公开(公告)号：US20050282410A1

公开(公告)日：2005-12-22

申请号：US11137061

申请日：2005-05-25

申请人： Harry Hedler ,  Roland Irsigler ,  Thorsten Meyer ,  Andreas Wolter

发明人： Harry Hedler ,  Roland Irsigler ,  Thorsten Meyer ,  Andreas Wolter

IPC分类号： G01R1/067 ,  G01R1/073 ,  H01L21/58 ,  H01R12/00 ,  H05K3/32 ,  H05K3/40

CPC分类号： H05K3/4007 ,  G01R1/06711 ,  G01R1/07357 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/0367

摘要： The present invention relates to an elastic contact-connecting device. An elastic elevation 3 is applied to a carrier area 2 of a carrier 1. The elastic elevation 3 has a first oblique area 4, a second ramp 5 and a roof area 6. The first oblique area 4 has a lesser inclination (30) with regard to the carrier area 2 than the second oblique area 5. A contact region 20 is applied to the roof area 6 of the elastic elevation. The contact region 20 is connected to other structures 12 on the carrier 1 via a conductor track 10. For this purpose, the conductor track 10 is guided over the first oblique area 4. If a mating contact is pressed onto the contact region 20, the elastic elevation yields, but presses against the mating contact on account of its elastic property and thus enables a reliable contact. In this case, essentially only the second oblique area 5 is deformed; the first oblique area 4 and the conductor track 10 applied thereto are not subjected to any mechanical stress.

摘要翻译： 本发明涉及弹性接触连接装置。 弹性高度3被施加到载体1的载体区域2。 弹性高度3具有第一倾斜区域4，第二斜坡5和屋顶区域6。 第一倾斜区域4相对于载体区域2具有比第二倾斜区域5更小的倾斜度（30）。 接触区域20被施加到弹性高度的屋顶区域6。 接触区域20经由导体轨道10连接到载体1上的其它结构12。 为此，导体轨道10被引导在第一倾斜区域4上。 如果配合接触件被按压到接触区域20上，则由于其弹性而使弹性高度屈服，而是压靠配合接触，因此能够进行可靠的接触。 在这种情况下，基本上仅第二倾斜区域5变形; 施加到其上的第一倾斜区域4和导体轨道10不会受到任何机械应力。

公开(公告)号：US06927157B2

公开(公告)日：2005-08-09

申请号：US10637899

申请日：2003-08-08

申请人： Harry Hedler ,  Thorsten Meyer

发明人： Harry Hedler ,  Thorsten Meyer

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H01L21/44

CPC分类号： H01L24/10 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13008 ,  H01L2224/13099 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00

摘要： Integrated circuit and method for producing a composite comprising a tested integrated circuit and an electrical device. According to one embodiment, a method is provided for producing a composite comprising a tested integrated circuit and an electrical device. The method can include applying a flexible elevation to a circuit substrate of the integrated circuit. Further, the method can include providing a rewiring device on the circuit substrate. The method can also include carrying out of a test of the integrated circuit with temporary utilization of the contact-making device on the flexible elevation. Further, the method can include applying solder to a contact device of the electrical device. The method can also include placing the tested integrated circuit onto the electrical device. In addition, the method can include reliquifying the solder to form a connection between the intergrated circuit and the electrical device.

摘要翻译： 用于生产复合材料的集成电路和方法，包括被测集成电路和电气装置。 根据一个实施例，提供了一种用于生产包括测试集成电路和电气设备的复合材料的方法。 该方法可以包括将柔性高程应用于集成电路的电路基板。 此外，该方法可以包括在电路基板上提供重新布线装置。 该方法还可以包括在柔性高程上临时利用接触制造装置进行集成电路的测试。 此外，该方法可以包括将焊料施加到电气装置的接触装置。 该方法还可以包括将测试的集成电路放置在电气设备上。 此外，该方法可以包括重新焊接以形成集成电路和电气设备之间的连接。

公开(公告)号：US06864575B2

公开(公告)日：2005-03-08

申请号：US10195958

申请日：2002-07-16

申请人： Harry Hedler ,  Thorsten Meyer

发明人： Harry Hedler ,  Thorsten Meyer

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L29/40

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014

摘要： Electronic component, in particular a chip, which can be electrically bonded by means of a plurality of contacts provided on the component to mating contacts provided on a carrier, each contact having a raised elastic base of a conductive material which is connected to a lead on the component side, and to which there is applied on the upper side a metallic cap-like contact covering, only partially covering the base.

