摘要:
An FET and DRAM using a plurality of such FETs wherein each transistor has a body region of a first conductivity type including a relatively high VT region and relatively low VT region, the high VT region disposed contiguous with the low VT region. A pair of source/drain regions of opposite conductivity type are disposed on a pair of opposing sides of each of the low VT region. The transistor includes a gate oxide over the body region and a gate electrode over the gate oxide and spaced from the body region. The body region is p-doped or n-doped with the high VT region more heavily doped than the remainder of the body. In a further embodiment, the FET includes a body region of a first conductivity type which includes a relatively low VT region and a first pair of relatively high VT regions on a first pair of opposing sides of the body. A pair of source/drain regions of opposite conductivity type are disposed on a second pair of opposing sides of each of the low VT region. A gate oxide is disposed over the body region and a gate electrode is disposed over the gate oxide and spaced from the body region.
摘要:
A circuit (300) employing metal-oxide-semiconductor (MOS) devices is disclosed. The circuit (300) includes a circuit portion (302) that provides a circuit function, and a body voltage adjust portion (304) which alters the body potential of the transistors within the circuit portion (302). By adjusting the body potentials of the circuit portion (300) transistors, the speed at which the circuit portion (300) can perform its function is increased. A decoder circuit embodiment (800) and sense amplifier embodiments (1200, 1300, 1500, 1600, 1700, 1800, 1900 and 2000) are also disclosed.
摘要:
A programmable fast comparison circuit for determining whether the result of a logic operation on two operands is the same as a specified number in advance of the completion of the actual operation includes four fast compare units coupled to each operand signal pairs of the same degree of significance for identifying possible result signal pairs of the same degree of significance. Each fast compare circuit generates a positive signal when a result signal pair is possible based on the corresponding operand bit signal pairs. Control signals determined by the specified number signal pair of the same degree of significance is used to activate one of the four fast compare circuits with the corresponding result signal pair. When the fast compare circuit activated by the control signals is a circuit generating a positive signal, the positive signal is transmitted to a combinatorial circuit. When a positive signal is transmitted by all the sets of fast compare circuits (and one result signal bit is specifically identified with a positive signal applied to the combinatorial circuit), the result number is identical with the specified number and an answer-correct signal is generated. By using the symmetry of the possible result bit signal pairs, the four fast compare circuits for each result signal pair can be reduced to two fast compare circuits. In another embodiment, N kill/generate/propagate circuits can perform a programmable fast comparison for logic operations involving two N length operands.
摘要:
A structure and a method for fabricating integrated circuits are disclosed in which narrow trench isolation structures (36) are formed between active regions (38) of an integrated circuit (10). A silicon nitride layer is deposited, patterned and etched to provide nitride mask (16) having spaces (20) which are preferably no larger than the minimum photolithography spacing limits. Single sidewall oxide spacers (24) are formed on the sidewalls of the nitride mask by depositing a conformal coating of oxide and then applying an anisotropic etch, leaving the oxide spacers (24) of approximately 100 to 500 Angstroms thickness on the sidewalls of the nitride mask (16). Isolation trenches (26) are etched into a silicon substrate (12) in the spaces between adjacent ones of the oxide spacers (24). The oxide spacers (24) are then removed without removing the nitride mask (16), leaving ledges, or shelf regions (28), of the substrate (12) in the spaces between the trenches (26) and the nitride mask (16). Channel stops (30) are implanted into the shelf regions (28). Oxide plugs (34) are formed within the trenches (26). Double sidewall spacers, such as nitride spacers (114) and oxide spacers (118), may be used to reduce the width of the trench isolation structure (140). The edges (66) of the isolation trench (60) may also be rounded.
摘要:
A compact capacitor for use in a small memory cell in high density memories is disclosed. Such a capacitor in the cross-coupling of cross-coupled inverters in the memory cell improves single event upset hardness. The subject capacitor in its preferred embodiment is a MOS capacitor with both n+ and p+ connections to the capacitor channel so as to maintain a relatively high capacitance for both positive and negative capacitor gate voltages.
摘要:
A bi-stable logic device 110 comprises first and second inverters 112 and 114. A first resistive connection 140 is made between the input 134 of the first inverter 112 and the output B.sub.-- of the second inverter 114 and a second resistive connection 142 is made between the input 138 of the second inverter 114 and the output B of the first inverter 112. The first and said second resistive connections are also capacitively coupling. The device 110 is hardened from single event upset. Other systems and methods are also disclosed.
摘要:
A compensation circuit 10 is disclosed herein. The circuit includes a control circuit 14 including a delay element 18 with a delay sensitive to at least one parameter which causes variations in delay and also comprises a compensated driver circuit 16. The compensated driver circuit 16 has a control input B coupled to the control circuit 14 and a signal input C coupled to an input circuit 12. The delay of an output signal OUT of the compensated driver circuit 16 is controlled in part by the control circuit 14 which modifies the delay of the output signal OUT in response to variation of the parameter. Other systems and methods and numerous variations are also disclosed.
摘要:
A delay circuit (10) for a memory device introduces asymmetrical delay to prevent a false write operation from being performed by the memory device, The asymmetrical delay can be disabled during read operations in response to a control signal (CS) in order to allow for fast column access.
摘要:
A method for forming a semiconductor on insulator device is provided that begins with an outer semiconductor layer (16). Trenches (12) of a predetermined depth are formed in outer semiconductor layer (16). An insulator layer (20) is formed outwardly from outer semiconductor layer (16). A mesa (18a) having a predetermined thickness is formed by removing portions of outer semiconductor layer (16) to expose a working surface such that mesa (18a) has a thickness substantially equal to the predetermined depth of the trenches (12) after the working surface is exposed.
摘要:
A method of testing a circuit having one or more memory cells, such as a random access memory, register or latch, is disclosed herein. A selected pattern (e.g., all "1"s, all "0"s, or alternating "1"s and "0 38 s) is stored (block 10) in each memory cell of the circuit under test. The power to-each of the cells is then lowered (block 12) to a selected voltage level which is below the static holding voltage, but greater than zero volts. The voltage level may have been previously determined. After a selected time period (which may also have been previously determined), the power to each of the cells is restored (block 14) and the logical state present in each cell is compared (block 16) with the initially stored logical state to determine if any of the cells have switched to another logical state. This procedure may be repeated (blocks 18-26) a number of times. Other systems and methods are also disclosed.