Liquid crystal display apparatus having grids
    41.
    发明授权
    Liquid crystal display apparatus having grids 有权
    具有网格的液晶显示装置

    公开(公告)号:US08384854B2

    公开(公告)日:2013-02-26

    申请号:US12385972

    申请日:2009-04-24

    IPC分类号: G02F1/1335

    摘要: A liquid crystal display apparatus includes a backlight unit, a second polarization layer, a liquid crystal layer disposed between the backlight unit and the second polarization layer, a first polarization layer disposed between the backlight unit and the liquid crystal layer. In an embodiment, a surface of the first polarization layer facing the backlight unit includes a reflective surface and a surface of the first polarization layer facing the backlight unit includes an absorbent surface. In another embodiment, the first polarization layer includes grids, which include a metal, and absorbing members, which include dielectric materials. In another embodiment, the first polarization layer includes grids, each of which includes a first component including a dielectric material and a second component including a metal.

    摘要翻译: 液晶显示装置包括背光单元,第二偏振层,设置在背光单元和第二偏振层之间的液晶层,设置在背光单元和液晶层之间的第一偏振层。 在一个实施例中,面向背光单元的第一偏振层的表面包括反射表面,并且面向背光单元的第一偏振层的表面包括吸收表面。 在另一个实施例中,第一偏振层包括包括金属的网格和包括电介质材料的吸收构件。 在另一个实施例中,第一偏振层包括格栅,每个栅格包括包括电介质材料的第一元件和包括金属的第二元件。

    Resistive memory devices, memory systems and methods of controlling input and output operations of the same
    42.
    发明授权
    Resistive memory devices, memory systems and methods of controlling input and output operations of the same 有权
    电阻式存储器件,存储器系统和控制其输入和输出操作的方法

    公开(公告)号:US08223529B2

    公开(公告)日:2012-07-17

    申请号:US12703354

    申请日:2010-02-10

    IPC分类号: G11C11/00

    摘要: A resistive memory device includes a resistive memory cell array, an output circuit and an input circuit. The resistive memory cell array includes a plurality of memory cells that are coupled to bitlines. The output circuit generates a sensing output signal during a write operation by sensing a bitline voltage, and generates output data during a read operation by sensing the bitline voltage. The input circuit controls the bitline voltage based on input data for the write operation, and limits the bitline voltage in response to the sensing output signal during the write operation. The memory cells are protected by effectually limiting bitline voltage.

    摘要翻译: 电阻式存储器件包括电阻存储单元阵列,输出电路和输入电路。 电阻存储单元阵列包括耦合到位线的多个存储单元。 输出电路通过感测位线电压在写入操作期间产生感测输出信号,并通过感测位线电压在读取操作期间产生输出数据。 输入电路基于用于写入操作的输入数据来控制位线电压,并且在写入操作期间响应于感测输出信号来限制位线电压。 存储单元受到有效限制位线电压的保护。

    Liquid crystal display device and method for driving the same
    45.
    发明授权
    Liquid crystal display device and method for driving the same 失效
    液晶显示装置及其驱动方法

    公开(公告)号:US07602362B2

    公开(公告)日:2009-10-13

    申请号:US11280295

    申请日:2005-11-17

    申请人: Chul-Woo Park

    发明人: Chul-Woo Park

    IPC分类号: G09G3/34

    摘要: A liquid crystal display (LCD) device and a method of operating the same prevents a tearing effect from occurring. The LCD device includes a frame memory for writing new red, green and blue data or reading previously written red, green and blue data according to address designation, and a detector which outputs a cut off signal for cutting off operation of a light source controller or a gradation voltage generating portion when the new red, green and blue data are written to the frame memory before the written red, green and blue data are read from the frame memory.

    摘要翻译: 液晶显示器(LCD)装置及其操作方法防止发生撕裂效应。 LCD装置包括用于写入新的红色,绿色和蓝色数据或者根据地址指定读取以前写入的红,绿和蓝数据的帧存储器,以及输出用于切断光源控制器的操作的截止信号的检测器, 在从帧存储器读取写入的红色,绿色和蓝色数据之前,将新的红色,绿色和蓝色数据写入帧存储器的灰度电压产生部分。

    Method for outputting internal temperature data in semiconductor memory device and circuit of outputting internal temperature date thereby
    46.
    发明授权
    Method for outputting internal temperature data in semiconductor memory device and circuit of outputting internal temperature date thereby 失效
    用于输出半导体存储器件中的内部温度数据的方法和由此输出内部温度日期的电路

    公开(公告)号:US07594750B2

    公开(公告)日:2009-09-29

    申请号:US11335036

    申请日:2006-01-18

    IPC分类号: G01K7/00 G11C7/00

    CPC分类号: G01K7/42

    摘要: A method for outputting internal temperature data in a semiconductor memory device can output, at high speed, relatively accurate temperature data externally, without continuously or periodically driving a temperature sensor. The method for outputting the internal temperature data comprises externally outputting internal temperature data stored in a register in a preceding driving cycle in response to a temperature data request signal; driving a temperature sensor during a predefined time section after the output of the internal temperature data is completed; and storing the internal temperature data obtained from the temperature sensor in the register. Power consumption is reduced and accurate temperature data is output externally within a shorter time.

