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公开(公告)号:US20080055874A1
公开(公告)日:2008-03-06
申请号:US11572334
申请日:2005-08-30
申请人: Masanori Kawade , Hiroyuki Tsuruga , Makoto Ebina
发明人: Masanori Kawade , Hiroyuki Tsuruga , Makoto Ebina
IPC分类号: H01R9/00
CPC分类号: H01L24/81 , H01L23/49811 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15312 , H05K3/3426 , H05K2201/10318 , H05K2201/1084 , Y02P70/613 , H01L2224/05599
摘要: A semiconductor loading lead pin that does not tilt at a time of reflow. A void is sometimes left in solder between an electrode pad and the flange of a semiconductor loading lead pin. When reflow is carried out to load an IC chip, the solder for connection is melted and at the same time, the void in the solder is expanded. The solder escapes sideway along the groove portion, and thereby a flange is not raised by the void so that the semiconductor loading lead pin is not tilted.
摘要翻译: 半导体负载引脚,在回流时不倾斜。 在电极焊盘和半导体负载引脚的凸缘之间的焊料中有时留下空隙。 当进行回流以加载IC芯片时,用于连接的焊料熔化,并且同时焊料中的空隙膨胀。 焊料沿着槽部侧向逸出,由此凸缘不会被空隙升高,使得半导体负载引脚不倾斜。
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公开(公告)号:US07189083B2
公开(公告)日:2007-03-13
申请号:US10509200
申请日:2003-04-01
IPC分类号: H01R12/00
CPC分类号: B23K3/0607 , B23K3/0638 , B23K2101/40 , H01L2224/1302 , H01L2224/16105 , H01L2224/16155 , H01L2924/0002 , H05K3/3405 , H05K3/341 , H05K3/3426 , H05K2201/10371 , H05K2201/10386 , H05K2201/1084 , H05K2201/10984 , H05K2203/0195 , H05K2203/0405 , Y02P70/613 , H01L2924/00 , H01L2924/00012
摘要: A method of retaining a solder mass to a solder-bearing article is provided and includes the steps of: (a) forming a plurality of openings in the solder-bearing article; (b) disposing a length of solder mass over at least some of the plurality of openings; and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.
摘要翻译: 提供了将焊料块保持在焊料轴承制品上的方法,包括以下步骤:(a)在所述含锡制品中形成多个开口; (b)在所述多个开口中的至少一些开口处设置长度的焊料块; 以及沿焊料块的长度形成多个焊接铆钉。 焊接铆钉用于将焊料质量的长度保持在焊接轴承制品上。 焊接轴承制品包括任何数量的不同类型的组件,其中保持焊料块,例如引线,端子,连接器,电磁屏蔽等
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公开(公告)号:US20070054548A1
公开(公告)日:2007-03-08
申请号:US11504176
申请日:2006-08-15
申请人: Hiroshi Nakano
发明人: Hiroshi Nakano
IPC分类号: H01R13/60
CPC分类号: H05K3/341 , H01R12/707 , H05K2201/10189 , H05K2201/10772 , H05K2201/1084 , H05K2201/10969 , Y02P70/613
摘要: A circuit board connector (1) has a housing (10), male terminals (20) and fixing members (30). Each fixing member (30) is formed by bending a metal plate into an L-shape to define a mounting portion (31) to mount the fixing member (30) to the housing (10), and a bonding portion (32) to be soldered. The bonding portion (32) is formed with connecting pieces (33) by making U-shaped cuts through the bonding portion (32) and then bending areas enclosed by the cuts upward. A clearance (S) is defined between the bottom edge of the leading end of each connecting piece (33) and the corresponding through hole (34). The lower surfaces of the connecting pieces (33) and the inner surfaces of the through holes (34) can be soldered.
摘要翻译: 电路板连接器(1)具有壳体(10),阳端子(20)和固定构件(30)。 每个固定构件(30)通过将金属板弯曲成L形而形成以将固定构件(30)安装到壳体(10)的安装部分(31)和形成为 焊接。 通过在接合部分(32)上形成U形切口,然后由向上切割的弯曲区域形成接合部分(32)。 在每个连接件(33)的前端的底部边缘和相应的通孔(34)之间限定有间隙(S)。 连接片(33)的下表面和通孔(34)的内表面可被焊接。
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公开(公告)号:US07070418B1
公开(公告)日:2006-07-04
申请号:US11138982
申请日:2005-05-26
申请人: Tiger Wang
发明人: Tiger Wang
IPC分类号: H01R12/00
CPC分类号: H01R4/182 , F21K9/00 , F21V19/0025 , F21Y2115/10 , H01R12/58 , H05K3/202 , H05K3/326 , H05K2201/0382 , H05K2201/0397 , H05K2201/10106 , H05K2201/10651 , H05K2201/10818 , H05K2201/1084
摘要: A light emitting diode (LED) assembly has a printed circuit board, multiple conductors and multiple light emitting diodes (LEDs). The printed circuit board has multiple mounting holes. The conductors are mounted on the PCB and serve respectively as positive electrode conductors and negative electrode conductors. Each conductor has a contact pin and at least one through hole with an inner edge. Each LED is mounted on the positive electrode conductor and the negative electrode conductor and has a die and two contact tabs. Each contact tab has a through hole having an inner edge and multiple hooks extending from the inner edge of the through hole in the contact tab and hooking the inner edge of the at least one through hole in the conductor. Consequently, neither solder nor welding is required to assemble the LED assembly.
