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公开(公告)号:US12104984B2
公开(公告)日:2024-10-01
申请号:US17751686
申请日:2022-05-24
申请人: Tsinghua University
发明人: Fei Guo , Qiyao Chen , Chong Xiang , Yijie Huang , Ganlin Cheng , Fan Zhang , Xiaohong Jia
CPC分类号: G01M3/2876 , G01M3/36
摘要: Embodiments of the present disclosure belong to the field of valve sealing, and in particular, relate to a test device for simulating sealing performance of a one-way valve. A box is provided with a gas inlet pipe and a gas outlet pipe, the gas inlet pipe is communicated with a gas source, a detection device is communicated with the gas outlet pipe, the detection device is used to detect detection gas input into the box by the gas source, a sleeve is connected to the gas inlet pipe, one end of the sleeve is communicated with the gas source, the other end of the sleeve has a gas outlet, one end of a fitting piece is used to block the gas outlet, and the other end of the fitting piece is connected to a driving member, which is used to drive the fitting piece to move and rotate.
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公开(公告)号:US12104489B2
公开(公告)日:2024-10-01
申请号:US17619784
申请日:2020-02-10
发明人: Raja Vikram Raj Pandya , Srinath Madasu , Keshava Prasad Rangarajan , Shashi Dande , Yashas Malur Saidutta
摘要: Geosteering can be used in a drilling operation to create a wellbore that is used to extract hydrocarbons from a defined zone within the subterranean formation. According to some aspects, generating paths for the wellbore may include using path-planning protocols and pure-pursuit protocols. The pure-pursuit protocol may be executed to output a plurality of candidate drilling paths. The output may also include control parameters for controlling the drill bit. A trajectory optimizer may determine a result of multi-objective functions for each candidate path. A cost function may represent a cost or loss associated with a candidate path. Additionally, the trajectory optimizer may perform an optimization protocol, such as Bayesian optimization, on the cost functions to determine which candidate path to select. The selected candidate path may correspond to new control parameters for controlling the drill bit to reach the target location.
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公开(公告)号:US12104178B2
公开(公告)日:2024-10-01
申请号:US17646212
申请日:2021-12-28
发明人: Vipin Suri , Dan Jun Li , Dexue Sun , Byron Delabarre , Vijaya Balakrishnan , Brian Dolinski , Mara Christine Inniss , Grace Y. Olinger
IPC分类号: A61K35/17 , C07K14/54 , C07K14/705 , C07K14/715 , C12N9/06 , C12N15/85 , C12N15/86
CPC分类号: C12N9/003 , A61K35/17 , C07K14/5434 , C07K14/5443 , C07K14/70503 , C07K14/7155 , C12N15/85 , C12Y105/01003 , C07K2319/30 , C07K2319/33
摘要: The present invention is related to compositions and methods for the regulated and controlled expression of proteins.
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公开(公告)号:US12103996B2
公开(公告)日:2024-10-01
申请号:US16867023
申请日:2020-05-05
申请人: Fluidigm Canada Inc.
发明人: Mitchell A. Winnik , Mark Nitz , Vladimir Baranov , Xudong Lou
IPC分类号: G01N33/532 , C08F8/14 , C08F8/32 , C08F8/42 , C08F220/36 , C08F220/56 , G01N33/574 , G01N33/58
CPC分类号: C08F220/36 , C08F8/14 , C08F8/32 , C08F8/42 , C08F220/56 , G01N33/532 , G01N33/57426 , G01N33/58 , Y10T436/24
摘要: Element tags based on novel metal-polymer conjugates are provided for elemental analysis of analytes, including ICP-MS. A polymer backbone is functionalized to irreversibly bind metals that are selected prior to use by the user. The polymer is further functionalized to attach a linker which allows for attachment to antibodies or other affinity reagents. The polymer format allows attachment of many copies of a given isotope, which linearly improves sensitivity. The metal-polymer conjugate tags enable multiplexed assay in two formats: bulk assay, where the average biomarker distribution in the sample is diagnostic, and single cell format to distinguish a rare (for example a diseased) cell in a complex sample (for example, blood).
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公开(公告)号:US12103958B2
公开(公告)日:2024-10-01
申请号:US17035327
申请日:2020-09-28
发明人: Natasha Kay Crellin , Lauren Kate Ely , Jason Robles Reyes , Chia Chi Ho , Jeffrey A. Bluestone , Eleonora Trotta , Qizhi Tang
IPC分类号: C07K14/705 , A61K39/00 , C12N15/63 , G01N33/50 , G01N33/68
CPC分类号: C07K14/70528 , A61K39/001129 , C12N15/63 , G01N33/505 , G01N33/68 , C07K2319/30 , G01N2333/70507
摘要: The invention provides LFA3 polypeptide molecules, e.g., variant LFA3 fusion polypeptide molecules. The invention includes uses, and associated methods of using the LFA3 polypeptide molecules.
