公开(公告)号：US20080302970A1

公开(公告)日：2008-12-11

申请号：US12038596

申请日：2008-02-27

申请人： Shinetsu Fujieda ,  Hiroko Watando ,  Akinori Honguu

发明人： Shinetsu Fujieda ,  Hiroko Watando ,  Akinori Honguu

IPC分类号： G01T1/20

CPC分类号： G01T1/2018 ,  H01L27/14663

摘要： A radiation ray detector includes an electrode substrate includes a transparent substrate, a plurality of thin film transistors and a plurality of collecting capacitors formed on the transparent substrate, respectively, an insulation layer formed on the transparent substrate including these thin film transistors and collecting capacitors, and a plurality of photoelectric conversion elements connected to respective thin film transistors and converting visible light into an electrical signal. A scintillator layer is formed on the electrode substrate. A protective layer comprises a reflective layer formed on the scintillator layer and containing a thermoplastic polymer compound and a titanium oxide powder contained therein in an amount of 70 wt % or more, an adhesive layer formed on the surface of the electrode substrate including the reflective layer, and a moisture-proof layer adhered to the adhesive layer and having a moisture transmittance of 0.5 g/m2/day or less at 40° C. and 90% RH.

摘要翻译： 辐射线检测器包括：电极基板，分别包括透明基板，多个薄膜晶体管和多个集电电容器，分别形成在透明基板上;绝缘层，形成在包括这些薄膜晶体管和收集电容器的透明基板上; 以及连接到各个薄膜晶体管并将可见光转换成电信号的多个光电转换元件。 在电极基板上形成闪烁体层。 保护层包括在闪烁体层上形成的反射层，其含有70重量％以上的含有热塑性聚合物化合物和氧化钛粉末，形成在包含反射层的电极基板的表面上的粘接层 ，并且在40℃和90％RH下粘合到粘合剂层上并具有0.5g / m 2 /天或更少的透湿度的防潮层。

公开(公告)号：US07026379B2

公开(公告)日：2006-04-11

申请号：US10233521

申请日：2002-09-04

申请人： Yumiko Oyasato ,  Shinetsu Fujieda ,  Kazutaka Matsumoto

发明人： Yumiko Oyasato ,  Shinetsu Fujieda ,  Kazutaka Matsumoto

IPC分类号： C08L5/04 ,  C08L5/06

CPC分类号： C08G63/664 ,  C08G63/668 ,  C08G81/00 ,  Y10S428/91 ,  Y10S428/922 ,  Y10T428/259 ,  Y10T428/265 ,  Y10T428/31786

摘要： A copolymer resin composition provided by the process of the present invention is of considerable strength and moldability and is produced by polymerization of a monosaccharide or a polysaccharide that is derived from natural objects and has a hydroxyl group, and a carboxyl group or a salt thereof with a compound having a hydroxyl group and a carboxyl group. The monosaccharide or the polysaccharide serves as a polyfunctional central compound. The copolymer resin composition is obtained through dehydration-polycondensation of (A) at least one selected from the group consisting of a monosaccharide and a polysaccharide having a hydroxyl group, and a carboxyl group or an ion-exchanged carboxyl group; and (B) at least one selected from the group consisting of (b1) hydroxycarboxylic acid, (b2) polyhydroxycarboxylic acid, (b3) a mixture of an aliphatic polyol and an aliphatic polybasic acid, and (b4) an aliphatic polyester obtained by the reaction of an aliphatic polyol with an aliphatic polybasic acid. Preferably, alginic acid is used to serve as the monosaccharide or the polysaccharide having a hydroxyl group and a carboxyl group.

公开(公告)号：US5641997A

公开(公告)日：1997-06-24

申请号：US305478

申请日：1994-09-13

申请人： Hideo Ohta ,  Tetsuo Okuyama ,  Shinetsu Fujieda ,  Sadao Kajiura ,  Akira Yoshizumi

发明人： Hideo Ohta ,  Tetsuo Okuyama ,  Shinetsu Fujieda ,  Sadao Kajiura ,  Akira Yoshizumi

IPC分类号： C08L63/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/433

CPC分类号： C08L63/00 ,  H01L21/56 ,  H01L23/293 ,  H01L23/295 ,  H01L23/4334 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/1815

摘要： A semiconductor chip is positioned between encapsulating sheets. The encapsulating sheets each have a surface that is highly adhesive and a surface that is less adhesive. The surface of the encapsulating sheet that is highly adhesive contacts the chip. The surface that is less adhesive contacts a mold. Subsequently, encapsulation is carried out by molding. A soldering resistance can be improved without reducing a mold releasing property.

