摘要:
In a miniaturized complete CMOS SRAM of a TFT load type, a field effect thin-film transistor (TFT) can achieve stable reading and writing operation of a memory cell and can reduce power consumption thereof. The field effect thin-film transistor formed on an insulator includes an active layer and a gate electrode. The gate electrode is formed on a channel region of the active layer with a gate insulating film therebetween. The active layer is formed of a channel region and source/drain regions. The channel region is formed of a monocrystal silicon layer and does not includes a grain boundary. The source/drain regions is formed of a polysilicon layer. The channel region has a density of crystal defects of less than 10.sup.9 pieces/cm.sup.2. The thin film transistor shows an ON current of 0.25 .mu.A/.mu.m per channel width of 1 .mu.m and an OFF current of 15 fA/.mu.m. The thin-film transistor can be applied to a p-channel MOS transistor serving as a load transistor in a memory cell of a CMOS type SRAM.
摘要:
Semiconductor devices are provided including an active layer, a gate structure, a spacer, and a source/drain layer. The active layer is on the substrate and includes germanium. The active layer includes a first region having a first germanium concentration, and a second region on both sides of the first region. The second region has a top surface getting higher from a first portion of the second region adjacent to the first region toward a second portion of the second region far from the first region, and has a second germanium concentration less than the first germanium concentration. The gate structure is formed on the first region of the active layer. The spacer is formed on the second region of the active layer, and contacts a sidewall of the gate structure. The source/drain layer is adjacent to the second region of the active layer.
摘要:
A semiconductor device can include an active region having a fin portion providing a channel region between opposing source and drain regions. A gate electrode can cross over the channel region between the opposing source and drain regions and first and second strain inducing structures can be on opposing sides of the gate electrode and can be configured to induce strain on the channel region, where each of the first and second strain inducing structures including a respective facing side having a pair of {111} crystallographically oriented facets.
摘要:
A semiconductor device is provided. The semiconductor device includes a first fin on a substrate, a first gate electrode formed on the substrate to intersect the first fin, a first elevated source/drain on the first fin on both sides of the first gate electrode, and a first metal alloy layer on an upper surface and sidewall of the first elevated source/drain.
摘要:
Methods and devices for forming both high-voltage and low-voltage transistors on a common substrate using a reduced number of processing steps are disclosed. An exemplary method includes forming at least a first high-voltage transistor well and a first low-voltage transistor well on a common substrate separated by an isolation structure extending a first depth into the substrate, using a first mask and first implantation process to simultaneously implant a doping material of a first conductivity type into a channel region of the low-voltage transistor well and a drain region for the high-voltage transistor well.
摘要:
In a semiconductor capable of reducing NBTI and a method for manufacturing the same, a multi-gate transistor includes an active region, gate dielectric, channels in the active region, and gate electrodes, and is formed on a semiconductor wafer. The active region has a top and side surfaces, and is oriented in a first direction. The gate dielectric is formed on the top and side surfaces of the active region. The channels are formed in the top and side surfaces of the active region. The gate electrodes are formed on the gate dielectric corresponding to the channels and aligned perpendicular to the active region such that current flows in the first direction. In one aspect of the invention, an SOI layer having a second orientation indicator in a second direction is formed on a supporting substrate having a first orientation indicator in a first direction.
摘要:
A semiconductor device with a strain layer and a method of fabricating the semiconductor device with a strain layer that can reduce a loading effect are provided. By arranging active dummies and gate dummies not to overlap each other, the area of active dummy on which a strain layer dummy will be formed can be secured, thereby reducing the loading effect.
摘要:
Disclosed is a MOS transistor including a multi-work function metal nitride gate electrode. The MOS transistor comprises a semiconductor substrate and a central gate electrode formed on the semiconductor substrate. The central gate electrode is formed of a metal nitride layer. A source side gate electrode and a drain side gate electrode are formed on respective opposite sidewalls of the central gate electrode. The source and drain side gate electrodes are composed of doped metal nitride containing first impurities having an electronegativity less than that of nitrogen or second impurities having an electronegativity greater than that of nitrogen.
摘要:
Provided are an electrical fuse, a semiconductor device having the same, and a method of programming and reading the electrical fuse. The electrical fuse includes first and second anodes disposed apart from each other. A cathode is interposed between the first and second anodes. A first fuse link couples the first anode to the cathode, and a second fuse link couples the second anode to the cathode.
摘要:
An on-chip inductor can include an outer inductor portion that separates an inner region of the inductor from an outer region of the inductor outside the inductor. An interconnect inductor portion is electrically coupled to the main inductor portion wherein the interconnect inductor portion can include extension portions that follow the contour of the adjacent portions of the outer inductor in the inner region of the inductor. An input path is coupled to the outer inductor portion through the extension portion and extends away from the inductor beneath the outer inductor portion on a first side thereof. An output path is coupled to the outer inductor portion through the extension portion and extends away from the inductor beneath the outer inductor portion on a second side of the inductor opposite the first side.