公开(公告)号：US07752996B2

公开(公告)日：2010-07-13

申请号：US11611736

申请日：2006-12-15

申请人： Yezdi Dordi ,  William Thie ,  John M. Boyd ,  Fritz C. Redeker ,  Aleksander Owczarz

发明人： Yezdi Dordi ,  William Thie ,  John M. Boyd ,  Fritz C. Redeker ,  Aleksander Owczarz

IPC分类号： B05C11/06 ,  B05C11/02 ,  B08B5/00 ,  B08B3/00

CPC分类号： H01L21/02074 ,  C23C18/1628 ,  C23C18/38 ,  C23C18/50 ,  H01L21/288 ,  H01L21/76849 ,  H01L21/76883 ,  Y10S134/902

摘要： An electroless plating chamber is provided. The electroless plating chamber includes a chuck configured to support a substrate and a bowl surrounding a base and a sidewall of the chuck. The base has an annular channel defined along an inner diameter of the base. The chamber includes a drain connected to the annular channel. The drain is capable of removing fluid collected from the chuck. A proximity head capable of cleaning and substantially drying the substrate is included in the chamber. A method for performing an electroless plating operation is also provided.

摘要翻译： 提供无电镀室。 化学镀室包括配置成支撑基板的卡盘和围绕卡盘的基部和侧壁的碗。 底座具有沿着底座的内径限定的环形通道。 该腔室包括连接到环形通道的排水口。 排水口能够去除从卡盘收集的流体。 能够清洁和基本上干燥基板的接近头包括在腔室中。 还提供了一种执行化学镀操作的方法。

公开(公告)号：US20090078282A1

公开(公告)日：2009-03-26

申请号：US12240300

申请日：2008-09-29

申请人： John M. de Larios ,  Mike Ravkin ,  Jeffrey Farber ,  Mikhail Korolik ,  Fritz Redeker ,  Aleksander Owczarz

发明人： John M. de Larios ,  Mike Ravkin ,  Jeffrey Farber ,  Mikhail Korolik ,  Fritz Redeker ,  Aleksander Owczarz

IPC分类号： B08B1/00

CPC分类号： B08B3/003 ,  H01L21/67028 ,  H01L21/67046 ,  Y10S134/902

摘要： An apparatus and method are disclosed in which a semiconductor substrate having a surface containing contaminants is cleaned or otherwise subjected to chemical treatment using a foam. The semiconductor wafer is supported either on a stiff support (or a layer of foam) and foam is provided on the opposite surface of the semiconductor wafer while the semiconductor wafer is supported. The foam contacting the semiconductor wafer is pressurized using a form to produce a jammed foam. Relative movement between the form and the semiconductor wafer. such as oscillation parallel and/or perpendicular to the top surface of the semiconductor wafer. is then induced while the jammed foam is in contact with the semiconductor wafer to remove the undesired contaminants and/or otherwise chemically treat the surface of the semiconductor wafer using the foam.

摘要翻译： 公开了一种装置和方法，其中具有含有污染物的表面的半导体衬底被清洁或以其它方式用泡沫进行化学处理。 半导体晶片被支撑在刚性支撑件（或泡沫层）上，并且在半导体晶片被支撑的同时在半导体晶片的相对表面上提供泡沫。 接触半导体晶片的泡沫使用形式加压以产生卡住的泡沫。 形式与半导体晶圆之间的相对移动。 例如平行于和/或垂直于半导体晶片的顶表面的振荡。 然后在卡住的泡沫与半导体晶片接触的同时引发，以除去不期望的污染物和/或以其它方式化学处理使用泡沫的半导体晶片的表面。

公开(公告)号：US07115023B1

公开(公告)日：2006-10-03

申请号：US11172270

申请日：2005-06-29

申请人： Aleksander Owczarz

发明人： Aleksander Owczarz

IPC分类号： B24B1/00

CPC分类号： B24B41/067 ,  B24B9/065

摘要： A wafer bevel processing apparatus comprises a plurality of rollers for rotatably supporting a wafer, first process roller, a second process roller, and a process tape extending between the first process roller and the second process roller. The first and second process rollers are positioned to cause the process tape to contact an edge of the wafer when the wafer is loaded into the processing apparatus. The process tape is configured to frictionally prepare the edge where contact occurs with the process tape.

