公开(公告)号：US20110233585A1

公开(公告)日：2011-09-29

申请号：US12817592

申请日：2010-06-17

申请人： Akihiro Kojima ,  Yoshiaki Sugizaki ,  Hideki Shibata ,  Hideo Tamura ,  Tetsuro Komatsu ,  Masayuki Ishikawa

发明人： Akihiro Kojima ,  Yoshiaki Sugizaki ,  Hideki Shibata ,  Hideo Tamura ,  Tetsuro Komatsu ,  Masayuki Ishikawa

IPC分类号： H01L33/44 ,  H01L33/00 ,  H01L21/78 ,  H01L33/36

CPC分类号： H01L33/486 ,  H01L33/50 ,  H01L33/504 ,  H01L2224/16

摘要： According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, an insulating film, a first interconnection, a second interconnection, a first metal pillar, a second metal pillar, a resin, and a fluorescent layer. The semiconductor layer has a first major surface, a second major surface formed on an opposite side to the first major surface, and a light emitting layer. The first electrode and the second electrode are provided on the second major surface of the semiconductor layer. The fluorescent layer faces to the first major surface of the semiconductor layer and includes a plurality of kinds of fluorescent materials having different peak wavelengths of emission light.

摘要翻译： 根据一个实施例，半导体发光器件包括半导体层，第一电极，第二电极，绝缘膜，第一互连，第二互连，第一金属柱，第二金属柱，树脂和 荧光层。 半导体层具有第一主表面，与第一主表面相反的一侧形成的第二主表面和发光层。 第一电极和第二电极设置在半导体层的第二主表面上。 荧光层面向半导体层的第一主表面，并且包括发射光的不同峰值波长的多种荧光材料。

公开(公告)号：US20110186900A1

公开(公告)日：2011-08-04

申请号：US12849102

申请日：2010-08-03

申请人： Gen Watari ,  Satoshi Shimizu ,  Mami Yamamoto ,  Hidenori Egoshi ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi

发明人： Gen Watari ,  Satoshi Shimizu ,  Mami Yamamoto ,  Hidenori Egoshi ,  Hiroaki Oshio ,  Tatsuo Tonedachi ,  Kazuhisa Iwashita ,  Tetsuro Komatsu ,  Teruo Takeuchi

IPC分类号： H01L33/52 ,  H01L33/62

CPC分类号： H01L24/97 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.

摘要翻译： 根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。 第一和第二引线框彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，并且LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。 此外，树脂体覆盖第一和第二引线框架和LED芯片，并且具有表面粗糙度为0.15μm以上的上表面和具有高于上表面的表面粗糙度的表面粗糙度的侧表面。

公开(公告)号：US20100133568A1

公开(公告)日：2010-06-03

申请号：US12505721

申请日：2009-07-20

申请人： Tetsuro Komatsu ,  Hideo Tamura

发明人： Tetsuro Komatsu ,  Hideo Tamura

IPC分类号： H01L33/00 ,  H01L21/28

CPC分类号： H01L33/44 ,  H01L25/167 ,  H01L33/505 ,  H01L33/58 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A light emitting device includes: a substrate including through electrodes; a light emitting element bonded onto the substrate and connected to the through electrodes; and a dielectric film made of a translucent inorganic material and spaced from the light emitting element so that an internal space is formed between the dielectric film and the substrate, emission light from the light emitting element being allowed to be emitted through the dielectric film, and a manufacturing the same are provided.

摘要翻译： 发光器件包括：包括通孔的衬底; 发光元件，其结合到所述基板上并连接到所述通孔; 以及由半透明无机材料制成并且与发光元件间隔开的电介质膜，使得在电介质膜和基板之间形成内部空间，允许来自发光元件的发射光通过电介质膜发射，并且 提供了制造相同的制造方法。

公开(公告)号：US06528870B2

公开(公告)日：2003-03-04

申请号：US09769394

申请日：2001-01-26

申请人： Kenta Fukatsu ,  Yasuhito Saito ,  Masayuki Arakawa ,  Tomohiro Iguchi ,  Naotake Watanabe ,  Yoshitoshi Fukuchi ,  Tetsuro Komatsu

发明人： Kenta Fukatsu ,  Yasuhito Saito ,  Masayuki Arakawa ,  Tomohiro Iguchi ,  Naotake Watanabe ,  Yoshitoshi Fukuchi ,  Tetsuro Komatsu

IPC分类号： H01L2302

CPC分类号： H05K3/363 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/144 ,  H05K3/3442 ,  H05K2201/0394 ,  H05K2201/09181 ,  H05K2201/096 ,  H05K2201/0969 ,  H05K2201/10681

摘要： In a stacked-type semiconductor unit having a plurality of semiconductor devices stacked on a base board including a base electrode, each semiconductor device has a wiring board including an external electrode provided in an end portion thereof. The semiconductor devices are stacked on the base board such that the external electrodes are aligned with one another. Then, the external electrodes are electrically connected to the base board by solder.

摘要翻译： 在具有堆叠在包括基极的基板上的多个半导体器件的叠层型半导体单元中，每个半导体器件具有包括设置在其端部中的外部电极的布线板。 半导体器件堆叠在基板上，使得外部电极彼此对准。 然后，外部电极通过焊料与基板电连接。