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公开(公告)号：US20210402547A1
公开(公告)日：2021-12-30
申请号：US17355038
申请日：2021-06-22
Applicant: Applied Materials, Inc.
Inventor： Brian J. Brown , Andrew J. Nagengast , Justin Ho Kuen Wong
IPC: B24B37/005 , B24B37/32
Abstract: A carrier head for holding a substrate in a polishing system includes a housing, a first flexible membrane secured to the housing to form one or more pressurizable chambers to apply pressure through a central membrane portion of the first flexible membrane to a central portion of a substrate, and a plurality of independently operable piezoelectric actuators supported by the housing, the plurality of piezoelectric actuators positioned radially outward of the central membrane portion and at different angular positions so as to independently adjust pressure on a plurality of angular zones in an annular outer region of the substrate surrounding the central portion of the substrate.
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公开(公告)号：US20200282509A1
公开(公告)日：2020-09-10
申请号：US16688604
申请日：2019-11-19
Applicant: Applied Materials, Inc.
Inventor： Jimin Zhang , Jianshe Tang , Brian J. Brown , Wei Lu , Priscilla Diep
IPC: B24B37/005 , H01L21/321
Abstract: A method of chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, the polishing pad having a groove that is concentric with the axis of rotation, oscillating the substrate laterally across the polishing pad such that a central portion of the substrate and an edge portion of the substrate are positioned over a polishing surface of the polishing pad for a first duration, and holding the substrate substantially laterally fixed in a position such that the central portion of the substrate is positioned over the polishing surface of the polishing pad and the edge portion of the substrate is positioned over the groove for a second duration.
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公开(公告)号：US10229842B2
公开(公告)日：2019-03-12
申请号：US13951913
申请日：2013-07-26
Applicant: Applied Materials, Inc.
Inventor： Clinton Sakata , Hui Chen , Jim K. Atkinson , Tomohiko Kitajima , Brian J. Brown
IPC: H01L21/67
Abstract: A buff module and method for using the same are provided. In one embodiment, a buff module includes housing having an interior volume, a plurality of drive rollers and a pair of buff heads. The drive rollers are arranged to rotate a substrate within the interior volume on a substantially horizontal axis. The buff heads are disposed in the housing, each buff head rotatable on an axis substantially aligned with the horizontal axis and movable to a position substantially parallel with the horizontal axis.
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公开(公告)号：US09984867B2
公开(公告)日：2018-05-29
申请号：US14602201
申请日：2015-01-21
Applicant: Applied Materials, Inc.
Inventor： Ekaterina Mikhaylichenko , Brian J. Brown , Kyle M. Hanson , Vincent S. Francischetti
IPC: H01L21/02 , H01L21/67 , H01L21/677 , B08B3/08
CPC classification number: H01L21/02054 , B08B3/08 , H01L21/67028 , H01L21/67034 , H01L21/67057 , H01L21/67733 , H01L21/67736 , H01L21/67751
Abstract: In some embodiments, a system is provided that includes (1) a loading position; (2) a drying position; (3) a movable tank configured to (a) hold at least one substrate; (b) hold a cleaning chemistry so as to expose a substrate within the movable tank to the cleaning chemistry; and (c) translate between the loading position and the drying position; and (4) a drying station located at the drying position and configured to rinse and dry a substrate as the substrate is unloaded from the movable tank when the movable tank is at the drying position. Numerous other aspects are provided.
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公开(公告)号：US09728428B2
公开(公告)日：2017-08-08
申请号：US13932698
申请日：2013-07-01
Applicant: Applied Materials, Inc.
Inventor： Brian J. Brown
IPC: H01L21/67
CPC classification number: H01L21/67051 , H01L21/67034 , H01L21/67057
Abstract: An apparatus for drying of wet substrates in a post CMP cleaning apparatus is provided. The apparatus provides a waterfall or shallow reservoir of rinsing solution, such as DIW, through which a substrate may be lifted. A solvent vapor may be provided at the rinsing solution interface on the substrate, such as in a Marangoni process. In certain embodiments, the volume of solution through which the substrate is lifted is reduced, which may provide for reduced or eliminated particle reattachment to the substrate.
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Patent Agency Ranking
公开(公告)号：US12285838B2
公开(公告)日：2025-04-29
申请号：US18505871
申请日：2023-11-09
Applicant: Applied Materials, Inc.