摘要翻译： 晶片斜面处理设备包括多个辊，用于可旋转地支撑晶片，第一处理辊，第二处理辊和在第一处理辊和第二处理辊之间延伸的处理带。 第一和第二处理辊定位成当晶片装载到处理装置中时，使处理带接触晶片的边缘。 处理带被配置为摩擦地准备与处理带接触发生的边缘。

公开(公告)号：US07094291B2

公开(公告)日：2006-08-22

申请号：US09893316

申请日：2001-06-26

申请人： Timothy J. Reardon ,  Craig P. Meuchel ,  Thomas H. Oberlitner ,  Aleksander Owczarz ,  Raymon F. Thompson

发明人： Timothy J. Reardon ,  Craig P. Meuchel ,  Thomas H. Oberlitner ,  Aleksander Owczarz ,  Raymon F. Thompson

IPC分类号： B05C11/00 ,  B05B12/00 ,  B05B15/00

CPC分类号： H01L21/6715 ,  G11B7/26 ,  H01L21/67075 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68785 ,  Y10S134/902

摘要： A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

公开(公告)号：US06894491B2

公开(公告)日：2005-05-17

申请号：US10328884

申请日：2002-12-23

申请人： Yehiel Gotkis ,  Rodney Kistler ,  Aleksander Owczarz ,  David Hemker ,  Nicolas J. Bright

发明人： Yehiel Gotkis ,  Rodney Kistler ,  Aleksander Owczarz ,  David Hemker ,  Nicolas J. Bright

IPC分类号： H01L21/66 ,  G01B7/06 ,  G01R33/12

CPC分类号： H01L22/26

摘要： A method for detecting a thickness of a layer of a wafer is provided. The method includes defining a particular radius of a wafer carrier configured to engage the wafer to be processed. The method also includes providing a plurality of sensors configured to create a set of complementary sensors. Further included in the method is distributing the plurality of sensors along the particular radius within the wafer carrier such that each sensor of the plurality of sensors is out of phase with an adjacent sensor by a same angle. The method also includes measuring signals generated by the plurality of sensors. Further included is averaging the signals generated by the plurality of sensors so as to generate a combination signal. The averaging is configured to remove noise from the combination signal such that the combination signal is capable of being correlated to identify the thickness of the layer.

摘要翻译： 提供了一种用于检测晶片层的厚度的方法。 该方法包括限定配置成接合要处理的晶片的晶片载体的特定半径。 该方法还包括提供配置成创建一组互补传感器的多个传感器。 该方法还包括沿着晶片载体内的特定半径分布多个传感器，使得多个传感器中的每个传感器与相邻的传感器相位相同角度。 该方法还包括测量由多个传感器产生的信号。 还包括对由多个传感器产生的信号进行平均以产生组合信号。 平均化被配置为从组合信号去除噪声，使得组合信号能够被相关联以识别层的厚度。

公开(公告)号：US06808590B1

公开(公告)日：2004-10-26

申请号：US10186932

申请日：2002-06-28

申请人： Yehiel Gotkis ,  Rodney Kistler ,  Aleksander Owczarz ,  David Hemker ,  Nicolas J. Bright

发明人： Yehiel Gotkis ,  Rodney Kistler ,  Aleksander Owczarz ,  David Hemker ,  Nicolas J. Bright