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公开(公告)号:US12103490B2
公开(公告)日:2024-10-01
申请号:US17999597
申请日:2021-05-21
申请人: Stabilus GmbH
发明人: Lars Löhken , Raphael Piroth , Markus Müller , Ulrich Probst , Marcus Weber
IPC分类号: B60R22/28
CPC分类号: B60R22/28 , B60R2022/282 , B60R2022/288
摘要: A self-regulating damper unit comprising a cylinder having a first working chamber and a second working chamber, a piston, a piston rod, and a through-hole between the first working chamber and the second working chamber. The damper unit also comprises a shiftable weight which modifies a passage cross-section of the through-hole. The shiftable weight is movably mounted such that retardation of the piston causes enlargement of the passage cross-section. A seat belt unit comprises a seat belt and the damper unit.
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公开(公告)号:US12101924B2
公开(公告)日:2024-09-24
申请号:US17671019
申请日:2022-02-14
发明人: Deyuan Xiao
IPC分类号: H01L21/00 , H01L29/66 , H01L29/786 , H10B12/00
CPC分类号: H10B12/09 , H01L29/66742 , H01L29/78642 , H10B12/0335 , H10B12/05 , H10B12/315 , H10B12/482 , H10B12/50
摘要: A semiconductor structure and a method for manufacturing same. The semiconductor structure includes: a semiconductor base, including a logical device region and a memory region; a bit line located in the memory region and an electrical contact layer located in the logical device region, which are disposed in a same layer; a first semiconductor channel located on the bit line and a second semiconductor channel located on the electrical contact layer, which are disposed in a same layer; a word line and a gate disposed in a same layer; a capacitor structure, in contact with a second doped region of the first semiconductor channel; an electrical connection structure, in contact with the fourth doped region of the second semiconductor channel; and a dielectric layer, located between the bit line and the word line, and on a side of the word line away from the semiconductor base.
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公开(公告)号:US12101222B2
公开(公告)日:2024-09-24
申请号:US18104569
申请日:2023-02-01
IPC分类号: H04L41/0806 , H04L12/46 , H04L43/50 , H04L45/42 , H04L45/76
CPC分类号: H04L41/0806 , H04L12/4633 , H04L43/50 , H04L45/42 , H04L45/76 , H04L12/4641
摘要: Techniques are described for creating a network-link between a first virtual network in a first cloud environment and a second virtual network in a second cloud environment. The first virtual network in the first cloud environment is created to enable a user associated with a customer tenancy in the second cloud environment to access one or more services provided in the first cloud environment. The network-link is created based on one or more link-enabling virtual networks being deployed in the first cloud environment and the second cloud environment.
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公开(公告)号:US12100755B2
公开(公告)日:2024-09-24
申请号:US17400076
申请日:2021-08-11
发明人: Ching-Hua Lee , Miao-Syuan Fan , Ta-Hsiang Kung , Jung-Wei Lee
IPC分类号: H01L29/00 , H01L21/02 , H01L29/06 , H01L29/16 , H01L29/24 , H01L29/423 , H01L29/66 , H01L29/76 , H01L29/786
CPC分类号: H01L29/7606 , H01L21/02568 , H01L21/0259 , H01L29/0665 , H01L29/0673 , H01L29/1606 , H01L29/24 , H01L29/42392 , H01L29/66969 , H01L29/78696
摘要: A semiconductor device includes a substrate, a semiconductor structure suspending over the substrate and comprising a source region, a drain region, and a channel region disposed between the source region and the drain region. The channel region includes a doped two-dimensional (2D) material layer comprising a first portion on an upper surface of the channel region. The semiconductor device also includes an interfacial layer surrounding the channel region including the first portion of the doped 2D material layer, and a gate electrode surrounding the interfacial layer.
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公开(公告)号:US12100670B2
公开(公告)日:2024-09-24
申请号:US17582147
申请日:2022-01-24
发明人: Mengmeng Wang , Hsin-Pin Huang , Qiang Zhang
IPC分类号: H01L23/522 , H01L21/764 , H01L21/768 , H01L23/00 , H01L23/528
CPC分类号: H01L23/562 , H01L21/764 , H01L21/76877 , H01L23/5226 , H01L23/5283
摘要: The disclosure provides a method for manufacturing a semiconductor structure and the semiconductor structure. The method for manufacturing the semiconductor structure comprises: a substrate, in which a first protective structure is formed, is provided; a first dielectric layer is formed on the substrate; and a second protective structure is formed in the first dielectric layer and the substrate. A projection of the second protective structure and a projection of the first protective structure in a direction perpendicular to a surface of the substrate are at least partially overlapped, and there is a spacing between a projection of the second protective structure and a projection of the first protective structure in a direction along the surface of the substrate.
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