    摘要翻译: 用于输出半导体存储器件中的内部温度数据的方法可以高速输出外部相对精确的温度数据,而不用连续地或周期地驱动温度传感器。 用于输出内部温度数据的方法包括响应于温度数据请求信号在前一个驱动周期内外部输出存储在寄存器中的内部温度数据; 在内部温度数据的输出完成之后的预定时间段内驱动温度传感器; 并将从温度传感器获得的内部温度数据存储在寄存器中。 降低功耗,并在较短的时间内外部输出精确的温度数据。

    Semiconductor memory device
    47.
    发明申请
    Semiconductor memory device 失效
    半导体存储器件

    公开(公告)号:US20070008681A1

    公开(公告)日:2007-01-11

    申请号:US11435636

    申请日:2006-05-17

    申请人: Chul-Woo Park

    发明人: Chul-Woo Park

    IPC分类号: H02B1/00

    摘要: A semiconductor memory device includes a semiconductor chip including a first voltage generating circuit that generates a first voltage in response to a first operation control signal, a second voltage generating circuit that generates a second voltage in response to a second operation control signal, a first operation control circuit that generates the first operation control signal, a second operation control circuit that generates the second operation control signal, a first bonding pad connected to an output of the fist voltage generating circuit, and a second bonding pad connected to an output of the second voltage generating circuit. A packaging substrate includes a first substrate pad connected to the first bonding pad and a second substrate pad connected to the second bonding pad. The first and second substrate pads are connected to each other through the packaging substrate.

    摘要翻译: 半导体存储器件包括:半导体芯片,包括响应于第一操作控制信号产生第一电压的第一电压产生电路;响应于第二操作控制信号产生第二电压的第二电压产生电路;第一操作 产生第一操作控制信号的控制电路,产生第二操作控制信号的第二操作控制电路,连接到第一电压产生电路的输出的第一焊盘和连接到第二操作控制信号的输出的第二焊盘 电压发生电路。 封装衬底包括连接到第一焊盘的第一衬底焊盘和连接到第二焊盘的第二衬底焊盘。 第一和第二基板焊盘通过封装基板相互连接。

    Method for outputting internal temperature data in semiconductor memory device and circuit of outputting internal temperature data thereby
    48.
    发明申请
    Method for outputting internal temperature data in semiconductor memory device and circuit of outputting internal temperature data thereby 失效
    用于输出半导体存储器件中的内部温度数据的方法和由此输出内部温度数据的电路

    公开(公告)号:US20060159156A1

    公开(公告)日:2006-07-20

    申请号:US11335036

    申请日:2006-01-18

    IPC分类号: G01K7/00

    CPC分类号: G01K7/42

    摘要: A method for outputting internal temperature data in a semiconductor memory device can output, at high speed, relatively accurate temperature data externally, without continuously or periodically driving a temperature sensor. The method for outputting the internal temperature data comprises externally outputting internal temperature data stored in a register in a preceding driving cycle in response to a temperature data request signal; driving a temperature sensor during a predefined time section after the output of the internal temperature data is completed; and storing the internal temperature data obtained from the temperature sensor in the register. Power consumption is reduced and accurate temperature data is output externally within a shorter time.

    摘要翻译: 用于输出半导体存储器件中的内部温度数据的方法可以高速输出外部相对精确的温度数据,而不用连续地或周期地驱动温度传感器。 用于输出内部温度数据的方法包括响应于温度数据请求信号在前一个驱动周期内外部输出存储在寄存器中的内部温度数据; 在内部温度数据的输出完成之后的预定时间段内驱动温度传感器; 并将从温度传感器获得的内部温度数据存储在寄存器中。 降低功耗,并在较短的时间内外部输出精确的温度数据。

    Leadless alloy for soldering
    49.
    发明授权
    Leadless alloy for soldering 失效
    用于焊接的无铅合金

    公开(公告)号:US5980822A

    公开(公告)日:1999-11-09

    申请号:US9309

    申请日:1998-01-20

    IPC分类号: B23K35/26 C22C13/00 C22C13/02

    CPC分类号: B23K35/262

    摘要: A leadless alloy for soldering containing 0.1 to 5.0% bismuth, 0.1 to 5.0% silver, 0.1 to 3.0% antimony, 0.1 to 5.5% copper, 0.001 to 0.01% phosphorus, 0.01 to 0.1% germanium and 81.4 to 99.6% tin by weight.

    摘要翻译: 一种用于焊接的无铅合金,其含有0.1至5.0%的铋,0.1至5.0%的银,0.1至3.0%的锑,0.1至5.5%的铜,0.001至0.01%的磷,0.01至0.1%的锗和81.4至99.6重量%的锡。