摘要翻译: 发光二极管(LED)组件具有印刷电路板,多个导体和多个发光二极管(LED)。 印刷电路板有多个安装孔。 导体安装在PCB上,分别用作正极导体和负极导体。 每个导体具有接触销和至少一个具有内边缘的通孔。 每个LED安装在正极导体和负极导体上,并具有一个模具和两个接触片。 每个接触片具有一个通孔,该通孔具有一个内边缘和多个钩子,它们从接触片中的通孔的内边缘延伸出来并钩住导体中至少一个通孔的内边缘。 因此,组装LED组件不需要焊料或焊接。
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45.
公开(公告)号:US20060057902A1
公开(公告)日:2006-03-16
申请号:US10509200
申请日:2003-04-01
IPC分类号: H01R4/02
CPC分类号: B23K3/0607 , B23K3/0638 , B23K2101/40 , H01L2224/1302 , H01L2224/16105 , H01L2224/16155 , H01L2924/0002 , H05K3/3405 , H05K3/341 , H05K3/3426 , H05K2201/10371 , H05K2201/10386 , H05K2201/1084 , H05K2201/10984 , H05K2203/0195 , H05K2203/0405 , Y02P70/613 , H01L2924/00 , H01L2924/00012
摘要: A method of retaining a solder mass to a solder-bearing article is provided and includes the steps of: (a) forming a plurality of openings in the solder-bearing article; (b) disposing a length of solder mass over at least some of the plurality of openings; and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.
摘要翻译: 提供了将焊料块保持在焊料轴承制品上的方法,包括以下步骤:(a)在所述含锡制品中形成多个开口; (b)在所述多个开口中的至少一些开口处设置长度的焊料块; 以及沿焊料块的长度形成多个焊接铆钉。 焊接铆钉用于将焊料质量的长度保持在焊接轴承制品上。 焊接轴承制品包括任何数量的不同类型的组件,其中保持焊料块,例如引线,端子,连接器,电磁屏蔽等
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46.
公开(公告)号:US20060016071A1
公开(公告)日:2006-01-26
申请号:US10898191
申请日:2004-07-26
申请人: Huang-Chou Huang
发明人: Huang-Chou Huang
IPC分类号: H01K3/10
CPC分类号: H05K3/3426 , H05K2201/1084 , H05K2201/10984 , H05K2203/041 , Y02P70/613 , Y10T29/49165
摘要: A method for attaching an IC socket connector to a circuit board has acts of fabricating IC socket connectors, installing the IC socket connectors in an IC socket, preparing the IC socket connectors for attachment to a circuit board and attaching the IC socket connector to the circuit board. The IC socket connectors are U-shaped, are punched from a metal sheet, have a closed bottom and are electroplated with a protective nickel coating. After installing the IC socket connectors in an IC socket, a recess is formed in the closed bottom of each IC socket connector in any shape. Solder balls are attached respectively to the recesses in the bottoms of the IC socket connectors. The IC socket connectors are attached to the circuit board by melting the solder ball.
摘要翻译: 将IC插座连接器连接到电路板的方法具有制造IC插座连接器,将IC插座连接器安装在IC插座中的功能,准备用于连接到电路板的IC插座连接器并将IC插座连接器连接到电路 板。 IC插座连接器是U形的,从金属片冲压,具有封闭的底部并且用保护性镍涂层电镀。 将IC插座连接器安装在IC插座中后,在每个IC插座连接器的封闭底部形成任何形状的凹槽。 焊球分别连接到IC插座连接器底部的凹槽中。 通过熔化焊球将IC插座连接器连接到电路板。
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公开(公告)号:US20050191880A1
公开(公告)日:2005-09-01
申请号:US10787747
申请日:2004-02-27
申请人: Po-Hsiung Lin
发明人: Po-Hsiung Lin
CPC分类号: H01R12/7029 , H01R43/0263 , H05K3/3426 , H05K2201/10189 , H05K2201/1084 , H05K2201/10984 , Y02P70/613
摘要: The electronic card connector of the present invention comprises an isolation chassis and a pair of metallic arms. The isolation chassis is made of an insulation material. The isolation chassis comprises a plurality of conductive terminals. A metallic arm is respectively fixed onto each of two ends of the isolation chassis. Each of the metallic arms extends downwardly and has a grounding portion and a welding portion for welding securely to the circuit board. Before attaching the electronic card connector to the circuit board, the welding portion of the metallic arm, which has a low melting point conductive metal, reduces the vertical height on the circuit board, when it gets liquefied due to heat in the convection reflow oven, and thus the connecting point on the circuit board and the welding portion of the metallic arm are electrically connected through the solder.
