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59 条记录 (耗时 0.027 秒)

    Method for Making Contact with a Component Embedded in a Printed Circuit Board
    54.
    发明申请
    Method for Making Contact with a Component Embedded in a Printed Circuit Board 审中-公开

    公开(公告)号：US20190082543A1

    公开(公告)日：2019-03-14

    申请号：US16184470

    申请日：2018-11-08

    申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

    发明人： Gerald Weidinger ,  Andreas Zluc ,  Johannes Stahr

    IPC分类号： H05K3/46 ,  H05K1/18 ,  H05K1/11 ,  H05K3/32 ,  H05K3/06

    摘要： The invention pertains to a method for the bonding of a component embedded into a printed circuit board exhibiting the following steps:Provision of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer,Embedding of at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer,Application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component,Clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist,by application of a semi-additive process, deposition of a layer of conductor material onto the cleared end faces of the contacts and the cleared areas of the conductor layer and formation of a conductor pattern on at least the one outer surface of the core on which the component is arranged, as well as the interconnecting paths between the contacts and the conductor pattern, andRemoval of the areas of the conductor layer not belonging to the conductor pattern.

    Method for Embedding a Component in a Printed Circuit Board
    56.
    发明申请
    Method for Embedding a Component in a Printed Circuit Board 审中-公开
    在印刷电路板中嵌入元件的方法

    公开(公告)号：US20160324004A1

    公开(公告)日：2016-11-03

    申请号：US15103826

    申请日：2014-12-12

    申请人： AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

    发明人： Timo Schwarz ,  Andreas Zluc ,  Gregor Langer ,  Johannes Stahr

    IPC分类号： H05K1/18 ,  H05K3/46 ,  H05K3/30

    摘要： A method for embedding a component in a printed circuit board or a printed circuit board intermediate product, wherein the printed circuit board or the printed circuit board intermediate product comprises at least one insulating layer made of a prepreg material, and the component is fixed by the resin of the prepreg material, is characterized by the following steps: providing a combination of the layers of the printed circuit board, or of the printed circuit board intermediate product, wherein this combination includes at least one curable prepreg material; creating a clearance in the combination for accommodating the component to be embedded; covering at least the region of the clearance with a first temporary carrier layer on a first side of the combination; positioning the component to be embedded in the clearance by way of the first temporary carrier layer; covering at least the region of the clearance on the second side of the combination with a second temporary carrier layer; compressing the combination with the component, curing the curable prepreg material; and removing the temporary carrier layers.

    Semi-finished Product for the Production of a Printed Circuit Board and Method for Producing the Same
    57.
    发明申请
    Semi-finished Product for the Production of a Printed Circuit Board and Method for Producing the Same 有权
    制造印刷电路板的半成品及其制造方法

    公开(公告)号：US20160021763A1

    公开(公告)日：2016-01-21

    申请号：US14771182

    申请日：2014-02-27

    申请人： AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

    发明人： Johannes Stahr ,  Mikael Tuominen

    IPC分类号： H05K3/46 ,  H05K3/30 ,  H05K1/18

    CPC分类号： H05K3/4611 ,  H05K1/185 ,  H05K1/188 ,  H05K3/30 ,  H05K3/323 ,  H05K3/46 ,  H05K2201/032 ,  H05K2203/063 ,  H05K2203/068

    摘要： In a semi-finished product for the production of a printed circuit board, the semi-finished product comprising a plurality of having multiple insulating layers of a prepreg material and conductive layers (2, 2′) of a conductive material and further comprising having at least one electronic component embedded in at least one insulating layer the at least one electronic component is attached to a corresponding conductive layer by the aid of an Anisotropic Conductive Film and the Anisotropic Conductive Film as well as the prepreg material are in an unprocessed state. The method for producing a printed circuit board comprises the following steps: Providing at least one conductive layer (2), Applying an Anisotropic Conductive Film on the conductive layer, Affixing at least one electronic component on the Anisotropic Conductive Film, Embedding the electronic component in at least one insulating layer of prepreg material to obtain a semi-finished product, Laminating the semi-finished product to process the prepreg material and the Anisotropic Conductive Film.

