摘要:
A shock detection optical fiber sensor includes: a plastic fiber; a corrugated plate having a plurality of protrusions arranged in the longitudinal direction of the plastic optical fiber and formed to oppose to the plastic optical fiber; a mold plate covering the plastic optical fiber and the corrugated plate; a light emitting element connected to one end of the plastic optical fiber; and a light receiving element connected to the other end of the plastic optical fiber.
摘要:
A semiconductor integrated circuit according to one aspect of the present invention may includes a plurality of driving circuits to drive a respective plurality of word lines with either a first voltage supplied from a first power supply or a second voltage supplied from a second power supply in accordance with a control signal, and a plurality of gate transistors in each of which a gate is connected to one of the plurality of word lines, and a connection state between a storage node and a bit line is changed based on the voltage provided to the word line connected to the gate. In the semiconductor integrated circuit, a gate oxide film of each of the plurality of gate transistors is thinner than a gate oxide film of each of transistors constituting the plurality of driving circuits.
摘要:
A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.
摘要:
An upper conveyance guide is provided at an apparatus main body. A guide surface of a lower conveyance guide is provided facing a guide surface of the upper conveyance guide, and can be drawn out in the direction intersecting the sheet conveyance direction with respect to the apparatus main body. A cleaning unit is provided on the backside in the drawing-out direction of the lower conveyance guide, moves together with the lower conveyance guide when the lower conveyance guide is drawn out from the apparatus main body, and cleans the guide surface of the upper conveyance guide.
摘要:
An exhaust assembly is described for use in a plasma processing system, whereby secondary plasma is formed in the exhaust assembly between the processing space and chamber exhaust ports in order to reduce plasma leakage to a vacuum pumping system, or improve the uniformity of the processing plasma, or both. The exhaust assembly includes a powered exhaust plate in combination with a ground electrode is utilized to form the secondary plasma surrounding a peripheral edge of a substrate treated in the plasma processing system.
摘要:
In a vehicle bumper structure, an optical fiber sensor (32) is provided in a vehicle width direction on the front surface of a front-bumper reinforcement (30). A front-bumper absorber (28) is provided in front of the optical fiber sensor (32), the front-bumper absorber (28) formed of a soft absorber (54) and a hard absorber (56). The hard absorber is disposed at the bumper center region where the thickness of the bumper is increased. Accordingly, the thickness of the soft absorber (54) becomes substantially uniform in the vehicle width direction, so that a substantially uniform load is inputted to the optical fiber sensor (32) regardless of the collision position of the bumper with an object. As a result, variations in the output of the load-sensing unit are reduced.
摘要:
A semiconductor memory device includes: a memory cell array provided with a plurality of memory cells in a matrix; and a power supply circuit configured to supply an intermediate voltage between a power supply voltage and a ground voltage to each of the plurality of memory cells. The power supply circuit includes: a first intermediate voltage generating circuit configured to generate a first intermediate voltage between the power supply voltage and the ground voltage; a second intermediate voltage generating circuit configured to generate a second intermediate voltage between the power supply voltage and the ground voltage; a first output node to which the first intermediate voltage is supplied; a second output node to which the second intermediate voltage is supplied; and a connection control circuit provided between the first output node and the second output node. The first intermediate voltage generating circuit supplies the first intermediate voltage in response to a first control signal, and the second intermediate voltage generating circuit stops its operation in response to the first control signal. The connection control circuit connects the first output node and the second output node when the second intermediate voltage generating circuit stops its operation.
摘要:
A processing system and method for chemical oxide removal (COR) is presented, wherein the processing system comprises a first treatment chamber and a second treatment chamber, wherein the first and second treatment chambers are coupled to one another. The first treatment chamber comprises a chemical treatment chamber that provides a temperature controlled chamber, and an independently temperature controlled substrate holder for supporting a substrate for chemical treatment. The substrate is exposed to a gaseous chemistry, such as HF/NH3, under controlled conditions including surface temperature and gas pressure. The second treatment chamber comprises a heat treatment chamber that provides a temperature controlled chamber, thermally insulated from the chemical treatment chamber. The heat treatment chamber provides a substrate holder for controlling the temperature of the substrate to thermally process the chemically treated surfaces on the substrate.
摘要:
A first exemplary aspect of the present invention is a word line selection circuit where address decode signals composed of a power supply voltage and a first voltage lower than a ground voltage are input, and that a word line selection signal composed of the first voltage and a second voltage higher than the power supply voltage is output not via a level shift circuit according to the address decode signals.
摘要:
A colliding object determination device for a vehicle having a bumper reinforcement member (12) includes a sensor (20) and a determination circuit (40). The sensor (20) is located in a front portion of a vehicle for measuring a collision state quantity correlating with a collision load generated in a collision of a colliding body with the vehicle. The determination circuit (40) determines whether the colliding body is a pedestrian based on the measured collision state quantity. The sensor (20) is located on an upper half region of a front end face of the bumper reinforcement member (12). Thus, accuracy of discriminating the pedestrian from other objects can be improved.