摘要翻译: 本发明的电子卡连接器包括隔离底盘和一对金属臂。 隔离底盘由绝缘材料制成。 隔离底盘包括多个导电端子。 金属臂分别固定在隔离底盘的两端。 每个金属臂向下延伸并具有接地部分和用于牢固地焊接到电路板的焊接部分。 在将电子卡连接器附接到电路板之前,具有低熔点导电金属的金属臂的焊接部分在对流回流炉中由于热量而液化时降低了电路板上的垂直高度, 因此电路板上的连接点和金属臂的焊接部分通过焊料电连接。
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公开(公告)号:US20050079745A1
公开(公告)日:2005-04-14
申请号:US11000889
申请日:2004-12-02
申请人: Ted Ju
发明人: Ted Ju
CPC分类号: H01R4/028 , H01R12/57 , H05K3/3426 , H05K2201/10189 , H05K2201/1084 , H05K2203/046 , Y02P70/613
摘要: A socket connector is bonded to a circuit board by solder materials. The solder materials are well arranged so that no short circuits occur. The socket connector can be applied in a wide range of uses with high yield and reduced cost. The socket connector has an insulative housing having a plurality of terminals and a solder material therein. The socket connector is characterized by the insulative housing being provided with a plurality of overflow holes in a direction along which the insulative housing and terminals apply pressure to the solder material.
摘要翻译: 插座连接器通过焊料粘合到电路板上。 焊料材料布置良好,不会发生短路。 插座连接器可以广泛应用于高产量和低成本。 插座连接器具有绝缘壳体,其中具有多个端子和焊料材料。 插座连接器的特征在于,绝缘壳体沿着绝缘壳体和端子对焊料材料施加压力的方向设置有多个溢流孔。
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公开(公告)号:US20050059276A1
公开(公告)日:2005-03-17
申请号:US10940133
申请日:2004-09-13
申请人: Gen-Sheng Lee , Ming-Lun Szu
发明人: Gen-Sheng Lee , Ming-Lun Szu
CPC分类号: H01R43/0235 , H05K3/3426 , H05K2201/10189 , H05K2201/1084 , H05K2201/10984 , H05K2203/041 , Y02P70/613
摘要: An electrical connector includes an electrically insulative housing having a plurality of passageways and an identical number of contacts. Each contact has an solder portion connected with a solder ball. The solder portion has at least two solder faces which are perpendicular from each other. The solder faces are partly engaged into the solder ball and soldered with the solder ball.
摘要翻译: 电连接器包括具有多个通道和相同数量的触点的电绝缘壳体。 每个触点具有与焊球连接的焊接部分。 焊料部分具有彼此垂直的至少两个焊接面。 焊接面部分地接合到焊球中并与焊球焊接。
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公开(公告)号:US20050030762A1
公开(公告)日:2005-02-10
申请号:US10911643
申请日:2004-08-05
申请人: Hideaki Kato , Kanae Matsumura , Shunsuke Ohtsuka
发明人: Hideaki Kato , Kanae Matsumura , Shunsuke Ohtsuka
IPC分类号: H01L23/12 , H01L25/075 , H01L33/48 , H05K3/34 , B60Q1/00
CPC分类号: H05K3/3442 , H01L25/0753 , H01L2224/48091 , H01L2224/48227 , H05K2201/10106 , H05K2201/1084 , H05K2201/10931 , Y02P70/613 , H01L2924/00014
摘要: A notch portion 7A is disposed on a formation surface of a wiring pattern 7 and is located in a contact point with a wiring pattern 9 of an outside substrate 8, so that a solder 9a melted by reflow soldering slowly flows up along an edge of the notch portion 7A, improving a solder-joint performance. The notch portion 7A is formed in a recess shape as formed by cutting away the substrate 6 and as a result, the melted solder stays in the recess portion, which prevents the melted solder from moving up over the notch portion 7A.
摘要翻译: 切口部7A设置在布线图案7的形成面上,与外部基板8的布线图案9的接触点配置,使得通过回流焊接而熔化的焊料9a缓慢地沿着 切口部7A,提高焊接性能。 切口部7A形成为通过切除基板6而形成的凹部形状,结果,熔融的焊料滞留在凹部中,防止熔融的焊料向上移动到切口部7A上方。
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