公开(公告)号：US20070103866A1

公开(公告)日：2007-05-10

申请号：US11505825

申请日：2006-08-18

申请人： Sang Park

发明人： Sang Park

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： H05K7/20972 ,  Y10S345/905

摘要： There is provided a cooling apparatus for a flat display device. The cooling apparatus includes a flat display module, a cover for protecting an exterior of the flat display module, an air inlet formed on one side of the cover, for introducing external air, an air outlet formed in the other side of the cover, for discharging high temperature air contained inside the cover, and a shield for selectively closing the air outlet to prevent inflow of foreign substances.

摘要翻译： 提供了一种用于平板显示装置的冷却装置。 该冷却装置包括平板显示模块，用于保护平板显示模块的外部的盖，形成在盖的一侧上用于引入外部空气的空气入口，形成在盖的另一侧的空气出口，用于 排出容纳在盖内的高温空气，以及用于选择性地关闭空气出口以防止异物流入的屏蔽。

公开(公告)号：US20070093004A1

公开(公告)日：2007-04-26

申请号：US11488895

申请日：2006-07-19

申请人： Sang Park ,  Chi Hwang ,  Hye Chu ,  Jeong Lee ,  Jin Lee ,  Ho Kwack ,  Yong Lee ,  Seung Kang

发明人： Sang Park ,  Chi Hwang ,  Hye Chu ,  Jeong Lee ,  Jin Lee ,  Ho Kwack ,  Yong Lee ,  Seung Kang

IPC分类号： H01L21/84

CPC分类号： H01L29/7869

摘要： Provided is a method of manufacturing a thin film transistor (TFT) including a transparent ZnO thin layer that is formed at a low temperature by causing a surface chemical reaction between precursors containing elements constituting the ZnO thin layer. The method includes the steps of: depositing a gate metal layer on a substrate and forming a gate electrode using photolithography and selective etching processes; depositing a gate insulator on the substrate having the gate electrode; forming source and drain electrodes; and depositing a ZnO thin layer on the gate insulator using a surface chemical reaction between precursors containing elements constituting the ZnO thin layer.

摘要翻译： 提供一种制造薄膜晶体管（TFT）的方法，该薄膜晶体管（TFT）包括通过在构成ZnO薄层的元件的前体之间引起表面化学反应而在低温下形成的透明ZnO薄层。 该方法包括以下步骤：在衬底上沉积栅极金属层并使用光刻和选择性蚀刻工艺形成栅电极; 在具有栅电极的衬底上沉积栅极绝缘体; 形成源极和漏极; 以及使用包含构成ZnO薄层的元素的前体之间的表面化学反应在栅极绝缘体上沉积ZnO薄层。

公开(公告)号：US20070091947A1

公开(公告)日：2007-04-26

申请号：US11370877

申请日：2006-03-09

申请人： Sang Park ,  Kwan Kim ,  Suk Kim

发明人： Sang Park ,  Kwan Kim ,  Suk Kim

IPC分类号： H01S3/00

CPC分类号： H01S5/042

摘要： A laser diode drive circuit drives a high-power laser diode using a single voltage source and a transistor. The laser diode drive circuit includes: a voltage-level shifter shifting an output voltage of an analog signal processor to a predetermined-level voltage; a voltage adder for adding a predetermined voltage according to a record or reproduction mode of an optical disc to the level-shifted voltage; and an amplifier for amplifying a current signal of a power-supply unit in response to the added voltage and outputting the amplified current signal to a laser diode.

摘要翻译： 激光二极管驱动电路使用单个电压源和晶体管驱动大功率激光二极管。 激光二极管驱动电路包括：电压电平移位器，将模拟信号处理器的输出电压移动到预定电平电压; 电压加法器，用于将根据光盘的记录或再现模式的预定电压加到电平移位电压; 以及放大器，用于响应于所添加的电压放大电源单元的电流信号，并将放大的电流信号输出到激光二极管。

公开(公告)号：US20070068450A1

公开(公告)日：2007-03-29

申请号：US11362035

申请日：2006-02-27

申请人： Won Jung ,  Jean Roncali ,  Sang Park ,  Antonio Cravino ,  Philippe Leriche ,  Pierre Frere ,  Sophie Roquet

发明人： Won Jung ,  Jean Roncali ,  Sang Park ,  Antonio Cravino ,  Philippe Leriche ,  Pierre Frere ,  Sophie Roquet

IPC分类号： H01L21/322 ,  C30B25/00 ,  C30B15/14 ,  C30B23/00 ,  C30B28/12 ,  C30B28/14

CPC分类号： H01L51/0061 ,  C07D333/58 ,  C09B23/105 ,  C09B57/008 ,  H01L51/5048 ,  H01L51/52 ,  Y02E10/549

摘要： Disclosed herein are a novel nitrogen semiconductor compound simultaneously including groups with different electrical properties and a device fabricated using the nitrogen semiconductor compound as an organic semiconductor material or a hole conducting material. The nitrogen semiconductor compound can be spin-coated at room temperature when applied to the fabrication of the device, and has superior electrical conductivity and photovoltaic properties.

