公开(公告)号：US07173306B2

公开(公告)日：2007-02-06

申请号：US10927948

申请日：2004-08-27

申请人： Franz Hirler ,  Ralf Henninger ,  Frank Pfirsch ,  Markus Zundel ,  Jenoe Tihanyi

发明人： Franz Hirler ,  Ralf Henninger ,  Frank Pfirsch ,  Markus Zundel ,  Jenoe Tihanyi

IPC分类号： H01L29/76

CPC分类号： H01L29/7802 ,  H01L29/0619 ,  H01L29/402 ,  H01L29/407 ,  H01L29/7813 ,  H01L29/861

摘要： The invention relates to a method for fabricating a drift zone of a vertical semiconductor component and to a vertical semiconductor component having the following features: a semiconductor body (100) having a first side (101) and a second side (102), a drift zone (30) of a first conduction type which is arranged in the region between the first and the second sides (101, 102) and is formed for the purpose of taking up a reverse voltage, a field electrode arrangement arranged in the drift zone (30) and having at least one electrically conducted field electrode (40; 40A–40E; 90A–90J) arranged in a manner insulated from the semiconductor body (100), an electrical potential of the at least one field electrode (40; 40A–40E; 90A–90J) varying in the vertical direction of the semiconductor body (100) at least when a reverse voltage is applied.

摘要翻译： 本发明涉及一种用于制造垂直半导体部件和具有以下特征的垂直半导体部件的漂移区的方法：具有第一侧（101）和第二侧（102）的半导体本体（100），漂移 第一导电类型的区域（30）布置在第一和第二侧面（101,102）之间的区域中并且被形成为用于吸收反向电压的目的，设置在漂移区域中的场电极布置（ 30），并且具有以与半导体本体（100）绝缘的方式布置的至少一个导电场电极（40; 40A-40E; 90A-90J），所述至少一个场电极 40; 40A-40E; 90A-90J），至少在施加反向电压时，在半导体本体（100）的垂直方向上变化。

公开(公告)号：US06720616B2

公开(公告)日：2004-04-13

申请号：US10027531

申请日：2001-12-26

申请人： Franz Hirler ,  Manfred Kotek ,  Joost Larik ,  Frank Pfirsch

发明人： Franz Hirler ,  Manfred Kotek ,  Joost Larik ,  Frank Pfirsch

IPC分类号： H01L2978

CPC分类号： H01L29/7813 ,  H01L29/1095 ,  H01L29/42368

摘要： A trench MOS-transistor includes a body region strengthened by an implantation area that faces the drain region to increase the avalanche resistance.

摘要翻译： 沟槽MOS晶体管包括通过面向漏极区域的注入区域增强的体区，以增加雪崩阻力。

公开(公告)号：US20130001640A1

公开(公告)日：2013-01-03

申请号：US13610240

申请日：2012-09-11

申请人： Frank Pfirsch ,  Maria Cotorogea ,  Franz Hirler ,  Franz-Josef Niedernostheide ,  Thomas Raker ,  Hans-Joachim Schulze ,  Hans Peter Felsl

发明人： Frank Pfirsch ,  Maria Cotorogea ,  Franz Hirler ,  Franz-Josef Niedernostheide ,  Thomas Raker ,  Hans-Joachim Schulze ,  Hans Peter Felsl

IPC分类号： H01L29/739

CPC分类号： H01L29/7813 ,  H01L29/0619 ,  H01L29/0696 ,  H01L29/407 ,  H01L29/7397

摘要： A semiconductor device includes a first trench and a second trench extending into a semiconductor body from a surface. A body region of a first conductivity type adjoins a first sidewall of the first trench and a first sidewall of the second trench, the body region including a channel portion adjoining to a source structure and being configured to be controlled in its conductivity by a gate structure. The channel portion is formed at the first sidewall of the second trench and is not formed at the first sidewall of the first trench. An electrically floating semiconductor zone of the first conductivity type adjoins the first trench and has a bottom side located deeper within the semiconductor body than the bottom side of the body region.

摘要翻译： 半导体器件包括从表面延伸到半导体本体中的第一沟槽和第二沟槽。 第一导电类型的主体区域邻接第一沟槽的第一侧壁和第二沟槽的第一侧壁，主体区域包括邻近源极结构的沟道部分，并且被配置为通过栅极结构来控制其导电性 。 通道部分形成在第二沟槽的第一侧壁处，并且不形成在第一沟槽的第一侧壁处。 第一导电类型的电浮动半导体区域邻接第一沟槽，并且具有位于半导体本体内比底体区域的底侧更深的底侧。

公开(公告)号：US20110018029A1

公开(公告)日：2011-01-27

申请号：US12506844

申请日：2009-07-21

申请人： Frank Pfirsch ,  Maria Cotorogea ,  Franz Hirler ,  Franz-Josef Niedernostheide ,  Thomas Raker ,  Hans-Joachim Schulze ,  Hans Peter Felsl

