公开(公告)号：US20110079889A1

公开(公告)日：2011-04-07

申请号：US12899077

申请日：2010-10-06

Applicant: Xavier BAILLIN

Inventor： Xavier BAILLIN

IPC: H01L23/02 ,  H01L21/56

CPC classification number: B81B7/0038 ,  B81C2203/019 ,  G01J5/045 ,  H01L23/10 ,  H01L23/26 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure comprising a cavity delimited by a first substrate and a second substrate attached to the first substrate by an adhesion interface, in which a first part of a first portion of a getter material forms part of the adhesion interface, and a second part of the first portion of getter material is placed in the cavity, the first portion of getter material being placed against the first substrate or the second substrate, the adhesion interface further comprising part of a second portion of a getter material thermocompressed to the first part of the first portion of getter material, said second portion of getter material being placed against the second substrate when the first portion of getter material is placed against the first substrate or placed against the first substrate when the first portion of getter material is placed against the second substrate.

Abstract translation: 一种结构，其包括由第一基底限定的空腔和通过粘合界面附接到第一基底的第二基底，其中吸气剂材料的第一部分的第一部分形成粘附界面的一部分，以及第二部分 吸气剂材料的第一部分被放置在空腔中，吸气材料的第一部分被放置在第一衬底或第二衬底上，粘合界面还包括被热压到第一衬底的第一部分的吸气材料的第二部分的一部分 当吸气剂材料的第一部分抵靠第二基底放置时，当吸气剂材料的第一部分靠着第一基底放置时，吸气剂材料的第二部分被放置在第二基底上。

公开(公告)号：US07897920B2

公开(公告)日：2011-03-01

申请号：US11436245

申请日：2006-05-18

Applicant: Oliver Kierse ,  Eamon Hynes

Inventor： Oliver Kierse ,  Eamon Hynes

IPC: G01T1/24

CPC classification number: H01L27/1446 ,  G01J5/041 ,  G01J5/045 ,  G01J5/0884 ,  H01L27/14618 ,  H01L27/14634 ,  H01L31/0203 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An improved radiation sensor device includes a cap attached to an integrated circuit chip which has a radiation sensor on a surface with a cap spaced from and covering the radiation sensor; the cap and integrated circuit chip with radiation sensor are encapsulated in an encapsulant with a transparent portion of at least one of the cap and integrated circuit chip proximate the radiation sensor being exposed at the boundary of the encapsulant.

Abstract translation: 改进的辐射传感器装置包括附接到集成电路芯片的盖子，该盖子在表面上具有辐射传感器，盖子与辐射传感器间隔开并覆盖辐射传感器; 具有辐射传感器的帽和集成电路芯片被封装在密封剂中，其中靠近辐射传感器的帽和集成电路芯片中的至少一个的透明部分暴露在密封剂的边界处。

公开(公告)号：US20100314544A1

公开(公告)日：2010-12-16

申请号：US12776935

申请日：2010-05-10

Applicant: Jean-Louis OUVRIER-BUFFET

Inventor： Jean-Louis OUVRIER-BUFFET

IPC: H01L31/09 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/60 ,  H01L33/46

CPC classification number: G01J5/04 ,  G01J5/045

Abstract: The device for detection and/or emission of radiation has an encapsulation micropackage in a vacuum or under reduced pressure that comprises a cap and a substrate delineating a sealed housing. The housing encapsulates at least one uncooled thermal detector and/or emitter having a membrane sensitive to electromagnetic radiation suspended above the substrate, a reflector and at least one getter. The getter is arranged on at least a part of a second main surface of the reflector to form a reflector/getter assembly. A free space, releasing an accessible surface of the getter and in communication with the housing, is also formed between the reflector/getter assembly and the front surface of the substrate.

Abstract translation: 用于检测和/或发射辐射的装置在真空或减压下具有包封微袋，其包括盖和描绘密封壳体的基板。 壳体封装至少一个非冷却的热检测器和/或发射器，其具有对悬挂在衬底上的电磁辐射敏感的膜，反射器和至少一个吸气剂。 吸气剂布置在反射器的第二主表面的至少一部分上以形成反射器/吸气剂组件。 在反射器/吸气剂组件和基板的前表面之间还形成有释放吸气剂的可接近表面并与壳体连通的自由空间。

公开(公告)号：US07851903B2

公开(公告)日：2010-12-14

申请号：US12156782

申请日：2008-06-03

Applicant: Kozo Ichikawa

Inventor： Kozo Ichikawa

IPC: H01L23/12

CPC classification number: H01L31/0203 ,  G01J5/022 ,  G01J5/04 ,  G01J5/045 ,  G01J5/08 ,  G01J5/0875 ,  H01L2924/16195

Abstract: An infrared detector comprises: first and second container members bonded to each other along an annular bonding portion to define a vacuum-sealed inner space, where the second container member has an infrared-transmissive property; an infrared detecting element disposed in the inner space; a first annular metallization layer formed on the bonding portion of the first container member; a second annular metallization layer formed on the bonding portion of the second container member; a solder metal for air-tightly bonding the first metallization layer and the second metallization layer; and a third metallization layer formed in a vicinity of one of the first and second metallization layers such that the third metallization layer overlaps the other of the first and second metallization layers at least partly.