摘要翻译： 半导体芯片位于封装片之间。 封装片各自具有高粘合性的表面和较少粘合剂的表面。 高度粘合的封装片的表面接触芯片。 粘合剂较少的表面与模具接触。 随后，通过模塑进行包封。 可以在不降低脱模性的情况下改善耐焊接性。

公开(公告)号：US5346743A

公开(公告)日：1994-09-13

申请号：US28696

申请日：1993-03-08

申请人： Ken Uchida ,  Michiya Higashi ,  Shinetsu Fujieda

发明人： Ken Uchida ,  Michiya Higashi ,  Shinetsu Fujieda

IPC分类号： C08G59/32 ,  C08G59/68 ,  C08L63/00 ,  H01B3/40 ,  H01L23/29

CPC分类号： H01L23/293 ,  C08G59/3218 ,  C08G59/686 ,  C08L63/00 ,  H01B3/40 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/1433 ,  H01L2924/181 ,  Y10T428/239

摘要： According to a first embodiment of the present invention, there is provided a resin encapsulation type semiconductor device, comprising a semiconductor element and an epoxy resin composition used as an encapsulating resin, the composition containing as essential components:(a) an epoxy resin represented by formula (I) given below: ##STR1## where R.sup.1, R.sup.2, R.sup.3, and R.sup.4 are hydrogen or an alkyl group respectively, and n.gtoreq.0,(b) a phenolic resin curing agent,(c) an imidazole compound, and(d) triphenyl phosphate.In the first embodiment of the present invention, a heat resistance skeletal structure is formed by the epoxy resin (a) and the phenolic resin curing agent (b) in the epoxy resin composition after cured, leading to an improved resistance to heat and to an improved package crack resistance. Further, the combination of the imidazole compound (c) used as a curing catalyst and triphenyl phosphate (d) permits ensuring a high reliability in terms of the humidity resistance and also permits improving the resistance to the external contamination.

摘要翻译： 根据本发明的第一实施例，提供一种树脂封装型半导体器件，其包含半导体元件和用作封装树脂的环氧树脂组合物，该组合物含有作为必要成分的组合物：（a）由 式（I）：其中R1，R2，R3和R4分别是氢或烷基，n≥0，（b）酚醛树脂固化剂，（c） 咪唑化合物和（d）磷酸三苯酯。 在本发明的第一实施方案中，环氧树脂组合物中的环氧树脂（a）和酚醛树脂固化剂（b）在固化后形成耐热骨架结构，导致耐热性提高 提高包装抗裂性。 此外，用作固化催化剂的咪唑化合物（c）和磷酸三苯酯（d）的组合可以确保在耐湿性方面的高可靠性，并且还可以改善对外部污染的抵抗力。

公开(公告)号：US5216077A

公开(公告)日：1993-06-01

申请号：US874226

申请日：1992-04-27

申请人： Akira Yoshizumi ,  Shinetsu Fujieda ,  Ken Uchida ,  Naoko Kihara ,  Kazuhiro Sawai ,  Tsutomu Nagata ,  Shinji Murakami ,  Shigeyuki Kouchiyama

发明人： Akira Yoshizumi ,  Shinetsu Fujieda ,  Ken Uchida ,  Naoko Kihara ,  Kazuhiro Sawai ,  Tsutomu Nagata ,  Shinji Murakami ,  Shigeyuki Kouchiyama

IPC分类号： C08L61/06 ,  C08L63/00 ,  H01B3/40

CPC分类号： H01B3/40 ,  C08L61/06 ,  C08L63/00

摘要： A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.

