulant is provided.

摘要翻译： 半导体封装可以包括散热器。 散热器可以布置在可以支撑半导体芯片的衬底的上方并与之隔开。 散热器可能有一个孔。 可以通过散热器的孔提供液体模塑料以形成密封剂。 密封剂可以密封半导体芯片，留下散热器的上部。 可以在基板上设置支撑散热器的带。 在提供密封剂之后可以去除胶带。

公开(公告)号：US07181253B2

公开(公告)日：2007-02-20

申请号：US10272124

申请日：2002-10-16

申请人： Tae-Hun Kim

发明人： Tae-Hun Kim

IPC分类号： H04M1/00

CPC分类号： H04M1/0247 ,  H04M1/0214

摘要： A dual-wing folder radio telephone is provided. The dual-wing folder radio telephone includes a lower housing, a middle housing, and an upper housing that are connected to a hinge axis. The lower housing has hinge arms formed in one end thereof. Further, the lower housing has a battery mounted on the lower surface and a microphone mounted on the upper surface. The middle housing has hinge arms formed in one end thereof. Further, the middle housing includes a keypad, in which a plurality of keys are arranged, installed on the upper surface, and a main printed circuit board installed therein. The upper housing includes a hinge arm formed in one end, and an LCD and a speaker mounted thereon.

摘要翻译： 提供双翼文件夹无线电话。 双翼文件夹无线电话包括连接到铰链轴的下壳体，中间壳体和上壳体。 下壳体在其一端形成铰链臂。 此外，下壳体具有安装在下表面上的电池和安装在上表面上的麦克风。 中间壳体在其一端形成铰链臂。 此外，中间壳体包括安装在上表面上的多个键布置的键盘和安装在其中的主印刷电路板。 上壳体包括形成在一端的铰链臂，以及安装在其上的LCD和扬声器。

公开(公告)号：US06838754B2

公开(公告)日：2005-01-04

申请号：US10621581

申请日：2003-07-18

申请人： Tae-Hun Kim

发明人： Tae-Hun Kim

IPC分类号： H01L25/18 ,  H01L23/12 ,  H01L23/495 ,  H01L25/065 ,  H01L25/07 ,  H01L23/48

CPC分类号： H01L24/32 ,  H01L23/49503 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/484 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A multi-chip package (MCP) that incorporates a leadframe pad arranged and configured to allow the active surface of a first chip to be mounted on a lower surface of the leadframe pad and a second chip to be mounted on an upper surface of the leadframe pad whereby the first and second chips may be mounted and wire bonded to inner leads without inverting the leadframe, thereby reducing the likelihood of damage during manufacturing and allowing for a reduction in package thickness. The first and second chips, as well as the bonding wires that connect the chips to inner leads of the leadframe may be sealed in a package body. Outer leads extending from the package body and integrally formed with the inner leads may be formed to provide finished packages having a variety of mounting configurations for attachment to circuit boards or other applications.

摘要翻译： 一种多芯片封装（MCP），其包括引线框垫，其被布置和配置为允许第一芯片的有源表面安装在引线框焊盘的下表面上，第二芯片被安装在引线框架的上表面上 衬垫，由此第一和第二芯片可以被安装并且线接合到内引线而不颠倒引线框架，从而减少在制造期间损坏的可能性并允许减小封装厚度。 第一和第二芯片以及将芯片连接到引线框架的内引线的接合线可以被密封在封装主体中。 可以形成从封装主体延伸并与内部引线一体形成的外部导线，以提供具有用于附接到电路板或其他应用的各种安装配置的成品封装。