摘要翻译： 电子部件，特别是芯片，其可以通过设置在部件上的多个触点电连接到设置在载体上的配合触点，每个触点具有连接到导线上的导电材料的凸起的弹性基部 组件侧，并且在上侧施加金属帽状接触覆盖物，仅覆盖基部。

公开(公告)号：US06714418B2

公开(公告)日：2004-03-30

申请号：US10285924

申请日：2002-11-01

申请人： Gerd Frankowsky ,  Harry Hedler ,  Roland Irsigler ,  Thorsten Meyer ,  Barbara Vasquez

发明人： Gerd Frankowsky ,  Harry Hedler ,  Roland Irsigler ,  Thorsten Meyer ,  Barbara Vasquez

IPC分类号： H05K702

CPC分类号： H01L25/50 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15331 ,  H01L2924/00

摘要： An electronic component has a plurality of chips which are stacked one above the other and contact-connected to one another. To form this component, a first planar chip arrangement is provided with the functional chips spaced apart from one another in a grid and with a filling material in the spaces between the chips to form an insulating holding frame that fixes the chips, the frame has chip-dedicated contact-connecting elements that serve for the electrical contact-connection to another chip of another chip arrangement and each chip has dedicated electrically conductive strips. At least one additional planar chip arrangement is formed by the same method as the first planar chip arrangement and is then stacked on the first planar chip arrangement so that the two chip arrangements lie one above the other and the respective contact-connecting elements of the two chip arrangements are connected to one another for electrical chip-to-chip contact-connection. Subsequently, each of the components, which comprise a stack of chips, is separated from the assembled stack of chip arrangements.

摘要翻译： 电子部件具有多个彼此叠置并彼此接触连接的芯片。 为了形成该部件，第一平面芯片布置设置有功能芯片，其格栅彼此间隔开，并且在芯片之间的空间中具有填充材料，以形成固定芯片的绝缘保持框架，框架具有芯片 用于与另一个芯片布置的另一芯片的电接触连接的每个芯片具有专用的导电条。 通过与第一平面芯片布置相同的方法形成至少一个附加的平面芯片布置，然后将其堆叠在第一平面芯片布置上，使得两个芯片布置在另一个之上并且两个相应的触点连接元件 芯片布置彼此连接以进行电芯片到芯片的接触连接。 随后，包括一堆芯片的每个部件与组装的芯片布置堆叠分离。

公开(公告)号：US06696319B2

公开(公告)日：2004-02-24

申请号：US10244256

申请日：2002-09-16

申请人： Gerd Frankowsky ,  Thorsten Meyer

发明人： Gerd Frankowsky ,  Thorsten Meyer

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/17517 ,  H01L2224/45144 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00

摘要： A method of attaching semiconductor devices, the contact devices of which have preferably already been applied at wafer level, on a switching device and such a device includes having the electrical contacts remain free of solder by using flexible contact elements, and performing the mechanical attachment by additional attachment elements or compression stops used as attachment elements.

摘要翻译： 将其接触装置优选地已经以晶片级施加在其上的半导体器件的方法在开关器件上，并且这种器件包括通过使用柔性接触元件使电触头保持不含焊料，并且通过使用柔性接触元件执行机械附接 用作附件的附加附件或压缩挡块。

公开(公告)号：US10170409B2

公开(公告)日：2019-01-01

申请号：US15037276

申请日：2013-12-23

申请人： Sanka Ganesan ,  John S. Guzek ,  Nitesh Nimkar ,  Klaus Reingruber ,  Thorsten Meyer

发明人： Sanka Ganesan ,  John S. Guzek ,  Nitesh Nimkar ,  Klaus Reingruber ,  Thorsten Meyer

IPC分类号： H01L23/02 ,  H01L23/52 ,  H01L23/522 ,  H01L21/56 ,  H01L21/768 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  H01L23/31 ,  H01L23/538

摘要： Embodiments of the present disclosure are directed to package assemblies and methods for fabricating package assemblies. In one embodiment, a package assembly includes a die at least partially embedded in a mold compound; and a through mold via (TMV). The TMV may have vertical sides or may include two different portions with varying shapes. In some instances, prefabricated via bars may be used during fabrication. Package assemblies of the present disclosure may include package-on-package (POP) interconnects having a pitch of less than 0.3 mm. Other embodiments may be described and/or claimed.

公开(公告)号：US09331057B2

公开(公告)日：2016-05-03

申请号：US11924691

申请日：2007-10-26

申请人： Thorsten Meyer ,  Grit Sommer ,  Ralf Plieninger

发明人： Thorsten Meyer ,  Grit Sommer ,  Ralf Plieninger

IPC分类号： H01L21/20 ,  H01L25/16 ,  H01L23/522 ,  H01L23/64 ,  H01L23/00 ,  H01L25/00 ,  H01L49/02 ,  H01L21/56

CPC分类号： H01L25/16 ,  H01L21/568 ,  H01L23/5223 ,  H01L23/642 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L28/40 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/20 ,  H01L2224/24195 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2224/96 ,  H01L2224/82

摘要： A semiconductor device is disclosed. One embodiment provides a semiconductor chip. The semiconductor chip includes a first electrode of a capacitor. An insulating layer is arranged on top of the first electrode. A second electrode of the capacitor is applied over the insulating layer, wherein the second electrode is made of a conductive layer arranged over the semiconductor chip.