Abstract translation: 红外检测器包括：第一和第二容器构件，其沿着环形接合部分彼此接合以限定真空密封的内部空间，其中第二容器构件具有红外透射性; 设置在所述内部空间中的红外线检测元件; 形成在第一容器构件的接合部分上的第一环形金属化层; 形成在第二容器构件的接合部分上的第二环形金属化层; 用于气密地结合第一金属化层和第二金属化层的焊料金属; 以及形成在第一和第二金属化层之一附近的第三金属化层，使得第三金属化层至少部分地与第一和第二金属化层中的另一个重叠。

公开(公告)号：US20100264459A1

公开(公告)日：2010-10-21

申请号：US12801718

申请日：2010-06-22

Applicant: Koichiro Ueno ,  Naohiro Kuze ,  Yoshitaka Moriyasu ,  Kazuhiro Nagase

Inventor： Koichiro Ueno ,  Naohiro Kuze ,  Yoshitaka Moriyasu ,  Kazuhiro Nagase

IPC: H01L31/062 ,  H01L31/113

CPC classification number: H01L31/035236 ,  B82Y20/00 ,  G01J1/02 ,  G01J1/0204 ,  G01J5/02 ,  G01J5/0215 ,  G01J5/04 ,  G01J5/045 ,  G01J5/20 ,  G01J2001/0276 ,  H01L31/1035 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An infrared sensor IC and an infrared sensor, which are extremely small and are not easily affected by electromagnetic noise and thermal fluctuation, and a manufacturing method thereof are provided. A compound semiconductor that has a small device resistance and a large electron mobility is used for a sensor (2), and then, the compound semiconductor sensor (2) and an integrated circuit (3), which processes an electrical signal output by the compound semiconductor sensor (2) and performs an operation, are arranged in a single package using hybrid formation. In this manner, an infrared sensor IC that can be operated at room temperature can be provided by a microminiature and simple package that is not conventionally produced.

公开(公告)号：US07723686B2

公开(公告)日：2010-05-25

申请号：US12191447

申请日：2008-08-14

Applicant: Robert Hannebauer

Inventor： Robert Hannebauer

IPC: G01J5/00

CPC classification number: G01J3/36 ,  G01J5/04 ,  G01J5/045 ,  G01J5/06 ,  G01J5/20 ,  H01L27/14647 ,  H01L27/14652 ,  H04N5/33 ,  H04N5/332

Abstract: An image sensor for detecting a wide spectrum includes a plurality of infrared ray receiving layers which individually receive infrared rays having different wavelengths for each pixel, the plurality of infrared ray receiving layers stacked to each other. The image sensor, which is an integrated image sensor where at least two micro bolometers are stacked, acquires spectrum information about visible rays and near-infrared rays as well as two or more infrared rays applied on an object, without mechanical/thermal/optical distortion, and provides the spectrum information to a silicon-based semiconductor such as a photodiode, thereby improving photoelectric conversion efficiency.

Abstract translation: 用于检测广谱的图像传感器包括多个红外线接收层，其各自接收各个像素具有不同波长的红外线，多个红外线接收层彼此堆叠。 作为集成图像传感器的图像传感器，其中堆叠有至少两个微测辐射热计，获得关于可见光和近红外线以及施加在物体上的两个或更多个红外线的光谱信息，没有机械/热/光学失真 并且将光谱信息提供给诸如光电二极管的硅基半导体，从而提高光电转换效率。

公开(公告)号：US07718967B2

公开(公告)日：2010-05-18

申请号：US11584121

申请日：2006-10-20

Applicant: William A. Lane ,  Eamon Hynes ,  Edward John Coyne

Inventor： William A. Lane ,  Eamon Hynes ,  Edward John Coyne

IPC: G01J5/02

CPC classification number: G01J1/04 ,  G01J1/0411 ,  G01J5/02 ,  G01J5/0225 ,  G01J5/024 ,  G01J5/045 ,  G01J5/06 ,  G01J5/08 ,  G01J5/0803 ,  G01J5/0806 ,  G01J5/0846 ,  G01J5/089 ,  G01J2005/068 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention provides a sensor array having a plurality of sensor elements formed in a first substrate and having a plurality of die temperature sensors located thereabout. Each of the die temperature sensors are configured to provide an output related to the temperature of the die on which they are located, the sensor elements providing an output indicative of the intensity of radiation incident thereon.

