公开(公告)号：US20040079791A1

公开(公告)日：2004-04-29

申请号：US10616194

申请日：2003-07-09

Applicant: MEC COMPANY LTD.

Inventor： Tetsuo Kida ,  Samuel Kenneth Liem

IPC: B23K001/20 ,  B23K031/02

CPC classification number: H05K3/26 ,  C23G1/00 ,  H05K3/3489 ,  H05K2203/0789 ,  H05K2203/0793 ,  Y10T29/4913

Abstract: A method for manufacturing a printed circuit board includes: washing a land that corresponds to the exposed portion of a copper circuit of a printed circuit board with acidic electrolytic water having a pH of not more than 5 to remove an oxide; treating the land with basic electrolytic water having a pH of not less than 9 to prevent oxidation; and soldering electronic components to the land. The portion to be soldered is treated with the electrolytic water beforehand, thereby improving soldering at low cost without any adverse effect on the environment.

Abstract translation: 印刷电路板的制造方法包括：用pH5以下的酸性电解水清洗与印刷电路板的铜电路的露出部分相对应的焊盘，以除去氧化物; 用pH不小于9的碱性电解水处理土地以防止氧化; 并将电子元件焊接到土地上。 预先用电解水处理要焊接的部分，从而以低成本改善焊接，而不会对环境产生不利影响。

公开(公告)号：US20020192460A1

公开(公告)日：2002-12-19

申请号：US10131771

申请日：2002-04-23

Applicant: MEC COMPANY LTD.

Inventor： Mutsuyuki Kawaguchi ,  Jun Hisada ,  Toshiko Nakagawa

IPC: B32B015/08 ,  B05D001/36 ,  B05D003/10

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B37/0038 ,  B32B38/0012 ,  B32B2311/12 ,  B32B2398/00 ,  B32B2457/08 ,  C23C22/52 ,  H05K3/389 ,  Y10S428/91 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/273 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31529 ,  Y10T428/3154 ,  Y10T428/31681

Abstract: A laminate is made by adhering at least one metal layer selected from the group consisting of copper and a copper alloy to a resin layer. A coating film of an azole-copper complex compound formed by a contact with an aqueous solution containing an azole compound in an range from 0.1 mass % to 15 mass % and an organic acid in a range from 1 mass % to 80 mass % is formed on the metal layer surface, and the metal layer adheres to the resin layer via the coating film of the azole-copper complex compound. Thereby, the present invention provides a laminate with improved adhesion between a surface of copper or a copper alloy and resin in a multilayered printed circuit board, and also a method of manufacturing the laminate.

Abstract translation: 通过将选自铜和铜合金的至少一种金属层粘附到树脂层上来制造层压体。 形成通过与含有0.1质量％-15质量％的唑类化合物的水溶液和1质量％至80质量％范围内的有机酸接触形成的唑 - 铜络合物的涂膜 在金属层表面上，并且金属层通过唑 - 铜络合物的涂膜粘附到树脂层。 因此，本发明提供了一种具有改进的铜或铜合金表面与多层印刷电路板中的树脂之间的粘附性的层压体，以及制造层压体的方法。

公开(公告)号：US20230212757A1

公开(公告)日：2023-07-06

申请号：US17998980

申请日：2021-11-16

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. ,  MEC COMPANY LTD.

Inventor： Ryuta OHSUKA ,  Koji NITTA ,  Shoichiro SAKAI ,  Yoshihito YAMAGUCHI ,  Masaharu YASUDA ,  Akira TSUCHIKO ,  Koji KASUYA ,  Kenji NISHIE ,  Yu FUKUI

IPC: C23F1/46 ,  H05K3/06

CPC classification number: C23F1/46 ,  H05K3/06

Abstract: A regenerating method of a removal liquid including: removing a nickel-chromium-containing layer from a substrate using the removal liquid at a time of manufacturing a printed circuit board by a semi-additive method, the substrate including the nickel-chromium-containing layer and a copper-containing layer; collecting the removal liquid that has been used; and contacting the collected removal liquid in collecting the removal liquid with a chelate resin, wherein the chelate resin includes a functional group represented by a following formula (1):




where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms in the hydrocarbon groups are substituted with halogen atoms or not substituted with a halogen atom.

公开(公告)号：US10883027B2

公开(公告)日：2021-01-05

申请号：US16611250

申请日：2018-03-02

Applicant: MEC COMPANY LTD.

Inventor： Itsuro Tomatsu ,  Kosuke Kumazaki ,  Yasutaka Amitani ,  Yuko Shibanuma ,  Ikuyo Katayama

IPC: C09J179/02 ,  B32B15/08 ,  B32B15/20 ,  B32B37/12 ,  C09J5/02 ,  C09J11/04 ,  C23C22/06 ,  C23C22/63 ,  C23C22/68 ,  H05K3/38

Abstract: The coating film-forming composition includes an aromatic compound having an amino group and an aromatic ring in one molecule, and thio compound (sulfur oxoacids having a pKa of −1.9 or less and salts thereof are excluded). pH of the coating film-forming composition is 4 to 10. The thio compound is preferably one that ionized to form anions in a solution, and thiosulfate and thiocyanate are especially preferable. By bringing the coating film-forming composition into contact with the surface of a metal member, a coating film is formed on the surface of the metal member, so that a surface-treated metal member can be obtained.

