摘要:
Electronic devices may provide microphone bias voltages to accessories. The accessories may include circuitry powered from the microphone bias voltages. The output impedances and the voltages of the microphone bias voltages may be adjusted during operation of the electronic devices. An electronic device may provide a bias voltage to an accessory, may lower the output impedance of the bias voltage, and may increase the voltage of the bias voltage during operation of the electronic device. Accessories that received bias voltages with lowered impedances or raised voltage levels may exhibit greater tolerance to faults such as moisture-based shorts and may be able to continue operating even in the presence of some faults.
摘要:
Electronic devices and accessories such as headsets for electronic devices are provided. A microphone may be included in an accessory to capture sound for an associated electronic device. Buttons and other user interfaces may be included in the accessories. An accessory may have an audio plug that connects to a mating audio jack in an electronic device, thereby establishing a wired communications link between the accessory and the electronic device. The electronic device may include power supply circuitry for applying bias voltages to the accessory. The bias voltages may bias a microphone and may adjust settings in the accessory such as settings related to operating modes. User input information may be conveyed between the accessory and the electronic device using ultrasonic tone transmission. The electronic device may also gather input from the accessory using a voltage detector coupled to lines in the communications path.
摘要:
An audio communications host device has a communications network interface, digitizing circuitry, and a headphone jack. A demultiplexer has an input coupled to receive a signal from a pin of the headphone jack, and multiple outputs coupled to inputs of the digitizing circuitry, respectively. An uplink audio processor receives digitized microphone signals from multiple outputs of the digitizing circuitry, and in response delivers an uplink signal to the communications network interface. The uplink signal contains audio from one or more of the digitized microphone signals. Other embodiments are also described and claimed.
摘要:
Electronic devices and accessories are provided that may communicate over wired communications paths. The electronic devices may be portable electronic devices such as cellular telephones or media players and may have audio connectors such as 3.5 mm audio jacks. The accessories may be headsets or other equipment having mating 3.5 mm audio plugs and speakers for playing audio. Microphones may be included in an accessory to gather voice signals and noise cancellation signals. Analog-to-digital converter circuitry in the accessory may digitize the microphone signals. Digital voice signals and voice noise cancellation signals can be transmitted over the communications path and processed by audio digital signal processor circuitry in an electronic device. Digital-to-analog converter circuitry in the accessory may convert digital audio signals to analog speaker signals. Digital noise cancellation signals may use digital noise signals to cancel noise from digital audio signals that have been received from an electronic device.
摘要:
A modulator includes a power driver, a power amplifier, and a heterojunction bipolar transistor (HBT) type device. The power driver is for receiving an amplitude modulation signal and for providing a control signal. The power amplifier is for receiving a phase modulation signal, a bias voltage, and the control signal. The power amplifier is for providing a radio frequency signal as an output based on the phase modulation signal, the bias voltage, and the control signal. The switching device is for coupling the power driver to the power amplifier such that the control signal is provided to the power amplifier in a timely manner.
摘要:
Solar power tracking techniques are described herein. In one aspect of the invention, a solar power tracking apparatus includes, but is not limited to, a voltage converter and a controller coupled to the voltage converter. The voltage converter includes an input capable of being coupled to a solar power source and an output capable of being coupled to an electronic load, such as, for example, a portable electronic device. The voltage converter is configured to monitor or detect an amount of power drawn by the electronic load at the output of the voltage converter. In response to the monitored power drawn, the controller is configured to control the voltage converter to reduce amount of power to be drawn subsequently if the monitored amount of power exceeds a predetermined threshold. As a result, the output voltage from the solar power source is maintained within a predetermined range. Other methods and apparatuses are also described.
摘要:
Electronic devices and accessories such as headsets for electronic devices are provided. A microphone may be included in an accessory to capture sound for an associated electronic device. Buttons and other user interfaces may be included in the accessories. An accessory may have an audio plug that connects to a mating audio jack in an electronic device, thereby establishing a wired communications link between the accessory and the electronic device. The electronic device may include power supply circuitry for applying bias voltages to the accessory. The bias voltages may bias a microphone and may adjust settings in the accessory such as settings related to operating modes. User input information may be conveyed between the accessory and the electronic device using ultrasonic tone transmission. The electronic device may also gather input from the accessory using a voltage detector coupled to lines in the communications path.
摘要:
Portable devices having multiple power interfaces are described herein. According to one embodiment of the invention, a portable electronic device includes, but is not limited to, a processor, a memory coupled to the processor for storing instructions, when executed from the memory, cause the processor to perform one or more functions, a battery coupled to provide power to the processor and the memory, and a battery charging manager coupled to charge the battery using power derived from a plurality of power sources including a solar power source. Other methods and apparatuses are also described.
摘要:
The present invention discloses a bus pumping compensation for a pulse modulation circuit such as class D modulators. The compensation according to the present invention provides a compensation current controlled by the output voltage, with the compensation characteristics matching the reverse current for improving circuit efficiency. Embodiments of the present invention also disclose a designable compensation circuit, comprising a linear compensation current, offering a good trade-off between circuit efficiency and ease of design. The present invention compensation circuit is preferably employed in a class D amplifier with substantial reverse current, and most preferably added into a LDO power supply in a class D amplifier circuit to prevent reverse current problem. The disclosed class D amplifier circuit is preferably used in an audio media player.
摘要:
A packaging technique for electronic devices includes wafer fabrication of contacts on the bottom surface of the substrate underneath the active circuit. Inherently reliable contacts suitable for a variety of devices can be formed, via a simple fabrication process, with good wafer packing density. In one embodiment, a trench is formed in the top surface of a substrate parallel to the edge of its electronic circuit. A gold wire extends from a connection point within the circuit into the trench. The gold wire may run over an insulating layer that ends part way through the trench. After epoxy encapsulating the top of the substrate, it is back thinned to expose the bottom surface of the gold wire. Either the back thinning is selective so as to form a substrate standoff, or an epoxy standoff is applied to the bottom of the substrate. A solderable wire runs onto the standoff from the gold wire exposed on the protrusion, possibly over another insulation layer. If an insulative substrate is used, the insulation layers may be optional. Sawing separates the electronic devices and completes their fabrication, without a subsequent assembly step. In another embodiment, the trench in which the gold wires and the solderable wires connect is formed from the bottom of the substrate after it has been epoxy encapsulated. Optionally, the bottom surface of the substrate of the finished device drops down to be co-planar with the contact bottom surfaces, so as to conduct heat out of the device.