System and method for manufacturing a thin-film device
    53.
    发明授权
    System and method for manufacturing a thin-film device 有权
    用于制造薄膜器件的系统和方法

    公开(公告)号:US08101947B2

    公开(公告)日:2012-01-24

    申请号:US12375660

    申请日:2007-07-26

    IPC分类号: H01L29/12 H01L21/00

    摘要: A thin-film device includes a plurality of circuit components defining an operational region of the thin-film device, an unpatterned channel portion (108, 340) disposed on the plurality of circuit components, and a patterned passivation dielectric (380,385) selectively disposed on the unpatterned channel portion (108, 340) to electrically pattern an active region of the unpatterned channel portion (108,340).

    摘要翻译: 薄膜器件包括限定薄膜器件的操作区域的多个电路部件,以及设置在多个电路部件上的未图案化通道部分(108,340),以及选择性地设置在多个电路部件上的图案化钝化电介质(380,385) 未图案化的通道部分(108,340),用于对未图案化的通道部分(108,340)的有源区域进行电图形化。

    System And Method For Manufacturing A Thin-film Device
    54.
    发明申请
    System And Method For Manufacturing A Thin-film Device 有权
    制造薄膜器件的系统和方法

    公开(公告)号:US20090289250A1

    公开(公告)日:2009-11-26

    申请号:US12375660

    申请日:2007-07-26

    IPC分类号: H01L29/22 H01L21/31

    摘要: A thin-film device includes a plurality of circuit components defining an operational region of the thin-film device, an unpatterned channel portion (108, 340) disposed on the plurality of circuit components, and a patterned passivation dielectric (380,385) selectively disposed on the unpatterned channel portion (108,340) to electrically pattern an active region of the unpatterned channel portion (108,340).

    摘要翻译: 薄膜器件包括限定薄膜器件的操作区域的多个电路部件,以及设置在多个电路部件上的未图案化通道部分(108,340),以及选择性地设置在多个电路部件上的图案化钝化电介质(380,385) 所述未图案化通道部分(108,340)对未图案化通道部分(108,340)的有源区域进行电图形化。

    Semiconductor device
    59.
    发明申请
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US20070152214A1

    公开(公告)日:2007-07-05

    申请号:US11715174

    申请日:2007-03-07

    IPC分类号: H01L29/10 H01L21/84

    CPC分类号: H01L29/7869 H01L29/78648

    摘要: One exemplary embodiment includes a semi-conductor device. The semi-conductor device can include a channel including that includes one or more compounds of the formula AxBxCxOx, wherein each A is selected from the group of Zn, Cd, each B is selected from the group of Ga, In, each C is selected from the group Ge, Sn, Pb, each O is atomic oxygen, each x is independently a non-zero integer, and each of A, B, and C are different.

    摘要翻译: 一个示例性实施例包括半导体器件。 半导体器件可以包括通道,其包括一个或多个下式的化合物:其中R 1,R 2,R 2, 其中每个A选自Zn,Cd,每个B选自Ga,In,每个C选自Ge,Sn,Pb组,每个O是原子氧, 每个x独立地是非零整数,并且A,B和C各自不同。

    Rectifying contact to an n-type oxide material or a substantially insulating oxide material
    60.
    发明申请
    Rectifying contact to an n-type oxide material or a substantially insulating oxide material 有权
    对n型氧化物材料或基本绝缘的氧化物材料进行整流接触

    公开(公告)号:US20070114528A1

    公开(公告)日:2007-05-24

    申请号:US11283914

    申请日:2005-11-21

    IPC分类号: H01L29/10

    摘要: A rectifying contact to an n-type oxide material and/or a substantially insulating oxide material includes a p-type oxide material. The p-type oxide material includes a copper species and a metal species, each of which are present in an amount ranging from about 10 atomic % to about 90 atomic % of total metal in the p-type oxide material. The metal species is selected from tin, zinc, and combinations thereof.

    摘要翻译: 与n型氧化物材料和/或基本上绝缘的氧化物材料的整流接触包括p型氧化物材料。 p型氧化物材料包括铜物质和金属物质,其各自以p型氧化物材料中的总金属的约10原子%至约90原子%的量存在。 金属物质选自锡,锌及其组合。