公开(公告)号：US20160340788A1

公开(公告)日：2016-11-24

申请号：US15224825

申请日：2016-08-01

Applicant: MEC COMPANY LTD.

Inventor： Masayo KURII ,  Kiyoto TAI ,  Mami NAKAMURA

IPC: C23F1/18 ,  H05K3/00

CPC classification number: C23F1/18 ,  C23F1/34 ,  H05K3/0085 ,  H05K3/022 ,  H05K3/383 ,  H05K2203/0307 ,  H05K2203/0789

Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

公开(公告)号：US09493878B2

公开(公告)日：2016-11-15

申请号：US13580111

申请日：2010-11-08

Applicant: Ryo Ogushi ,  Minoru Otani

Inventor： Ryo Ogushi ,  Minoru Otani

IPC: H01L21/302 ,  H01L21/461 ,  C09K13/00 ,  C09K13/02 ,  C23F1/36 ,  C23F1/32 ,  C23F1/14 ,  C23F1/00

CPC classification number: C23F1/36 ,  C09K13/00 ,  C09K13/02 ,  C23F1/00 ,  C23F1/14 ,  C23F1/32

Abstract: Provided are a surface roughening agent for aluminum and a surface roughening method using said surface roughening agent wherein it is possible to easily reduce costs for the surface roughening step and to improve the adhesiveness between aluminum and a resin. Specifically, provided is a surface roughening agent for aluminum comprising an aqueous solution containing: an alkali source, an amphoteric metal ion, a nitrate ion, and a thio compound. Moreover, provided is a surface roughening method for aluminum which involves a surface roughening step in which the surface of aluminum is treated with the aforementioned surface roughening agent.

Abstract translation: 提供了一种铝的表面粗糙剂和使用所述表面粗糙剂的表面粗糙化方法，其中可以容易地降低表面粗糙化步骤的成本并改善铝和树脂之间的粘附性。 具体地，提供一种铝的表面粗糙剂，其包含含有碱源，两性金属离子，硝酸根离子和硫代化合物的水溶液。 此外，提供了一种铝的表面粗糙化方法，其包括用上述表面粗糙剂处理铝的表面的表面粗糙化步骤。

公开(公告)号：US08828554B2

公开(公告)日：2014-09-09

申请号：US12352048

申请日：2009-01-12

Applicant: Mutsuyuki Kawaguchi ,  Satoshi Saito ,  Tsuyoshi Amatani ,  Yuko Fujii

Inventor： Mutsuyuki Kawaguchi ,  Satoshi Saito ,  Tsuyoshi Amatani ,  Yuko Fujii

IPC: B32B15/20 ,  H05K3/38

CPC classification number: H05K3/388 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0353 ,  H05K2203/0361 ,  Y10T428/12431 ,  Y10T428/12493 ,  Y10T428/12569 ,  Y10T428/12708

Abstract: The object of the present invention is to provide an electroconductive layer that retains bondability to a resin layer certainly and is further a layer from which a copper-tin alloy layer is easily removed in a subsequent step, a laminate using this layer, and producing processes thereof. The electroconductive layer of the present invention is an electroconductive layer which is to be bonded to a resin layer, and which contains a copper layer and a copper-tin alloy layer laminated over the copper layer, wherein the copper-tin alloy layer has a thickness of 0.001 to 0.020 μm.

Abstract translation: 本发明的目的是提供一种导电层，其保持与树脂层的粘合性，并且还可以在随后的步骤中容易地除去铜 - 锡合金层的层，使用该层的层压体和制造方法 其中。 本发明的导电层是与树脂层接合并且在铜层上层叠有铜层和铜 - 锡合金层的导电层，其中，铜 - 锡合金层的厚度 为0.001〜0.020μm。

公开(公告)号：US07156904B2

公开(公告)日：2007-01-02

申请号：US10826091

申请日：2004-04-16

Applicant: Mutsuyuki Kawaguchi ,  Satoshi Saito ,  Jun Hisada ,  Naomi Kanda ,  Toshiko Nakagawa

Inventor： Mutsuyuki Kawaguchi ,  Satoshi Saito ,  Jun Hisada ,  Naomi Kanda ,  Toshiko Nakagawa

IPC: C23C18/31 ,  C23C18/34 ,  C23C18/48 ,  C23C30/00

CPC classification number: C23C18/48 ,  C23C18/31 ,  H01L2924/0002 ,  H05K3/384 ,  H05K2203/072 ,  Y10T428/31681 ,  H01L2924/00

Abstract: An aqueous copper-to-resin bonding layer solution comprising: (a) at least one acid type; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum; (d) a reaction accelerator; and (e) a diffusive retaining solvent, so that an alloy layer of tin and the at least one type of metal selected in (c) is formed on the surface of the copper. Subsequently, a portion of the alloy layer is removed, so that a bonding layer containing an alloy of diffused copper, tin, and the at least one type of metal selected in (c) is formed on a surface of copper which enhances the adhesion between copper and resin. The present invention provides the solution, a method of producing the bonding layer, and a product obtained thereby.