发明人： Frank Pfirsch ,  Maria Cotorogea ,  Franz Hirler ,  Franz-Josef Niedernostheide ,  Thomas Raker ,  Hans-Joachim Schulze ,  Hans Peter Felsl

IPC分类号： H01L29/739

CPC分类号： H01L29/7813 ,  H01L29/0619 ,  H01L29/0696 ,  H01L29/407 ,  H01L29/7397

摘要： A semiconductor device includes a first trench and a second trench extending into a semiconductor body from a surface. A body region of a first conductivity type adjoins a first sidewall of the first trench and a first sidewall of the second trench, the body region including a channel portion adjoining to a source structure and being configured to be controlled in its conductivity by a gate structure. The channel portion is formed at the first sidewall of the second trench and is not formed at the first sidewall of the first trench. An electrically floating semiconductor zone of the first conductivity type adjoins the first trench and has a bottom side located deeper within the semiconductor body than the bottom side of the body region.

摘要翻译： 半导体器件包括从表面延伸到半导体本体中的第一沟槽和第二沟槽。 第一导电类型的主体区域邻接第一沟槽的第一侧壁和第二沟槽的第一侧壁，主体区域包括邻近源极结构的沟道部分，并且被配置为通过栅极结构来控制其导电性 。 通道部分形成在第二沟槽的第一侧壁处，并且不形成在第一沟槽的第一侧壁处。 第一导电类型的电浮动半导体区域邻接第一沟槽，并且具有位于半导体本体内比底体区域的底侧更深的底侧。

公开(公告)号：US20070138544A1

公开(公告)日：2007-06-21

申请号：US11469011

申请日：2006-08-31

申请人： Franz Hirler ,  Walter Rieger ,  Thorsten Meyer ,  Wolfgang Klein ,  Frank Pfirsch

发明人： Franz Hirler ,  Walter Rieger ,  Thorsten Meyer ,  Wolfgang Klein ,  Frank Pfirsch

IPC分类号： H01L29/94

CPC分类号： H01L29/7813 ,  H01L27/04 ,  H01L27/0727 ,  H01L29/0696 ,  H01L29/0878 ,  H01L29/404 ,  H01L29/407 ,  H01L29/42368 ,  H01L29/66734 ,  H01L29/732 ,  H01L29/735 ,  H01L29/7803 ,  H01L29/7808 ,  H01L29/861

摘要： A field plate trench transistor having a semiconductor body is disclosed. In one embodiment, the semiconductor has a trench structure and an electrode structure embedded in the trench structure. The electrode structure being electrically insulated from the semiconductor body by an insulation structure and having a gate electrode structure and a field electrode structure. The field plate trench transistor has a voltage divider configured such that the field electrode structure is set to a potential lying between source and drain potentials.

摘要翻译： 公开了一种具有半导体本体的场板沟槽晶体管。 在一个实施例中，半导体具有沟槽结构和嵌入沟槽结构中的电极结构。 电极结构通过绝缘结构与半导体本体电绝缘并具有栅电极结构和场电极结构。 场板沟槽晶体管具有分压器，其被配置为使得场电极结构被设置为位于源极和漏极之间的电位。

公开(公告)号：US20050082591A1

公开(公告)日：2005-04-21

申请号：US10927948

申请日：2004-08-27

申请人： Franz Hirler ,  Ralf Henninger ,  Frank Pfirsch ,  Markus Zundel ,  Jenoe Tihanyi

发明人： Franz Hirler ,  Ralf Henninger ,  Frank Pfirsch ,  Markus Zundel ,  Jenoe Tihanyi

IPC分类号： H01L29/06 ,  H01L29/40 ,  H01L29/739 ,  H01L29/78 ,  H01L29/861

CPC分类号： H01L29/7802 ,  H01L29/0619 ,  H01L29/402 ,  H01L29/407 ,  H01L29/7813 ,  H01L29/861

摘要： The invention relates to a method for fabricating a drift zone of a vertical semiconductor component and to a vertical semiconductor component having the following features: a semiconductor body (100) having a first side (101) and a second side (102), a drift zone (30) of a first conduction type which is arranged in the region between the first and the second sides (101, 102) and is formed for the purpose of taking up a reverse voltage, a field electrode arrangement arranged in the drift zone (30) and having at least one electrically conducted field electrode (40; 40A-40E; 90A-90J) arranged in a manner insulated from the semiconductor body (100), an electrical potential of the at least one field electrode (40; 40A-40E; 90A-90J) varying in the vertical direction of the semiconductor body (100) at least when a reverse voltage is applied.