摘要翻译： 橡胶改性酚醛树脂组合物含有酚醛清漆型酚醛树脂，其中至少一种选自ABS树脂和MBS树脂的改性剂均匀分散。 该组合物具有良好的抗冲击性和耐热冲击性。 通过将上述至少一种改性剂加入到其软化点或更高温度下被加热和熔化的酚醛清漆型酚醛树脂来制备组合物，使得改性剂均匀分散在树脂中。 树脂组合物适合用作环氧树脂密封剂用于密封电子器件的固化剂。

公开(公告)号：US5043211A

公开(公告)日：1991-08-27

申请号：US175225

申请日：1988-03-30

申请人： Akira Yoshizumi ,  Kazutaka Matsumoto ,  Shinetsu Fujieda ,  Ken Uchida

发明人： Akira Yoshizumi ,  Kazutaka Matsumoto ,  Shinetsu Fujieda ,  Ken Uchida

IPC分类号： C08G59/00 ,  C08G59/18 ,  C08G59/40 ,  C08G59/62 ,  C08K9/06 ,  C08K9/08 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L23/296 ,  C08K9/08 ,  C08L63/00 ,  H01L23/295 ,  H01L2924/0002 ,  Y10T428/239 ,  Y10T428/259 ,  Y10T428/31511

摘要： An epoxy resin composition useful for sealing a semiconductor device includes 100 parts by weight of epoxy resin, 30-75 parts by weight of phenolic resin, 320-570 parts by weight of silica powder, and 2-30 parts by weight of styrene-butadiene-methyl methacrylate copolymer. The surface of the silica powder is treated, at room temperature, by 0.05-1.00% by weight of silane coupling agent, 0.05-1.00% by weight of a silicone base surface active agent, and 0.15-3.00% by weight of thermosetting silicone rubber.

公开(公告)号：US20120234764A1

公开(公告)日：2012-09-20

申请号：US13411787

申请日：2012-03-05

申请人： Toshihiro IMADA ,  Hideyuki Tsuji ,  Arisa Yamada ,  Shinetsu Fujieda ,  Tatsuoki Kohno

发明人： Toshihiro IMADA ,  Hideyuki Tsuji ,  Arisa Yamada ,  Shinetsu Fujieda ,  Tatsuoki Kohno

IPC分类号： C02F1/42 ,  B01D15/04 ,  C02F1/66

CPC分类号： C02F1/048 ,  B01J20/06 ,  B01J20/08 ,  B01J41/02 ,  B01J41/04 ,  B01J47/026 ,  C02F1/04 ,  C02F1/288 ,  C02F1/42 ,  C02F1/44 ,  C02F1/4693 ,  C02F1/66 ,  C02F2101/108 ,  C02F2209/06

摘要： There is provided an efficient treatment method for boron-containing water capable of reducing an amount of use of medical agent and an amount of generation of sludge. A treatment method for boron-containing water of an embodiment includes a first process of concentrating boron-containing water to obtain boron-concentrated liquid. Further, the method includes a second process of making the boron-concentrated liquid to be brought into contact with a layered inorganic hydroxide, and making the layered inorganic hydroxide adsorb boron in the boron-concentrated liquid to remove boron.

摘要翻译： 提供了能够减少药剂的使用量和产生污泥量的含硼水的有效处理方法。 一个实施方案的含硼水的处理方法包括将含硼水浓缩以获得硼浓缩液体的第一方法。 此外，该方法包括使硼浓缩液与层状无机氢氧化物接触的第二工序，使层状无机氢氧化物在硼浓缩液中吸附硼以除去硼。

公开(公告)号：US08258076B2

公开(公告)日：2012-09-04

申请号：US12184278

申请日：2008-08-01

申请人： Akiko Suzuki ,  Tatsuoki Kohno ,  Shinetsu Fujieda ,  Toshihide Takahashi ,  Katsuya Yamamoto ,  Mari Iwashita ,  Nobuyuki Ashikaga ,  Hidetake Shiire ,  Satoshi Haraguchi ,  Tokusuke Hayami

发明人： Akiko Suzuki ,  Tatsuoki Kohno ,  Shinetsu Fujieda ,  Toshihide Takahashi ,  Katsuya Yamamoto ,  Mari Iwashita ,  Nobuyuki Ashikaga ,  Hidetake Shiire ,  Satoshi Haraguchi ,  Tokusuke Hayami

IPC分类号： B01J20/22 ,  B01J20/02 ,  B01D15/00 ,  B01D9/02

CPC分类号： B01J20/3265 ,  B01D15/00 ,  B01J20/3204 ,  B01J20/3219

摘要： A phosphorus compound adsorbent; a phosphorus compound adsorption system, wherein the phosphorus compound adsorbed can be desorbed in a neutral solvent; and a method of using the phosphorus compound adsorbent are provided. The phosphorus compound adsorbent includes a nitrogen-containing compound having an amino group at an end of the molecular structure, a support carrying the nitrogen-containing compound, and at least one metal ion selected from the group consisting of a zinc ion, a copper ion, an iron ion, and a zirconium ion, which is fixed to the nitrogen-containing compound.

