COMMON-SUBSTRATE SEMICONDUCTOR DEVICES HAVING NANOWIRES OR SEMICONDUCTOR BODIES WITH DIFFERING MATERIAL ORIENTATION OR COMPOSITION
    51.
    发明申请
    COMMON-SUBSTRATE SEMICONDUCTOR DEVICES HAVING NANOWIRES OR SEMICONDUCTOR BODIES WITH DIFFERING MATERIAL ORIENTATION OR COMPOSITION 有权
    具有不同材料取向或组成的纳米线或半导体器件的共面衬底半导体器件

    公开(公告)号:US20130320294A1

    公开(公告)日:2013-12-05

    申请号:US13996506

    申请日:2011-12-23

    IPC分类号: H01L29/04

    摘要: Common-substrate semiconductor devices having nanowires or semiconductor bodies with differing material orientation or composition and methods to form such common-substrate devices are described. For example, a semiconductor structure includes a first semiconductor device having a first nanowire or semiconductor body disposed above a crystalline substrate. The first nanowire or semiconductor body is composed of a semiconductor material having a first global crystal orientation. The semiconductor structure also includes a second semiconductor device having a second nanowire or semiconductor body disposed above the crystalline substrate. The second nanowire or semiconductor body is composed of a semiconductor material having a second global crystal orientation different from the first global orientation. The second nanowire or semiconductor body is isolated from the crystalline substrate by an isolation pedestal disposed between the second nanowire or semiconductor body and the crystalline substrate.

    摘要翻译: 描述具有不同材料取向或组成的纳米线或半导体主体的共基板半导体器件以及形成这种共基板器件的方法。 例如,半导体结构包括具有设置在结晶衬底之上的第一纳米线或半导体本体的第一半导体器件。 第一纳米线或半导体主体由具有第一全局晶体取向的半导体材料组成。 半导体结构还包括具有设置在晶体衬底上方的第二纳米线或半导体本体的第二半导体器件。 第二纳米线或半导体本体由具有与第一全局取向不同的第二全局晶体取向的半导体材料组成。 通过设置在第二纳米线或半导体本体与晶体衬底之间的隔离基座将第二纳米线或半导体本体与晶体衬底隔离。

    ISOLATED AND BULK SEMICONDUCTOR DEVICES FORMED ON A SAME BULK SUBSTRATE
    55.
    发明申请
    ISOLATED AND BULK SEMICONDUCTOR DEVICES FORMED ON A SAME BULK SUBSTRATE 审中-公开
    在相同的大块基板上形成的隔离和大块半导体器件

    公开(公告)号:US20160336219A1

    公开(公告)日:2016-11-17

    申请号:US15219138

    申请日:2016-07-25

    摘要: Isolated and bulk semiconductor devices formed on a same bulk substrate and methods to form such devices are described. For example, a semiconductor structure includes a first semiconductor device having a first semiconductor body disposed on a bulk substrate. The first semiconductor body has an uppermost surface with a first horizontal plane. The semiconductor structure also includes a second semiconductor device having a second semiconductor body disposed on an isolation pedestal. The isolation pedestal is disposed on the bulk substrate. The second semiconductor body has an uppermost surface with a second horizontal plane. The first and second horizontal planes are co-planar.

    摘要翻译: 描述了形成在相同体积基板上的隔离和体半导体器件以及形成这种器件的方法。 例如,半导体结构包括具有设置在体基板上的第一半导体本体的第一半导体器件。 第一半导体本体具有带有第一水平面的最上表面。 半导体结构还包括具有设置在隔离基座上的第二半导体本体的第二半导体器件。 隔离基座设置在主体基板上。 第二半导体本体具有带有第二水平面的最上表面。 第一和第二水平面是共面的。

    MOLDED DIELECTRIC NANOSTRUCTURE
    58.
    发明申请
    MOLDED DIELECTRIC NANOSTRUCTURE 有权
    模制电介质纳米结构

    公开(公告)号:US20150179786A1

    公开(公告)日:2015-06-25

    申请号:US14138254

    申请日:2013-12-23

    摘要: An embodiment concerns selective etching of a structure (e.g., a fin) to form a void with the shape of the original structure. This void then functions as a mold. Flowable dielectric material fills the void to form the same shape as the original structure/mold. Post-processing then occurs (e.g., oxidation build up and annealing) to harden the dielectric in the void. The resulting product is a molded dielectric nanostructure that has the same shape as the original structure but consists of a different material (e.g., dielectric instead of silicon). Other embodiments are described herein.

    摘要翻译: 实施例涉及对结构(例如,翅片)的选择性蚀刻以形成具有原始结构形状的空隙。 该空隙然后用作模具。 可流动介电材料填充空隙以形成与原始结构/模具相同的形状。 然后发生后处理(例如,氧化堆积和退火)以使空隙中的电介质硬化。 所得到的产品是模制的电介质纳米结构,其具有与原始结构相同的形状,但由不同的材料(例如电介质代替硅)构成。 本文描述了其它实施例。