IPC分类号： H01L21302

CPC分类号： G01B7/105 ,  G01B7/107 ,  G01B2210/44

摘要： A system for processing a wafer is provided. The system includes a chemical mechanical planarization (CMP) tool. The CMP tool includes a wafer carrier defined within a housing. A carrier film is affixed to the bottom surface and supports a wafer. A sensor embedded in the wafer carrier. The sensor is configured to induce an eddy current in the wafer to determine a proximity and a thickness of the wafer. A sensor array external to the CMP tool is included. The sensor array is in communication with the sensor embedded in the wafer carrier and substantially eliminates a distance sensitivity. The sensor array provides an initial thickness of the wafer to allow for a calibration to be performed on the sensor embedded in the wafer carrier. The calibration offsets variables causing inaccuracies in the determination of the thickness of the wafer during CMP operation. A method and an apparatus are also provided.

摘要翻译： 提供了一种用于处理晶片的系统。 该系统包括化学机械平面化（CMP）工具。 CMP工具包括限定在壳体内的晶片载体。 载体膜固定到底表面并支撑晶片。 嵌入晶片载体的传感器。 传感器被配置为在晶片中感应涡流以确定晶片的接近度和厚度。 包括CMP工具外部的传感器阵列。 传感器阵列与嵌入在晶片载体中的传感器连通，并且基本上消除了距离灵敏度。 传感器阵列提供晶片的初始厚度，以允许对嵌入在晶片载体中的传感器进行校准。 校准偏移了在CMP操作期间确定晶片厚度的不准确性的变量。 还提供了一种方法和装置。

公开(公告)号：US6098641A

公开(公告)日：2000-08-08

申请号：US897914

申请日：1997-07-21

申请人： Aleksander Owczarz

发明人： Aleksander Owczarz

IPC分类号： B08B11/00 ,  B08B3/02 ,  B08B11/02 ,  F16F1/38 ,  F16F15/00 ,  F16F15/02 ,  F16F15/08 ,  H01L21/00 ,  H01L21/304 ,  H01L21/67 ,  H02K5/124 ,  H02K5/24 ,  B08B13/00

CPC分类号： H01L21/67051 ,  B08B11/02 ,  B08B3/02 ,  F16F1/38 ,  F16F15/02 ,  F16F15/08 ,  H01L21/67 ,  H02K5/124 ,  H02K5/24 ,  Y10S134/902

摘要： An apparatus for processing a semiconductor wafer is set forth. The apparatus comprises a processing bowl that defines a processing chamber. The processing bowl is in fixed alignment with a frame. A wafer support structure adapted to support at least one wafer is mounted for rotation within the processing chamber. A motor drive assembly is disposed exterior to the processing chamber and connected to rotate the wafer support. The motor drive assembly includes an electrically driven motor and at least one shock absorbing member connected between the electrically driven motor and the frame. The electrically driven motor preferably includes a rotor shaft that rotates about an axis of rotation. The shock absorbing member is adapted to elastically deform in substantially all directions perpendicular to the axis of rotation of the rotor shaft in response to vibrational forces having components perpendicular to the axis of rotation and, to a lesser degree, in directions parallel to the axis of rotation of the rotating shaft in response to vibrational forces having components parallel to the axis of rotation. In accordance with a further, independently unique aspect of the present invention, an aggressive seal is provided to prevent materials, such as processing fluids, from entering the motor in the region of the motor rotor. To this end, expulsion threads are provided at an end of the rotor shaft of the motor. A member substantially surrounds the expulsion threads at the end of the rotor. Together, the member defines a chamber with the rotor. Rotation of the rotor and threads assist in preventing foreign materials from entering the motor.

公开(公告)号：US5575641A

公开(公告)日：1996-11-19

申请号：US509704

申请日：1995-07-31

申请人： Aleksander Owczarz ,  Ronald J. Ray ,  Daniel L. Durado

发明人： Aleksander Owczarz ,  Ronald J. Ray ,  Daniel L. Durado

IPC分类号： H01L21/00 ,  H01L21/677 ,  F27D3/00

CPC分类号： H01L21/67126 ,  H01L21/67772

摘要： A semiconductor processor including an enclosure with an access opening. A door assembly is supported for translational movement between aligned and displaced positions relative to the access opening. The door assembly has a main part, and an extension part which telescopically moves toward and away from the access opening. A bellows is provided between the main and extension parts. The closed door is sealed by a first face seal and a second expandable seal. A liquids trap is provided to prevent outward escape of liquids from the access opening. A drain removes liquid collected in the trap.