摘要翻译： 本发明涉及一种用于制造垂直半导体部件和具有以下特征的垂直半导体部件的漂移区的方法：具有第一侧（101）和第二侧（102）的半导体本体（100），漂移 第一导电类型的区域（30）布置在第一和第二侧面（101,102）之间的区域中并且被形成为用于吸收反向电压的目的，设置在漂移区域中的场电极布置（ 30），并且具有以与半导体本体（100）绝缘的方式布置的至少一个导电场电极（40; 40A-40E; 90A-90J），所述至少一个场电极 40; 40A-40E; 90A-90J），至少在施加反向电压时，在半导体本体（100）的垂直方向上变化。

公开(公告)号：US10566462B2

公开(公告)日：2020-02-18

申请号：US12512285

申请日：2009-07-30

申请人： Hans-Joachim Schulze ,  Frank Pfirsch ,  Franz-Josef Niedernostheide

发明人： Hans-Joachim Schulze ,  Frank Pfirsch ,  Franz-Josef Niedernostheide

IPC分类号： H01L29/861

摘要： A bipolar semiconductor device and method are provided. One embodiment provides a bipolar semiconductor device including a first semiconductor region of a first conductivity type having a first doping concentration, a second semiconductor region of a second conductivity type forming a pn-junction with the first semiconductor region, and a plurality of third semiconductor regions of the first conductivity type at least partially arranged in the first semiconductor region and having a doping concentration which is higher than the first doping concentration. Each of the third semiconductor regions is provided with at least one respective junction termination structure.

公开(公告)号：US08809971B2

公开(公告)日：2014-08-19

申请号：US12861153

申请日：2010-08-23

申请人： Hans-Joachim Schulze ,  Frank Pfirsch

发明人： Hans-Joachim Schulze ,  Frank Pfirsch

IPC分类号： H01L29/78

CPC分类号： H01L29/7802 ,  H01L29/51 ,  H01L29/513 ,  H01L29/516 ,  H01L29/517 ,  H01L29/7395 ,  H01L29/7397 ,  H01L29/7813 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor component comprising a semiconductor body, a channel zone in the semiconductor body, a channel control electrode adjacent to the channel zone, and a dielectric layer between the channel zone and the channel control electrode, wherein the dielectric layer has a relative dielectric constant ∈r with a negative temperature coefficient.

摘要翻译： 一种半导体元件，包括半导体本体，半导体主体中的沟道区，与沟道区相邻的沟道控制电极，以及沟道区和沟道控制电极之间的介电层，其中介电层具有相对介电常数ε r具有负温度系数。

公开(公告)号：US07541260B2

公开(公告)日：2009-06-02

申请号：US11677430

申请日：2007-02-21

申请人： Frank Pfirsch ,  Walter Rieger

发明人： Frank Pfirsch ,  Walter Rieger

IPC分类号： H01L21/76

CPC分类号： H01L29/0634 ,  H01L29/66727

摘要： A semiconductor structure is formed comprising a plurality of columns doped with alternating dopants. The columns are separated by trenches, and the dopant is diffused in the doped columns. The trenches are filled with semiconductor material. Other embodiments may be described and claimed.

摘要翻译： 形成包括掺杂有交替掺杂剂的多个列的半导体结构。 这些列由沟槽分开，并且掺杂剂在掺杂柱中扩散。 沟槽填充有半导体材料。 可以描述和要求保护其他实施例。

公开(公告)号：US20090085103A1

公开(公告)日：2009-04-02

申请号：US11864238

申请日：2007-09-28

申请人： Frank Hille ,  Carsten Schaeffer ,  Frank Pfirsch ,  Holger Ruething

发明人： Frank Hille ,  Carsten Schaeffer ,  Frank Pfirsch ,  Holger Ruething

IPC分类号： H01L29/94 ,  H01L21/00

CPC分类号： H01L29/7802 ,  H01L29/0619 ,  H01L29/0634 ,  H01L29/0834 ,  H01L29/1095 ,  H01L29/41766 ,  H01L29/4236 ,  H01L29/6634 ,  H01L29/66348 ,  H01L29/66727 ,  H01L29/66734 ,  H01L29/7396 ,  H01L29/7397 ,  H01L29/7805 ,  H01L29/7813

摘要： A semiconductor device and production method is disclosed. In one embodiment, the semiconductor device includes a first electrode and a second electrode, located on surfaces of a semiconductor body, and an insulated gate electrode. The semiconductor body has a contact groove for the first electrode in an intermediate oxide layer. Highly doped zones of a first conduction type are located in edge regions of the source connection zone. Below the highly doped zones of the first conduction type, there are highly doped zones of a body zone with a complementary conduction type. In a central region of the source connection zone, the body zone has a net charge carrier concentration with a complementary conduction type which is lower than the charge carrier concentration in the edge regions of the source connection zone.

摘要翻译： 公开了一种半导体器件和制造方法。 在一个实施例中，半导体器件包括位于半导体本体表面上的第一电极和第二电极以及绝缘栅电极。 半导体本体具有用于中间氧化物层中的第一电极的接触槽。 第一导电类型的高掺杂区域位于源极连接区域的边缘区域。 在第一导电类型的高掺杂区之下，存在具有互补导电类型的体区的高掺杂区。 在源极连接区域的中心区域，体区具有互补导电类型的净电荷载流子浓度，该互补导电类型低于源极连接区域的边缘区域中的载流子浓度。