摘要:
A method is disclosed for forming LDDs (Lightly Doped Drains) in high voltage devices employed in non-volatile memories and DDDs (Doubly Doped Drains) in flash memory applications. The high voltage device is formed by using two successive ion implantations at a tilted angle which provides an improved gradation of doped profile near the junction and the attendant improvement in junction breakdown at higher voltages. The doubly doped drain in a stacked flash memory cell is also formed by two implantations, but at an optimum tilt-angle, where the first implantation is lightly doped, and the second, heavily doped. The resulting DDD provides faster program speed, reduced program current, increase read current and reduced drain disturb in the flash memory cell.
摘要:
A method is provided for forming a stacked-gate flash memory cell having a shallow trench isolation with a high-step of oxide and high lateral coupling. This is accomplished by first depositing an unconventionally high or thick layer of nitride and then forming a shallow trench isolation (STI) through the nitride layer into the substrate, filling the STI with isolation oxide, removing the nitride thus leaving behind a deep opening about the filled STI, filling conformally the opening with a first polysilicon layer to form a floating gate, forming interpoly oxide layer over the floating gate, and then forming a second polysilicon layer to form the control gate and finally forming the self-aligned source of the stacked-gate flash memory cell of the invention. A stacked-gate flash memory cell is also provided having a shallow trench isolation with a high-step of oxide and high lateral coupling.
摘要:
A process for fabricating a flash memory cell, featuring self-aligned contact structures, overlying and contacting, self-aligned source, and self-aligned drain regions, located between stack gate structures, has been developed. The stack gate structures, located on an underlying silicon dioxide, tunnel oxide layer, are comprised of: a capping insulator shape; a polysilicon control gate shape; an inter-polysilicon dielectric shape; and a polysilicon floating gate shape. The use of self-aligned contact structures, and self-aligned source regions, allows increased cell densities to be achieved.
摘要:
When FLASH cells are made in association with STI (as opposed to LOCOS) it is often the case that stringers of silicon nitride are left behind after the spacers have been formed. This problem has been eliminated by requiring that the oxide in the STI trenches remain in place at the time that the silicon nitride spacers are formed. After that, the oxide is removed in the usual manner, following which a SALICIDE process is used to form a self aligned source line. When this sequence is followed no stringers are left behind on the walls of the trench, guaranteeing the absence of any open circuits or high resistance regions in the source line.
摘要:
The invention provides a bio-detection device, including a carrier, a plurality of spacers, an electronic circuit, and a package layer, wherein an open platform is formed. The carrier includes a test region and a signal transmission wiring, wherein the test region is configured to carry a fluid under test. The spacers are located on the test region and electrically connected to two different voltage levels to form a capacitor for sensing a capacitance of the fluid. The spacers are connected to the signal transmission wiring. The electronic circuit receives and processes a sensing signal corresponding to the capacitance of the fluid. The package layer covers a portion of the carrier but does not cover the test region. The open platform is formed whereby a user can easily put in the fluid. The open platform has a bottom which includes the test region, and an area of the open platform is defined by the spacers and the package layer.
摘要:
The present invention discloses a lateral double diffused metal oxide semiconductor (LDMOS) device and a manufacturing method thereof. The LDMOS device includes: drift region, an isolation oxide region, a first oxide region, a second oxide region, a gate, a body region, a source, and a drain. The isolation oxide region, the first oxide region, and the second oxide region have an isolation thickness, a first thickness, and a second thickness respectively, wherein the second thickness is less than the first thickness. The present invention can reduce a conduction resistance without decreasing a breakdown voltage of the LDMOS device by the first oxidation region and the second oxidation region.
摘要:
The present invention discloses a semiconductor composite film with a heterojunction and a manufacturing method thereof. The semiconductor composite film includes: a semiconductor substrate; and a semiconductor epitaxial layer, which is formed on the semiconductor substrate, and it has a first surface and a second surface opposite to each other, wherein the heterojunction is formed between the first surface and the semiconductor substrate, and wherein the semiconductor epitaxial layer further includes at least one recess, which is formed by etching the semiconductor epitaxial layer from the second surface toward the first surface. The recess is for mitigating a strain in the semiconductor composite film.
摘要:
The present invention discloses a semiconductor PN junction structure and a manufacturing method thereof. From top view, the PN junction includes a staggered comb-teeth structure. The PN junction forms a depletion region with enhanced breakdown voltage, hence broadening the applications of a semiconductor device having such PN junction.
摘要:
A level shift circuit includes an input stage and an output stage coupled to each other by two nodes. The input stage changes the voltages on the nodes according to an input signal, and the output stage determines an output signal according to the voltages on the two nodes. In a transition state, the input stage provides a large current to charge or discharge the first node or the second node so as to quickly change the voltage thereon. In a steady state, the input stage lowers the current so as to reduce power consumption.
摘要:
A single-chip common-drain JFET device comprises a drain, two gates and two source arranged such that two common-drain JFETs are formed therewith. Due to the two JFETs merged within a single chip, no wire bonding connection is needed therebetween, thereby without parasitic inductance and resistance caused by bonding wire, and therefore improving the performance and reducing the package cost. The single-chip common-drain JFET device may be applied in buck converter, boost converter, inverting converter, switch, and two-step DC-to-DC converter to improve their performance and efficiency. Alternative single-chip common-drain JFET devices are also provided for current sense or proportional current generation.