摘要翻译： 公开了一种半导体器件。 一个实施例提供一种半导体芯片。 半导体芯片包括电容器的第一电极。 绝缘层设置在第一电极的顶部。 电容器的第二电极被施加在绝缘层上，其中第二电极由布置在半导体芯片上的导电层制成。

公开(公告)号：US09205868B2

公开(公告)日：2015-12-08

申请号：US14237232

申请日：2012-08-03

申请人： Axel Hebenstreit ,  Hans-Dieter Loeffler ,  Thorsten Meyer

发明人： Axel Hebenstreit ,  Hans-Dieter Loeffler ,  Thorsten Meyer

IPC分类号： B62D1/16 ,  B62D7/06 ,  B62D1/20 ,  F16D1/08 ,  F16D3/38

CPC分类号： B62D7/06 ,  B62D1/20 ,  F16D1/0876 ,  F16D1/0882 ,  F16D1/0888 ,  F16D3/387

摘要： A steering spindle has a steering spindle connection connected to a fork crown of a steering coupling via an intermediate piece. The steering spindle connection and the intermediate piece are formed as plug partners at ends facing each other, by means of at least one tongue and groove guide element pair, which provides a torque-transmitting priority control. A groove and a tongue of the at least one tongue and groove guide element pair are positioned in the longitudinal axial direction on the steering spindle connection and the intermediate piece. The steering arrangement includes a clamping device that clamps the plug partners to each other in a plugging position.

摘要翻译： 转向主轴具有通过中间件连接到转向联轴器的叉头的转向主轴连接。 转向主轴连接件和中间件通过至少一个榫舌和槽导向元件对形成为彼此面对的端部处的插塞配合，其提供扭矩传递优先级控制。 所述至少一个舌槽导向元件对的槽和舌部沿着纵向轴向位于转向主轴连接件和中间件上。 该转向装置包括夹紧装置，该夹紧装置将插塞合体彼此夹持在堵塞位置。

公开(公告)号：US09126622B2

公开(公告)日：2015-09-08

申请号：US14237289

申请日：2012-08-03

申请人： Axel Hebenstreit ,  Hans-Dieter Loeffler ,  Thorsten Meyer

发明人： Axel Hebenstreit ,  Hans-Dieter Loeffler ,  Thorsten Meyer

IPC分类号： B62D1/16 ,  B62D1/20 ,  F16D1/08 ,  F16D3/38 ,  F16D1/06

CPC分类号： B62D1/16 ,  B62D1/20 ,  F16D1/06 ,  F16D1/0876 ,  F16D1/0882 ,  F16D1/0888 ,  F16D3/387 ,  Y10T403/7026

摘要： A steering arrangement includes a steering spindle and a steering coupling provided with a fork crown bearing a connecting element that connects an end of the steering spindle to the steering coupling in the form of a plug connection. To enable the combined steering spindle and steering coupling ends to be connected to each other in the correct relative position and thus to be able to prevent a defective assembly, the steering spindle end and the connecting element are coaxial plug partners on ends facing each other, by means of at least one tongue and groove guide element pair that provides a torque-transmitting priority control. The at least one groove and/or the at least one tongue of the guide element pair is molded on the interior of the shaft. A clamping device clamps the plug partners against each other in a plugging position so that they cannot come loose.

摘要翻译： 转向装置包括转向主轴和转向联轴器，该转向联轴器设置有叉形冠，其具有将转向主轴的端部与插头连接形式的转向联轴器连接的连接元件。 为了使组合的转向主轴和转向联轴器端部能够以正确的相对位置彼此连接，并且因此能够防止组装不良，转向主轴端部和连接元件是彼此相对的端部上的同轴插头配件， 通过提供转矩传递优先级控制的至少一个舌槽导向元件对。 引导元件对的至少一个凹槽和/或至少一个舌片模制在轴的内部上。 夹紧装置将插塞合体彼此夹紧在堵塞位置，使其不会松动。

公开(公告)号：US20150243572A1

公开(公告)日：2015-08-27

申请号：US14189938

申请日：2014-02-25

申请人： Sven Albers ,  Sonja Koller ,  Thorsten Meyer ,  Georg Seidemann ,  Christian Geissler ,  Andreas Wolter

发明人： Sven Albers ,  Sonja Koller ,  Thorsten Meyer ,  Georg Seidemann ,  Christian Geissler ,  Andreas Wolter

IPC分类号： H01L23/31 ,  H01L21/56

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/562 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed towards an integrated circuit (IC) package including a die having a first side and a second side disposed opposite to the first side. The IC package may further include an encapsulation material encapsulating at least a portion of the die and having a first surface that is adjacent to the first side of the die and a second surface disposed opposite to the first surface. In embodiments, the second surface may be shaped such that one or more cross-section areas of the IC package are thinner than one or more other cross-section areas of the IC package. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及集成电路（IC）封装，其包括具有与第一侧相对设置的第一侧和第二侧的管芯。 IC封装还可以包括封装模具的至少一部分并且具有与模具的第一侧相邻的第一表面的封装材料和与第一表面相对设置的第二表面。 在实施例中，第二表面可以被成形为使得IC封装的一个或多个横截面积比IC封装的一个或多个其它横截面积更薄。 可以描述和/或要求保护其他实施例。