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公开(公告)号：US12112888B2
公开(公告)日：2024-10-08
申请号：US17650388
申请日：2022-02-09
CPC分类号： H01F7/0242 , H01F41/0253
摘要： A drive device includes a component carrier with a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and a cavity formed in the stack. A driven body is arranged at least partially in the cavity and configured for being drivable to move relative to the component carrier. At least one drive coil for creating a magnetic drive field and at least one drive magnet interacts with the magnetic drive field created by the at least one drive coil to generate a force for moving the driven body relative to the component carrier. One of the at least one drive magnet and the at least one drive coil forms part of the component carrier and the other one of the at least one drive magnet and the at least one drive coil forms part of the driven body.
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公开(公告)号：US20240114656A1
公开(公告)日：2024-04-04
申请号：US18537287
申请日：2023-12-12
发明人： Gerald Weis
IPC分类号： H05K7/20
CPC分类号： H05K7/20272 , H05K7/20263 , H05K7/20927 , H05K7/20145
摘要： An electronic device includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an electronic component on and/or in the stack, and a cooling member with a fluid cooling unit at least partially therein. The component carrier and the cooling member are connected by a connection structure. The connection structure comprises thermal interface material which contributes to a heat removal from the electronic component to the cooling unit.
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公开(公告)号：US11937379B2
公开(公告)日：2024-03-19
申请号：US17301130
申请日：2021-03-25
发明人： Jolanta Klocek
IPC分类号： H05K3/06
摘要： A method of etching an electrically conductive layer structure during manufacturing a component carrier is provided. The method includes subjecting the electrically conductive layer structure to an etching composition having an etchant and a photosensitive compound to thereby form a recess in the electrically conductive layer structure; while, at least for a part of time, irradiating and/or heating the recess. In addition, an apparatus for etching an electrically conductive layer structure during manufacturing a component carrier, an etched electrically conductive layer structure and a component carrier are provided.
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公开(公告)号：US11889629B2
公开(公告)日：2024-01-30
申请号：US15929349
申请日：2020-04-28
发明人： Gerald Weidinger , Gerald Weis , Ivan Salkovic , Karl Kirchheimer
CPC分类号： H05K1/185 , H01F27/24 , H01F27/2804 , H01F41/041 , H05K1/181 , H05K3/4644 , H01F2027/2809 , H01F2027/2819 , H05K2201/1003
摘要： A component carrier includes a base material stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a magnet stack with a plurality of magnetic layers and at least one bonding layer, each of the at least one bonding layer bonding two respectively neighboured magnetic layers, wherein the magnet stack is embedded in the base material stack.
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公开(公告)号：US11778754B2
公开(公告)日：2023-10-03
申请号：US16777116
申请日：2020-01-30
发明人： Robin Zhang , Seok Kim Tay
CPC分类号： H05K3/429 , H05K1/115 , H05K1/186 , H05K3/423 , H05K2201/0959 , H05K2201/09827 , H05K2203/1572
摘要： A component carrier includes an electrically insulating layer structure with a first main surface and a second main surface, a through hole extends through the electrically insulating layer structure between the first main surface and the second main surface. The through hole has a first tapering portion extending from the first main surface and a second tapering portion extending from the second main surface. The through hole is delimited by a first plating structure on at least part of the sidewalls of the electrically insulating layer structure and a second plating structure formed separately from and arranged on the first plating structure. The second plating structure includes an electrically conductive bridge structure connecting the opposing sidewalls.
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公开(公告)号：US11778751B2
公开(公告)日：2023-10-03
申请号：US17247151
申请日：2020-12-01
发明人： Abderrazzaq Ifis , Markus Leitgeb
CPC分类号： H05K3/303 , G06T7/0006 , H05K3/4638 , G06T2207/30141 , H05K2203/166
摘要： A method of compensating misalignment during manufacturing laminate-type component carriers is disclosed. The method includes detecting an image of a region of interest of a component carrier structure during manufacturing the component carriers based on the component carrier structure, identifying a structural feature in the image of the region of interest showing misalignment with respect to a target design, and at least partially compensating the identified misalignment of the structural feature by modifying the target design of at least one correlated structural feature to be manufactured subsequently, wherein the at least one correlated structural feature is correlated to said structural feature showing misalignment.
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公开(公告)号：US11749613B2
公开(公告)日：2023-09-05
申请号：US17451012
申请日：2021-10-15
发明人： Gerald Weidinger , Andreas Zluc
IPC分类号： H01L23/538 , H01L23/31 , H01L23/373 , H01L23/00 , H01L21/48 , H01L21/56
CPC分类号： H01L23/5389 , H01L21/4853 , H01L21/565 , H01L21/568 , H01L23/3121 , H01L23/373 , H01L23/5386 , H01L24/19 , H01L24/20 , H01L2224/214
摘要： A method for manufacturing a component carrier includes forming a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, providing a component having one or more pads and at least one dielectric layer on at least one main surface of the component such that the dielectric layer at least partially covers one or more pads of the component, placing the component on a temporary carrier, and embedding the component between the temporary carrier and the at least one insulating layer structure by pressing the component into the at least one insulating layer structure.
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8.发明授权公开(公告)号：US11658142B2
公开(公告)日：2023-05-23
申请号：US16947786
申请日：2020-08-17
发明人： Heinz Moitzi , Johannes Stahr , Andreas Zluc
CPC分类号： H01L24/16 , H01L21/4846 , H01L23/49838 , H01L24/05 , H01L24/13 , H01L24/81 , H05K1/111 , H05K1/181 , H05K3/3436 , H01L2224/0401 , H01L2224/05557 , H01L2224/05572 , H01L2224/13019 , H01L2224/1607 , H01L2224/16059 , H01L2224/81143 , H01L2224/81345 , H01L2224/81801 , H05K2201/09472 , H05K2201/10636 , H05K2201/10727 , H05K2203/048
摘要： A connection arrangement for forming a component carrier structure is disclosed. The connection arrangement includes a first electrically conductive connection element and a second electrically conductive connection element. The first connection element and the second connection element are configured such that, upon connecting the first connection element with the second connection element along a connection direction, a form fit is established between the first connection element and the second connection element that limits a relative motion between the first connection element and the second connection element in a plane perpendicular to the connection direction. A component carrier and a method of forming a component carrier structure are also disclosed.
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公开(公告)号：US11622443B2
公开(公告)日：2023-04-04
申请号：US17301756
申请日：2021-04-13
发明人： Artan Baftiri
摘要： A component carrier includes a stack having a first electrically insulating layer structure and a first electrically conductive layer structure arranged on the first electrically insulating layer structure. The first electrically insulating layer structure has at least one first covered portion, which is covered by the first electrically conductive layer structure, and at least one first non-covered portion, which is not covered by the first electrically conductive layer structure. The first electrically insulating layer structure defines a recess at the at least one first non-covered portion.
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10.发明授权公开(公告)号：US11612064B2
公开(公告)日：2023-03-21
申请号：US17302599
申请日：2021-05-07
IPC分类号： H05K1/03 , H05K3/00 , H01L21/67 , H01L21/70 , H01L21/768 , H01L23/12 , H01L23/498 , H05K3/34 , H05K3/42
摘要： A component carrier includes (a) a first stack with at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure; (b) a hole formed within the first stack; and (c) a non-deformable solid body closing a portion of the hole and being spaced with respect to side walls of the hole by a gap. A component carrier assembly includes (a) a component carrier as described above; (b) a second stack having at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure; and (c) a connection piece connecting the first stack with the second stack. Further described are methods for manufacturing such a component carrier and such a component carrier assembly.
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