Abstract translation: 本发明提供一种传感器阵列，其具有形成在第一基底中的多个传感器元件，并且具有位于其周围的多个模具温度传感器。 每个模具温度传感器被配置为提供与它们所在的管芯的温度相关的输出，传感器元件提供指示入射在其上的辐射强度的输出。

公开(公告)号：US20090196626A1

公开(公告)日：2009-08-06

申请号：US12285563

申请日：2008-10-08

Applicant: Takuya Nakao

Inventor： Takuya Nakao

IPC: H04B10/00 ,  G01J1/44

CPC classification number: H01L31/101 ,  G01J1/02 ,  G01J1/0219 ,  G01J1/0271 ,  G01J1/04 ,  G01J1/0411 ,  G01J5/045 ,  H05K1/182

Abstract: A receiver optical sub-assembly includes a multilayered ceramic substrate mounted on an electrically conductive base. The multilayered ceramic substrate has a ground layer on the front surface. A light receiving element is mounted on the front surface of the multilayered ceramic substrate. A cap and the electrically conductive base enclose the multilayered ceramic substrate and the light receiving element. An electrically conductive body connects the ground layer to the electrically conductive base. Terminals are attached to the back surface of the multilayered ceramic substrate. The terminals project outside the electrically conductive base. A high frequency noise propagates from the ground layer to the base through the electrically conductive body. A sufficient amount of ground potential is obtained. Self-resonance is prevented. The multilayered ceramic substrate enables an enhanced density of the terminals based on a wiring pattern or patterns and a via or vias.

Abstract translation: 接收器光学子组件包括安装在导电基底上的多层陶瓷衬底。 多层陶瓷基板在前表面具有接地层。 光接收元件安装在多层陶瓷基板的前表面上。 盖和导电基部包围多层陶瓷基板和光接收元件。 导电体将接地层连接到导电基底。 端子连接到多层陶瓷基板的背面。 端子在导电基座之外投射。 高频噪声通过导电体从接地层传播到基底。 获得足够的接地电位。 防止自谐振。 多层陶瓷基板能够基于布线图案或图案以及通孔或通孔提高端子的密度。

公开(公告)号：US07566957B2

公开(公告)日：2009-07-28

申请号：US11982279

申请日：2007-10-31

Applicant: Marco Amiotti

Inventor： Marco Amiotti

IPC: H01L23/20 ,  H01L21/00

CPC classification number: B81C1/00285 ,  C23C14/04 ,  C23C16/04 ,  G01J5/045 ,  H01L21/6835 ,  H01L23/26 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: The specification teaches a system for manufacturing microelectronic, microoptoelectronic or micromechanical devices (microdevices) in which a contaminant absorption layer improves the life and operation of the microdevice. In an embodiment, a system for manufacturing the devices includes efficiently integrating a getter material in multiple microdevices.

Abstract translation: 本说明书教导了一种用于制造微电子，微细胞电子学或微机械器件（微器件）的系统，其中污染物吸收层改善微器件的寿命和操作。 在一个实施例中，用于制造装置的系统包括将吸气剂材料有效地集成在多个微型装置中。

公开(公告)号：US20090050808A1

公开(公告)日：2009-02-26

申请号：US12264961

申请日：2008-11-05

Applicant: Yoshimitsu USHIMI ,  Naoko AIZAWA ,  Hiroyuki FUJINO ,  Hajime YAMADA

Inventor： Yoshimitsu USHIMI ,  Naoko AIZAWA ,  Hiroyuki FUJINO ,  Hajime YAMADA

IPC: G01J5/12

CPC classification number: G01J5/10 ,  G01J5/02 ,  G01J5/023 ,  G01J5/024 ,  G01J5/04 ,  G01J5/045 ,  G01J5/046 ,  G01J5/34 ,  H01L37/02

Abstract: An infrared sensor includes a first substrate made of a thermoelectric conversion material and a second substrate. The first substrate is supported by posts made of an electrode material while being spaced apart from the second substrate. A sensing electrode and lead portions connected thereto are provided on the first substrate. The sensing electrode and the lead portions are covered with an infrared-absorbing film. The posts are connected to the lead portions, and external terminal connection electrodes are connected to the posts.

Abstract translation: 红外线传感器包括由热电转换材料和第二基板制成的第一基板。 第一衬底由与电极材料制成的柱支撑，同时与第二衬底间隔开。 感测电极和与其连接的引线部分设置在第一基板上。 感测电极和引线部分被红外线吸收膜覆盖。 柱连接到引线部分，并且外部端子连接电极连接到柱。