Abstract translation: 一种铜 - 树脂粘合层水溶液，包括：（a）至少一种酸型; （b）锡盐或氧化锡; （c）选自银，锌，铝，钛，铋，铬，铁，钴，镍，钯，金和铂中的至少一种金属的盐或氧化物; （d）反应促进剂; 和（e）扩散保持溶剂，使得在铜的表面上形成锡的合金层和（c）中选择的至少一种类型的金属。 随后，去除合金层的一部分，使得在铜的表面上形成包含扩散的铜，锡和（c）中选择的至少一种类型的金属的合金的粘合层，这增强了 铜和树脂。 本发明提供了溶液，粘合层的制造方法和由此获得的产物。

公开(公告)号：US20050279253A1

公开(公告)日：2005-12-22

申请号：US11153968

申请日：2005-06-16

Applicant: Sachiko Nakamura ,  Yoshinari Miyata ,  Terukazu Ishida ,  Miho Misumi

Inventor： Sachiko Nakamura ,  Yoshinari Miyata ,  Terukazu Ishida ,  Miho Misumi

IPC: C08J7/06 ,  C08J7/12 ,  C09K13/04 ,  H05K3/38 ,  C07G1/00 ,  B05D1/40 ,  B05D3/00

CPC classification number: C08J7/06 ,  C08J7/12 ,  H05K3/381

Abstract: The present invention relates to a resin surface treating agent containing as an effective component at least one cerium compound selected from tetravalent and trivalent cerium compounds. The surface treating method of the present invention is a method of bringing a surface of a resin into contact with a surface treating agent containing as an effective component at least one cerium compound selected from tetravalent and trivalent cerium compounds, and thereafter treating the surface with an acidic aqueous solution. This activates the resin surface and thereby increases a strength of adhesion of, for instance, a polyimide-based resin film with metal wires, as well as a strength of adhesion of a polyimide-based resin film with another resin. Thus, a resin surface treating agent that provides excellent productivity and reduces processing costs, as well as a surface treating method using the same, are provided.

Abstract translation: 本发明涉及含有至少一种选自四价和三价铈化合物的铈化合物作为有效成分的树脂表面处理剂。 本发明的表面处理方法是使树脂的表面与含有选自四价和三价铈化合物的至少一种铈化合物作为有效成分的表面处理剂接触，然后用 酸性水溶液。 这激活树脂表面，从而增加例如具有金属线的聚酰亚胺系树脂膜的粘附强度，以及聚酰亚胺系树脂膜与其他树脂的粘合强度。 因此，提供了提供优异的生产率和降低加工成本的树脂表面处理剂以及使用其的表面处理方法。

公开(公告)号：US20050003086A1

公开(公告)日：2005-01-06

申请号：US10881276

申请日：2004-06-30

Applicant: Minoru Otani ,  Jun Hisada ,  Toyoki Mawatari

Inventor： Minoru Otani ,  Jun Hisada ,  Toyoki Mawatari

IPC: C07F1/08 ,  C07F1/00 ,  C23C18/08 ,  H05K3/40 ,  C23C16/00

CPC classification number: C23C18/08

Abstract: The present invention provides a copper compound having a decomposition temperature in a range of 100° C. to 300° C. and including one unit or a plurality of connected units represented by the following Formula (1): [R1COO]n[NH3]mCuX1p   (1) where n is 1 to 3; m is 1 to 3; p is 0 to 1; n pieces of R1 respectively represent the following Formula (2), CH2X2, CH2X2(CHX2)q, NH2, or H, and may be the same or different from each other, or n is 2 and two pieces of [R1COO] represent together the following Formula (3); R2, R3, and R4 are respectively CH2X2, CH2X2(CHX2)q, NH2, or H; R5 is —(CHX2)r—; X2 is H, OH, or NH2; r is 0 to 4; q is 1 to 4; and X1 is NH4+, H2O, or solvent molecules According to the above configuration, there are provided a copper compound capable of forming a copper thin film required for producing an electronic device or the like safely, inexpensively, and easily, and a method for producing a copper thin film using the copper compound.

Abstract translation: 本发明提供一种分解温度在100℃至300℃的铜化合物，并且包括由下式（1）表示的一个单元或多个连接单元：[R 1 COO] n [NH 3] mCuX 1 p（1）其中n为1至3; m为1〜3; p为0〜1; n个R 1分别表示下式（2），CH 2 X 2，CH 2 X 2（CHX 2）q，NH 2或H，并且可以彼此相同或不同，或 n为2，两个[R 1 COO]一起表示下式（3）。 R 2，R 3和R 4分别为CH 2 X 2，CH 2 X 2（CHX 2）q，NH 2或H; R 5为 - （CHX 2）r - ; X 2是H，OH或NH 2; r为0〜4; q为1〜4; X 1是NH 4 +，H 2 O或溶剂分子根据上述结构，提供了能够安全，廉价且容易地形成电子器件等制造所需的铜薄膜的铜化合物， 使用铜化合物的铜薄膜的制造方法。