摘要:
A memory system having a memory element chip (DRAM) and a memory controller chips having a plurality of drivers and receivers and latches for transferred data. For writes clocks, write data and write for CRC (cyclic redundancy checks) is transferred to the DRAM from the memory controller and latched for error checking. The reads are clocked and the read data is received and transferred to a read data latch with also receives a clocked read strobe for verification of data integrity from DRAM. Each chip has a bi-functional pin that acts as a shared CRC pin during write and acts as a shared strobe pin during READ. Data transfers with the CRC signal and DQS signal are transferred across two paths CRC0/DQS and CRC1/DQS1. One could also transfer the CRC signal across one path with only the CRC0/DQS signal. Read operations have no CRC, and have no need for CRC because transfer errors during read can be detected by memory error correction coding (ECC). Write data provides source synchronous I/O data to said memory element chip needed for modem high speed memory communications.
摘要:
A semiconductor driver circuit includes impedance units for generating impedances at data pads, independently of each-other. Thus, signal swing widths of data signals generated at the data pads may be easily adjusted to be substantially equal for high operating speed. The semiconductor driver circuit also includes switching units for uncoupling at least one of the impedance units from at least one of the data pads for enhanced testing of the data pads.
摘要:
A differential amplifier includes an input stage, a biasing unit and a load unit. The input stage receives a first phase signal and at least two phase signals among odd-numbered phase signals, wherein an average of phases of the at least two phase signals has a phase difference of substantially 180 degrees from the first phase signal. The biasing unit is coupled between the input stage and a first power voltage. The load unit is coupled between the input stage and a second power voltage, and configured to output a differential output signal based on differentially amplifying of the first phase signal and the at least two phase signals. Therefore, a duty cycle distortion in an output signal of a duty cycle correction circuit can be prevented.
摘要:
For signal processing such as in an image sensor, a CDS (correlated double sampling) unit generates a first CDS signal from a first set of input signals at a predetermined node. In addition, a conversion unit converts a second CDS signal into a respective converted signal concurrently as the CDS unit generates the fist CDS signal. The second CDS signal is determined from a second set of input signals previously generated at the predetermined node.
摘要:
A semiconductor memory device includes an IO circuit for receiving or outputting command signals, address signals and data which are serialized and an IO signal control circuit for parallel converting the serialized command signals, address signals and data inputted through the IO circuit and applying the parallel converted signals to an internal portion and serial converting parallel data applied from the internal portion and outputting the serial converted data to the IO circuit.
摘要:
A semiconductor memory device and a memory system including the same are provided. The semiconductor memory device may include a first memory cell array block generating first data, a second memory cell array block generating second data, and first and second error detection code generators. The first error detection code generator may generate a first error detection code and may combine a portion of bits of the first error detection code with a portion of bits of a second error detection code to generate a first final error detection signal. The second error detection code generator may generate the second error detection code and may combine the remaining bits other than the portion of bits of the second error detection code with the remaining bits other than the portion of bits of the first error detection code to generate a second final error detection signal.
摘要:
A ring oscillator has a first logic circuit forming a first loop. The ring oscillator also has a second logic circuit forming a second loop, such that phase interpolation occurs at a node common to the first and second loops. The phase interpolation results in an output signal with a high frequency.
摘要:
A ring oscillator has a first logic circuit forming a first loop. The ring oscillator also has a second logic circuit forming a second loop, such that phase interpolation occurs at a node common to the first and second loops. The phase interpolation results in an output signal with a high frequency.
摘要:
The present invention discloses an input buffer circuit of a synchronous semiconductor memory device comprising a differential amplifier type input buffer and a low current type input buffer, wherein the differential amplifier type input buffer is operated in a normal mode, and the low current type input buffer is operated in a self-refresh mode, thereby decreasing the current flowing through the input buffer in the self-refresh mode. According to the input buffer of the synchronous semiconductor memory device, the current flowing through the input buffer in the self-refresh mode is very small, therefore the power consumption of the synchronous semiconductor memory device can be reduced.
摘要:
An integrated circuit die stack including a first integrated circuit die mounted upon a substrate, the first die including pass-through vias (‘PTVs’) composed of conductive pathways through the first die with no connection to any circuitry on the first die; and a second integrated circuit die, identical to the first die, shifted in position with respect to the first die and mounted upon the first die, with the PTVs in the first die connecting signal lines from the substrate through the first die to through silicon vias (‘TSVs’) in the second die composed of conductive pathways through the second die connected to electronic circuitry on the second die; with the TSVs and PTVs disposed upon each identical die so that the positions of the TSVs and PTVs on each identical die are translationally compatible with respect to the TSVs and PTVs on the other identical die.