    摘要翻译： 在用于生产印刷电路板的半成品中，半成品包括多个具有预浸料材料的多个绝缘层和导电材料的导电层（2,2'）的多个，并且还包括： 至少一个电子部件嵌入到至少一个绝缘层中，所述至少一个电子部件借助于各向异性导电膜和各向异性导电膜以及预浸料材料被附着到相应的导电层上，处于未处理状态。 制造印刷电路板的方法包括以下步骤：提供至少一个导电层（2），在导电层上施加各向异性导电膜，在各向异性导电膜上粘贴至少一个电子元件，将电子元件嵌入 至少一层预浸料材料的绝缘层，以获得半成品，对半成品进行层压以加工预浸料材料和各向异性导电膜。

    METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION PREVENTION MATERIAL AND MULTILAYER PRINTED CIRCUIT BOARD AND USE OF SUCH A METHOD
    58.
    发明申请
    METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION PREVENTION MATERIAL AND MULTILAYER PRINTED CIRCUIT BOARD AND USE OF SUCH A METHOD 审中-公开
    生产多层印刷电路板的方法，粘合防止材料和多层印刷电路板以及这种方法的使用

    公开(公告)号：US20140216795A1

    公开(公告)日：2014-08-07

    申请号：US14203728

    申请日：2014-03-11

    申请人： AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

    发明人： Günther Weichslberger ,  Johannes Stahr ,  Markus Leitgeb ,  Andreas Zluc ,  Gerald Weidinger

    IPC分类号： H05K3/46 ,  H05K1/02

    CPC分类号： H05K3/4688 ,  H05K1/0298 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4691 ,  H05K3/4697 ,  H05K2201/09127 ,  Y10T29/49124 ,  Y10T156/1066 ,  Y10T156/1195

    摘要： In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region (11) thereof is removed, and wherein in order to prevent adherence of the partial region (11) to be removed a material (8) preventing adhesion is applied in accordance with the partial region to be removed onto a layer (9) which adjoins the partial region to be removed, it is provided that the material (8) preventing adhesion is formed by a mixture comprising a release agent on the basis of at least one metal soap, preferably the fatty acid salts of Al, Mg, Ca, Na and Zn, a binding agent, and a solvent, whereby a partial region to be removed can be removed easily and reliably after appropriate treatment and/or processing steps of the multilayer printed circuit board. In addition, an adhesion prevention material and a use of the method in connection with the production of a multilayer printed circuit board (1) are provided.

    摘要翻译： 在多层印刷电路板的制造方法中，多层印刷电路板由多个导电或不导电或不导电或绝缘层或层组成，以彼此连接，特别是被压在一起，其中至少部分平面的层至少连接 去除其部分区域（11），并且其中为了防止待除去的部分区域（11）的粘附，根据待除去的部分区域（9）施加防止粘附的材料（8）（9） ），其邻接待移除的部分区域，条件是防止粘附的材料（8）由包含基于至少一种金属皂的脱模剂的混合物形成，优选由Al，Mg的脂肪酸盐， Ca，Na和Zn，粘合剂和溶剂，由此在多层印刷电路板的适当处理和/或加工步骤之后，可以容易且可靠地除去待除去的部分区域。 另外，提供了一种防粘连材料和与制造多层印刷电路板（1）相关的方法的使用。

    NONSTICK MATERIAL, METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYER STRUCTURE AND USE THEREFOR
    59.
    发明申请
    NONSTICK MATERIAL, METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYER STRUCTURE AND USE THEREFOR 审中-公开
    非磁性材料，移除平面材料层的一部分和多层结构的方法及其使用

    公开(公告)号：US20130149506A1

    公开(公告)日：2013-06-13

    申请号：US13759645

    申请日：2013-02-05

    申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

    发明人： Gerald Weidinger ,  Gunther Weichslberger ,  Markus Leitgeb ,  Johannes Stahr

    IPC分类号： C08L91/06

    CPC分类号： B32B37/26 ,  C08L91/06 ,  H05K1/183 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  Y10T156/1064 ,  Y10T156/1153 ,  Y10T156/1195 ,  Y10T428/24802 ,  Y10T428/265

    摘要： The invention relates to a nonstick material for use during removal of a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least on further, substantially planar material layer (9). According to the invention, the nonstick material (8) has a different polarity than the adjoining, substantially planar material layers (2, 9). The invention also relates to a method for removing a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least one further, substantially planar material layer (9), to a multilayer structure which consists of at least two substantially planar material layers (2, 9) to be interconnected, and to a use of the same, especially in a multilayer printed circuit board.

    摘要翻译： 本发明涉及一种不粘材料，用于在移除基本平坦的材料层（2）的部分（11）时使用，所述部分（11）在连接步骤中至少在至少另外基本平坦的材料层（9）上连接。 根据本发明，不粘材料（8）具有与相邻的基本平坦的材料层（2,9）不同的极性。 本发明还涉及一种用于去除基本平坦的材料层（2）的部分（11）的方法，所述部分（11）在连接步骤中连接到至少一个其它基本平坦的材料层（9）上，所述多层结构包括 至少两个基本平坦的材料层（2,9）要互连，并且使用该材料层，特别是在多层印刷电路板中。