摘要翻译： 磷化合物吸附剂; 磷化合物吸附系统，其中吸附的磷化合物可以在中性溶剂中解吸; 并提供使用磷化合物吸附剂的方法。 磷化合物吸附剂包括在分子结构末端具有氨基的含氮化合物，承载含氮化合物的载体和至少一种选自锌离子，铜离子的金属离子 ，铁离子和锆离子，其固定在含氮化合物上。

公开(公告)号：US20100116997A1

公开(公告)日：2010-05-13

申请号：US12692902

申请日：2010-01-25

申请人： Katsuhisa Homma ,  Shinetsu Fujieda

发明人： Katsuhisa Homma ,  Shinetsu Fujieda

IPC分类号： G01T1/20 ,  H01L31/0232

CPC分类号： H01L27/1446 ,  G01T1/2002 ,  H01L27/14625 ,  H01L27/14663

摘要： A radiation detector characterized by includes a photoelectric conversion element, a scintillation layer which converts radioactive rays to fluorescence, the scintillation layer being formed on the photoelectric conversion element, and a reflective film formed on the scintillation layer, the reflective film containing light-scattering particles for reflecting the fluorescence from the scintillation layer and a binder material binding the light-scattering particles, and having depletion portions without being filled with the binder material, the depletion portions being formed in a periphery of the light-scattering particles.

摘要翻译： 一种辐射探测器，其特征在于包括光电转换元件，将放射线转换为荧光的闪烁层，形成在光电转换元件上的闪烁层和形成在闪烁层上的反射膜，反射膜含有光散射粒子 用于反射来自闪烁层的荧光和粘合光散射颗粒的粘合剂材料，并且在不填充粘合剂材料的情况下具有耗尽部分，所述耗尽部分形成在光散射颗粒的周围。

公开(公告)号：US20090176323A1

公开(公告)日：2009-07-09

申请号：US12343191

申请日：2008-12-23

申请人： Akiko Suzuki ,  Shinetsu Fujieda ,  Tatsuoki Kono ,  Toshihide Takahashi ,  Kazuaki Ootsuka ,  Hiroaki Oshio ,  Hideo Tamura

发明人： Akiko Suzuki ,  Shinetsu Fujieda ,  Tatsuoki Kono ,  Toshihide Takahashi ,  Kazuaki Ootsuka ,  Hiroaki Oshio ,  Hideo Tamura

IPC分类号： H01L21/56

CPC分类号： C08L83/04 ,  H01L33/52 ,  H01L33/56 ,  H01L2224/32245 ,  H01L2924/181 ,  H01L2924/00012

摘要： A process for producing a light-emitting semiconductor device includes: (i) mixing at least one low-molecular silane or at least one silanol with an alcohol solution containing an alkoxysiloxane to prepare a mixture solution, the amount of the silane or silanol being from 10% by weight to 50% by weight based on the dry weight of an encapsulating material to be formed; (ii) applying the mixture solution to a light-emitting element; (iii) vaporizing the alcohol solvent in the mixture solution applied and drying the residual mixture to thereby form the encapsulating material; and (iv) curing the encapsulating material.

摘要翻译： 制造发光半导体装置的方法包括：（i）将至少一种低分子硅烷或至少一种硅烷醇与含有烷氧基硅氧烷的醇溶液混合以制备混合溶液，硅烷或硅烷醇的量来自 10重量％至50重量％，基于要形成的封装材料的干重; （ii）将混合溶液施加到发光元件上; （iii）蒸发所施加的混合溶液中的醇溶剂并干燥残余混合物从而形成包封材料; 和（iv）固化封装材料。