公开(公告)号：US5224841A

公开(公告)日：1993-07-06

申请号：US874333

申请日：1992-04-24

申请人： Raymon E. Thompson ,  Karl Martin ,  Aleksander Owczarz

发明人： Raymon E. Thompson ,  Karl Martin ,  Aleksander Owczarz

IPC分类号： F04B9/117 ,  F04B43/113 ,  F04B53/10

CPC分类号： F04B9/1174 ,  F04B43/1136 ,  F04B53/1022

摘要： A low contamination double bellows pump suitable for providing relatively constant pressure and delivery. The illustrated pump includes two pumping chambers with bellows arranged in opposed relationship on opposite sides of a central section. The central section acts as a valve body for inlet and outlet valves. The bellows are provided with interior bellows tubes which connect to the free ends of the bellows and slide upon stationary support pistons mounted within each tube. Bellows tube head pieces slide upon piston rods which support the pistons. Pneumatic pressure is controllably supplied to opposing sides of the pistons within the bellows tubes to power the bellows and effect pumping.

摘要翻译： 低污染双波纹管泵适用于提供相对恒定的压力和输送。 示出的泵包括两个泵送室，其中波纹管以相对的关系布置在中心部分的相对侧上。 中心部分用作入口和出口阀的阀体。 波纹管设有内部波纹管，其连接到波纹管的自由端并在安装在每个管内的固定支撑活塞上滑动。 波纹管管头部件在支撑活塞的活塞杆上滑动。 气动压力可控地供应到波纹管内的活塞的相对侧面，以对波纹管供电并实现泵送。

公开(公告)号：US5174045A

公开(公告)日：1992-12-29

申请号：US703266

申请日：1991-05-17

申请人： Raymon F. Thompson ,  Aleksander Owczarz

发明人： Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： F26B5/08 ,  F26B25/00 ,  H01L21/00

CPC分类号： H01L21/67028 ,  F26B25/004 ,  F26B5/08 ,  Y10S414/135

摘要： A processor for centrifugal processing of semiconductor wafers and similar units without a wafer carrier. The processor is specially constructed to provide an automatically extendible and retractable rotor head to allow automated loading and unloading of discrete wafers onto the rotor head. The rotor head includes means for holding the wafers in spaced discrete relationship without a carrier. The processor includes a novel shaft assembly construction which includes an axially extendible shaft controlled using pressurized fluid. The pressurized fluid is supplied to the shaft assembly by a pressure supply which is controllably extendible and retractable for engagement with the shaft assembly when rotation is stopped. The shaft assembly also preferably incorporates an axial locking mechanism which holds the axially movable components of the shaft assembly in fixed axial position during rotation, while allowing release when rotation is stopped so that movable portions of the shaft assembly can be axially extended.

摘要翻译： 一种用于离心处理半导体晶片和类似单元而没有晶片载体的处理器。 该处理器是特别构造的，以提供可自动伸缩的转子头，以允许将离散晶片自动加载和卸载到转子头上。 转子头包括用于将晶片保持在间隔离散的关系中而没有载体的装置。 该处理器包括新颖的轴组件结构，其包括使用加压流体控制的可轴向延伸的轴。 加压流体通过压力供应器供应到轴组件，该压力供应器在旋转停止时可控制地伸缩并用于与轴组件接合。 轴组件还优选地包括轴向锁定机构，其将轴组件的可轴向移动的部件在旋转期间保持在固定的轴向位置，同时当旋转停止时允许释放，使得轴组件的可动部分可以轴向延伸。