摘要翻译： 本文公开了同时包含具有不同电特性的基团的新型氮半导体化合物和使用氮半导体化合物作为有机半导体材料或空穴传导材料制造的器件。 氮化物半导体化合物可以在室温下旋涂，适用于器件制造，具有优异的导电性和光伏特性。

公开(公告)号：US20070020483A1

公开(公告)日：2007-01-25

申请号：US11357945

申请日：2006-02-22

申请人： Sang Park ,  Myung Kim ,  Jeong Seo ,  Eun Cha ,  Jae Lee ,  Chang Sung

发明人： Sang Park ,  Myung Kim ,  Jeong Seo ,  Eun Cha ,  Jae Lee ,  Chang Sung

IPC分类号： H01L51/54 ,  H01L51/56 ,  H05B33/12

CPC分类号： H01L51/508 ,  H01L27/3211 ,  H01L51/005 ,  H01L51/0062 ,  H01L51/0081 ,  H01L51/0085 ,  H01L51/5016 ,  H01L51/5278

摘要： An organic electroluminescent (EL) device having improved efficiency and service life is provided. The organic electroluminescent device has a stack structure including an emitting layer and an electron-transport layer positioned between an anode and a cathode. The electron-transport layer includes a first layer adjacent to the emitting layer which may be a mixture of at least two materials, and a second layer adjacent to the cathode which may be a mixture of at least two materials. The mixture of at least two materials may be a mixture of an organic compound and one or more other organic compounds, or may be a mixture of a metal or inorganic compound and one or more other metal or inorganic compounds, or may be a mixture of one or more organic compounds and one or more metal or inorganic compounds.

摘要翻译： 提供了一种具有提高效率和使用寿命的有机电致发光（EL）装置。 有机电致发光器件具有包括位于阳极和阴极之间的发光层和电子传输层的堆叠结构。 电子传输层包括与发光层相邻的第一层，其可以是至少两种材料的混合物，以及与阴极相邻的第二层，其可以是至少两种材料的混合物。 至少两种材料的混合物可以是有机化合物和一种或多种其它有机化合物的混合物，或者可以是金属或无机化合物与一种或多种其它金属或无机化合物的混合物，或者可以是 一种或多种有机化合物和一种或多种金属或无机化合物。

公开(公告)号：US20070019077A1

公开(公告)日：2007-01-25

申请号：US10561607

申请日：2004-06-07

申请人： Sang Park

发明人： Sang Park

IPC分类号： H04N5/232

CPC分类号： G08B13/19695 ,  G08B13/19621 ,  G08B13/19636 ,  G08B13/1966 ,  G08B13/19667 ,  G08B13/19676 ,  G08B13/19684 ,  H04N7/181 ,  H04N7/185

摘要： A portable surveillance camera and a personal surveillance system are disclosed. More specifically, provided are a portable surveillance camera comprising a mini-camera such as a CMOS camera or a CCD camera, and a system for surveilling a predetermined place using the portable surveillance camera. The personal surveillance system receives multimedia data such as image, sound, event and control data on real time from the portable surveillance camera installed in various areas such as a house, a shop or an office with a control device connectable to a network such as a LAN or an internet, and then monitors or stores the multimedia data. Also, the personal surveillance system can search, surveille, control, edit and store multimedia data such as image, sound, event and control data for a desired period of time from data stored in the portable surveillance camera or the control device.

摘要翻译： 公开了便携式监视摄像机和个人监视系统。 更具体地，提供了包括诸如CMOS照相机或CCD照相机的微型照相机的便携式监视摄像机以及使用便携式监视摄像机监视预定位置的系统。 个人监视系统从安装在诸如房屋，商店或办公室等各种区域的便携式监视摄像机实时接收诸如图像，声音，事件和控制数据的多媒体数据，其具有可连接到诸如 LAN或互联网，然后监视或存储多媒体数据。 此外，个人监视系统可以从存储在便携式监视摄像机或控制设备中的数据搜索，监视，控制，编辑和存储多个数据，例如图像，声音，事件和控制数据达期望的时间段。

公开(公告)号：US20070002666A1

公开(公告)日：2007-01-04

申请号：US11275421

申请日：2005-12-30

申请人： Sang Park

发明人： Sang Park

IPC分类号： G11C5/14

CPC分类号： G11C29/02 ,  G11C29/025 ,  G11C29/83 ,  G11C2029/5006

摘要： A current reduction circuit of a semiconductor device is disclosed which includes an enabling signal generator which outputs a predetermined enabling signal in association with a cell block in which a bridge has been formed between a word line and a bit line, and an isolation controller which is enabled in response to the enabling signal, and outputs a control signal to periodically isolate the bridge-formed cell block from a sense amplifier array for a predetermined period in a standby mode in response to a periodic signal enabled at intervals of a predetermined time.

