摘要:
A semiconductor device includes a non-volatile memory, such as an electrically erasable programmable read only memory (EEPROM) array of memory cells. The memory is arranged as an array of cells in rows and columns. Each column of the array is located within an isolated well, common to the cells in the column but isolated from other wells of other columns. The array is programmed by pulsing potentials to each column, with isolation of results for each column. In one embodiment, the memory cells are devoid of floating gate devices and use a non-conductive charge storage layer to store charges. In another embodiment, the memory cells store charges in nanocrystals.
摘要:
An EEPROM device includes a split-gate FET (10) having a source (36), a drain (22), a select gate (16) adjacent the drain (22), and a control gate (32) adjacent the source (36). When programming the split-gate FET (10), electrons are accelerated in a portion of a channel region (38) between the select gate (16) and the control gate (32), and then injected into a nitride layer (24) of an ONO stack (25) underlying the control gate (32). The split-gate FET (10) is erased by injecting holes from the channel region (38) into the charge nitride layer (24). When reading data from the split-gate FET (10), a reading voltage is applied to the drain (22) adjacent the select gate (16). Data is then read from the split-gate FET (10) by sensing a current flowing in a bit line coupled to the drain (22).
摘要:
A memory circuit and method of formation uses a transmission gate (24) as a select gate. The transmission gate (24) contains a transistor (30) which is an N-channel transistor and a transistor (28) which is a P-channel transistor. The transistors (28 and 30) are electrically connected in parallel. The use of the transmission gate (24) as a select gate allows reads and writes to occur to a memory cell storage device (i.e. a capacitor (32), a floating gate (22), etc.) without a significant voltage drop occurring across the transmission gate. In addition, EEPROM technology is more compatible with EPROM/flash technology when using a transmission gate as a select gate within EEPROM devices.
摘要:
A memory circuit and method of formation uses a transmission gate (24) as a select gate. The transmission gate (24) contains a transistor (30) which is an N-channel transistor and a transistor (28) which is a P-channel transistor. The transistors (28 and 30) are electrically connected in parallel. The use of the transmission gate (24) as a select gate allows reads and writes to occur to a memory cell storage device (i.e. a capacitor (32), a floating gate (22), etc.) without a significant voltage drop occurring across the transmission gate. In addition, EEPROM technology is more compatible with EPROM/flash technology when using a transmission gate as a select gate within EEPROM devices.
摘要:
An integrated circuit (10) is formed using jet vapor deposition (JVD) silicon nitride. A non-volatile memory device (11) has a tunnel dielectric layer (27) and an inter-poly dielectric layer (31) that can be formed from JVD silicon nitride. A transistor (12,13,40) is formed that has a gate dielectric material made from JVD silicon nitride. In addition, a passivation layer (47) can be formed overlying a semiconductor device (40) that is formed from JVD silicon nitride.
摘要:
A process for fabricating a non-volatile memory cell (10) in a semiconductor device includes the formation of a doped region (28) in a semiconductor substrate (40) underlying a floating gate electrode (16) and separated therefrom by a tunnel dielectric layer (44). Stress induced failure of the tunnel dielectric layer (44) is avoided by laterally diffusing dopant atoms under the floating gate electrode (16) after completely fabricating both the floating gate electrode (16) and the underlying tunnel dielectric layer (44).
摘要:
An EEPROM cell (40) includes a floating gate transistor (47) and an isolation transistor (45). Both a floating gate (48) and an isolation gate (46) are formed on a tunnel dielectric (44) within the cell. The isolation gate is coupled to a doped source region (52) of the floating gate transistor. The isolation transistor is not biased during a program operation of the cell, enabling a thin tunnel dielectric (less than 120 angstroms) to be used beneath all portions of both gates within the cell. Thus, the need for both a conventional tunnel dielectric and a gate dielectric is eliminated. The cell tolerates over-erasure, can be programmed at low programming voltages, and has good current drive due to the thin tunnel dielectric throughout the cell.
摘要:
Zener diodes that are formed concurrently with flash EEPROM cells are utilized to regulate programming voltages for programming a flash EEPROM cell (37). A selected bit-line (38) is voltage regulated with both a zener diode (19) and a bias transistor (36). The bias transistor is activated during programming to prevent breaking down a drain junction of a flash EEPROM cell, which would generate hot-electrons and cause a runaway programming problem. The regulated voltage on the bit-line is also utilized to optimize programming characteristics of a flash EEPROM cell, and to minimize disturbing a programmed logic state of flash EEPROM cells connected to a commonly selected bit-line. A separate zener diode (17) provides a regulated voltage for a selected word-line (40) during programming. By regulating the voltage of the word-line during programming, a program disturb problem associated with a high voltage word-line is minimized.