Inventor： Jimin Zhang , Jianshe Tang , Brian J. Brown , Wei Lu , Priscilla Diep LaRosa
IPC: B24B37/26 , B24B37/005 , B24B37/04 , B24B37/27
Abstract: A chemical mechanical polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, and a controller. The polishing pad has a polishing control groove. The carrier is laterally movable by a first actuator across the polishing pad and rotatable by a second actuator. The controller synchronizes lateral oscillation of the carrier head with rotation of the carrier head such that over a plurality of successive oscillations of the carrier head such that when a first angular swath of an edge portion of the substrate is at an azimuthal angular position about an axis of rotation of the carrier head the first angular swath overlies the polishing surface and when a second angular swath of the edge portion of the substrate is at the azimuthal angular position the second angular swath overlies the polishing control groove.
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公开(公告)号：US20250114901A1
公开(公告)日：2025-04-10
申请号：US18377615
申请日：2023-10-06
Applicant: Applied Materials, Inc.
Inventor： Zhize Zhu , Brian J. Brown , Christopher Heung-Gyun Lee , Huyen Tran , Huanbo Zhang , Eric Lau , Ekaterina A. Mikhaylichenko
Abstract: A method for chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, dispensing a polishing liquid onto the polishing pad, and oscillating the substrate laterally across the polishing pad. The polishing pad has a polishing-rate adjustment groove that is concentric with the axis of rotation, and a coolant, a dilutant, or both, is dispensed into the polishing-rate adjustment groove such that a polishing rate is reduced in an annular zone of the polishing pad that is positioned radially inward of the polishing-rate adjustment groove. The annular zone surrounds a central zone of the polishing pad in which a polishing rate is not substantially affected by the coolant, dilutant, or both.
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公开(公告)号：US20250114898A1
公开(公告)日：2025-04-10
申请号：US18377599
申请日：2023-10-06
Applicant: Applied Materials, Inc.
Inventor： Zhize Zhu , Brian J. Brown , Christopher Heung-Gyun Lee , Huyen Tran , Huanbo Zhang , Eric Lau , Ekaterina A. Mikhaylichenko
Abstract: A method for chemical mechanical polishing includes bringing a substrate into contact with a polishing pad, causing relative motion between the substrate and polishing pad, dispensing a polishing liquid onto the polishing pad, holding the substrate in a lateral position with a retaining ring secured to a carrier head, and rotating the carrier head about an axis of rotation. The retaining ring has a plurality of channels extending from an inner diameter surface of the retaining ring to an outer diameter surface of the retaining ring such that rotation cause the polishing liquid to be preferentially expelled from a region below an outer edge of the substrate through the plurality of channels.
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公开(公告)号：US20250114897A1
公开(公告)日：2025-04-10
申请号：US18377591
申请日：2023-10-06
Applicant: Applied Materials, Inc.
Inventor： Zhize Zhu , Brian J. Brown , Christopher Heung-Gyun Lee , Huyen Tran , Huanbo Zhang , Eric Lau , Ekaterina A. Mikhaylichenko
IPC: B24B37/04 , B24B37/005 , B24B37/24 , B24B37/26
Abstract: A polishing pad has a polishing layer having a polishing surface that has a circular central region and an annular outer region surrounding the central region. The polishing surface can include slurry distribution grooves formed with uniformity spacing across the central region and the annular outer region, and slurry discharge grooves that start at an outer perimeter of the circular central region and extend radially outward to an edge of the polishing pad so as to preferentially discharge the polishing liquid from the annular outer region. The central region can be formed of a first polishing material and the annular outer region can be formed of a second polishing material that is softer than the first polishing material.
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公开(公告)号：US11890715B2
公开(公告)日：2024-02-06
申请号：US17355038
申请日：2021-06-22
Applicant: Applied Materials, Inc.
Inventor： Brian J. Brown , Andrew J. Nagengast , Justin Ho Kuen Wong
Abstract: A carrier head for holding a substrate in a polishing system includes a housing, a first flexible membrane secured to the housing to form one or more pressurizable chambers to apply pressure through a central membrane portion of the first flexible membrane to a central portion of a substrate, and a plurality of independently operable piezoelectric actuators supported by the housing, the plurality of piezoelectric actuators positioned radially outward of the central membrane portion and at different angular positions so as to independently adjust pressure on a plurality of angular zones in an annular outer region of the substrate surrounding the central portion of the substrate.
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