摘要翻译： 公开了一种半导体器件的电流减小电路，其包括使能信号发生器，其与在字线和位线之间形成桥的单元块相关联地输出预定的使能信号，以及隔离控制器， 响应于使能信号使能，并且响应于以预定时间间隔启用的周期性信号，输出控制信号，以在备用模式中将桥形成的单元块周期性地与读出放大器阵列隔离一段预定周期。

公开(公告)号：US20060250049A1

公开(公告)日：2006-11-09

申请号：US11259199

申请日：2005-10-27

申请人： Doo Park ,  Young Lee ,  Seung Lee ,  Joo Park ,  Sang Park ,  Nam Kim

发明人： Doo Park ,  Young Lee ,  Seung Lee ,  Joo Park ,  Sang Park ,  Nam Kim

IPC分类号： H01L41/053

CPC分类号： H03H9/1085 ,  H01L2224/16225 ,  H03H9/059

摘要： The present invention provides a SAW device package used in filters, duplexers, etc., in particular, which simplifies sealing process for protecting the active area of a SAW device. The SAW device package comprises a wiring substrate, as a package base having connection patterns, having bare chip attaching means. A bare chip is flip-bonded and attached to the attaching means on the wiring substrate while maintaining the airtight condition. A resin molding part covers the top of the bare chip to seal the device. The invention facilitates maintaining an airtight condition of the active area which affects the operational characteristics of the device, and simplifies the manufacturing processes. Furthermore, the improved structure of the wiring substrate blocks the external moisture permeation, thereby enabling the device to better withstand the external changes.

摘要翻译： 本发明提供了一种特别用于滤波器，双工器等中的SAW器件封装，其简化了用于保护SAW器件的有源区域的密封工艺。 SAW器件封装包括布线衬底，作为具有连接图案的封装基座，具有裸芯片附接装置。 在保持气密状态的同时，将裸芯片翻转接合并附接到布线基板上的附接装置。 树脂成型部分覆盖裸芯片的顶部以密封装置。 本发明有助于维持影响装置的操作特性的活性区域的气密状态，并且简化了制造过程。 此外，布线基板的改进的结构阻止外部水分渗透，从而使得该装置能够更好地承受外部变化。

公开(公告)号：US20060249824A1

公开(公告)日：2006-11-09

申请号：US11217465

申请日：2005-09-02

申请人： Seung Lee ,  Doo Park ,  Joo Park ,  Young Lee ,  Sang Park ,  Nam Kim

发明人： Seung Lee ,  Doo Park ,  Joo Park ,  Young Lee ,  Sang Park ,  Nam Kim

IPC分类号： H01L23/02

CPC分类号： H03H9/1085 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H03H3/08 ,  H03H9/059 ,  H03H9/1078 ,  H01L2224/81 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Disclosed herein is a stack type surface acoustic wave package. The surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips. The surface acoustic wave package can prevent deformation due to thermal impact from the outside during a packaging process, enhancing reliability of the product, minimizing the size of the product, and reducing manufacturing costs by reducing the number of components and material costs.

摘要翻译： 这里公开了一种堆叠型表面声波封装。 表面声波封装包括具有形成在其上的多个电极的第一裸芯片，具有形成在其上的多个电极和通孔的第二裸芯片，将第一裸芯片电连接到第二裸芯片的上表面的连接部分 裸芯片，使得第一裸芯片的电极面对第二裸芯片的电极;以及密封构件，设置在第一裸芯片和第二裸芯片上，以在第一和第二裸芯片之间的操作表面上形成气密空间 。 表面声波封装可以防止在包装过程中由于外界的热冲击而引起的变形，提高产品的可靠性，最小化产品尺寸，并通过减少部件数量和材料成本降低制造成本。

公开(公告)号：US20060223238A1

公开(公告)日：2006-10-05

申请号：US11416102

申请日：2006-05-03

申请人： Kwang Koh ,  Song Kim ,  Sang Park

发明人： Kwang Koh ,  Song Kim ,  Sang Park

IPC分类号： H01L21/00

CPC分类号： H01L24/48 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/40 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05639 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/40091 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

摘要： A leadless semiconductor package mainly includes a semiconductor device securely attached to an upper surface of a die pad by solder paste and a plurality of leads arranged about the periphery of the die pad. The thickness of the leads and the die pad are within a range of 10 to 20 mils. The semiconductor device is electrically coupled to one of the leads. A package body is formed over the semiconductor device and the leads in a manner that the lower surfaces of the die pad and the leads are exposed through the package body. Preferably, the first semiconductor device is electrically coupled to one of the leads by at least one heavy gauge aluminum wire. The present invention further provides a method of producing the semiconductor package described above.

摘要翻译： 无引线半导体封装主要包括通过焊膏牢固地附接到管芯焊盘的上表面的半导体器件和围绕管芯焊盘的周边布置的多个引线。 引线和芯片焊盘的厚度在10至20密耳的范围内。 半导体器件电耦合到引线之一。 在半导体器件和引线上形成封装体，使得芯片焊盘和引线的下表面通过封装主体露出。 优选地，第一半导体器件通过至少一个大规格铝线电耦合到引线之一。 本发明还提供了一种制造上述半导体封装的方法。