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公开(公告)号：US20180374987A1
公开(公告)日：2018-12-27
申请号：US16064917
申请日：2015-12-23
Applicant: Goertek Inc.
Inventor： Quanbo Zou
IPC: H01L33/00 , H01L25/075
Abstract: A micro-LED transfer method and a manufacturing method are disclosed. The micro-LED transfer method comprises: coating a sacrificial layer on a carrier substrate, wherein micro-LEDs are bonded on the carrier substrate through a first bonding layer (S1100); patterning the sacrificial layer to expose micro-LEDs to be picked up (S1200); bonding the micro-LEDs to be picked up with a pickup substrate through a second bonding layer (S1300); removing the sacrificial layer by undercutting (S1400); lifting-off the micro-LEDs to be picked up from the carrier substrate (S1500); bonding the micro-LEDs on the pickup substrate with a receiving substrate through a third bonding layer (S1600); and lifting-off the micro-LEDs from the pickup substrate (S1700).
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公开(公告)号：US20180324510A1
公开(公告)日：2018-11-08
申请号：US15772576
申请日：2015-11-03
Applicant: Goertek Inc.
Inventor： Quanbo Zou
CPC classification number: H04R1/04 , B81B7/0061 , B81B7/02 , B81B2201/0257 , B81B2201/0264 , B81B2207/012 , G01L9/0001 , G01L19/0092 , H01L25/00 , H04R19/005 , H04R19/04 , H04R2201/003 , H04R2499/11
Abstract: A MEMS multi-module assembly, manufacturing method, and electronics apparatus are disclosed herein. The MEMS multi-module assembly comprises: a first die having a first hole; and a second die stacked on the first die, having a second MEMS device, wherein the second MEMS device is connected outside via the first hole.
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公开(公告)号：US20180242092A1
公开(公告)日：2018-08-23
申请号：US15772580
申请日：2015-11-03
Applicant: Goertek Inc.
Inventor： Quanbo Zou , Zhe Wang , Yan Loke
CPC classification number: H04R31/003 , B81B2201/0257 , H04R19/04 , H04R31/00 , H04R2201/003
Abstract: A MEMS microphone chip trimming method, apparatus, manufacturing method and microphone are disclosed herein. The method for trimming MEMS microphone chips comprises: detecting a pull-in voltage distribution of MEMS microphone chips on a wafer; providing a mask based on the pull-in voltage distribution; and trimming the MEMS microphone chips on the wafer by using the mask.
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54.发明申请公开(公告)号：US20170330857A1
公开(公告)日：2017-11-16
申请号：US15531270
申请日：2015-07-14
Applicant: Goertek, Inc.
Inventor： Quanbo Zou , Zhe Wang
IPC: H01L23/00 , H01L33/62 , H01L25/075
CPC classification number: H01L24/97 , H01L24/81 , H01L24/83 , H01L25/0753 , H01L33/0079 , H01L33/0095 , H01L33/20 , H01L33/62 , H01L2224/81005 , H01L2224/81143 , H01L2224/81815 , H01L2224/83005 , H01L2224/83143 , H01L2224/83851 , H01L2224/95001 , H01L2224/95144 , H01L2224/95145 , H01L2924/12041 , H01L2933/0066
Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED comprises: forming micro-LEDs on a laser-transparent original substrate; irradiating the original substrate with laser from the original substrate side to lift-off the micro-LEDs from the original substrate; bring the micro-LEDs into contact with pads preset on a receiving substrate through a contactless action.
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公开(公告)号：US11205677B2
公开(公告)日：2021-12-21
申请号：US16473538
申请日：2017-01-24
Applicant: Goertek, Inc.
Inventor： Quanbo Zou , Peixuan Chen , Xiangxu Feng
Abstract: A micro-LED device, a display apparatus and a method for manufacturing a micro-LED device are provided. The micro-LED device comprises: a growth substrate; a plurality of vertical micro-LEDs formed on the growth substrate; a first type electrode formed on top of each of the vertical micro-LEDs; and a second type electrode formed on side surface of each of the vertical micro-LEDs.
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Patent Agency Ranking
公开(公告)号：US11109000B2
公开(公告)日：2021-08-31
申请号：US16487246
申请日：2017-03-07
Applicant: GOERTEK INC.
Inventor： Zhe Wang , Xiaoyang Zhang , Quanbo Zou
IPC: H04N9/31
Abstract: The present disclosure provides a laser projection device and a laser projection system. The laser projection device includes a light source scanner and a MEMS scanning mirror, the light source scanner including micro laser diodes; and the micro laser diodes are used to provide laser beams needed for image projection, and the laser beams are projected to the MEMS scanning mirror, and then reflected by the MEMS scanning mirror to a predetermined area to form a projection image. By providing the micro laser diodes in the laser projection device and initiatively emitting laser by exciting the micro laser diodes, the present disclosure does not need an external laser source and facilitates the reduction of the size of the laser projection device, as compared with the prior art.
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公开(公告)号：US11004602B2
公开(公告)日：2021-05-11
申请号：US15739950
申请日：2017-10-18
Applicant: Goertek Inc.
Inventor： Quanbo Zou
IPC: H01F41/074 , H01F41/04 , H01F5/00 , H02J50/10 , H01F27/28
Abstract: A flat coil, a manufacturing method thereof and an electronic apparatus are disclosed. The manufacturing method comprises: rolling a metal foil lamination onto a carrier roller to form a foil rod, wherein the metal foil lamination includes at least one layer of metal foil; sliding the foil rod from the carrier roller; slicing the foil rod into thin disks; and processing the thin disks to form at least one flat coil, wherein a pressing roller is pressed against the carrier roller via the metal foil lamination with a controlled pressing force as the metal foil lamination is rolled.
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公开(公告)号：US20200260192A1
公开(公告)日：2020-08-13
申请号：US16640009
申请日：2018-09-06
Applicant: GOERTEK, INC.
Inventor： Quanbo Zou , Yongwei Dong
Abstract: An MEMS microphone is provided, comprising: a first substrate; a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate; and a floating gate field effect transistor outputting a varying electrical signal, the floating gate field effect transistor including a source electrode and a drain electrode both provided on the first substrate and a floating gate provided on the vibration diaphragm.
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公开(公告)号：US10715923B2
公开(公告)日：2020-07-14
申请号：US16316535
申请日：2016-07-11
Applicant: GOERTEK INC.
Inventor： Quanbo Zou
Abstract: Disclosed are a condenser MEMS microphone and an electronic apparatus. The condenser MEMS microphone comprises: a substrate; a bottom plate placed on the substrate; and a top plate placed above the bottom plate and spaced from the bottom plate, wherein the top plate is torsional with respect to a first torsional axis and is divided into a first part and a second part by the first torsional axis, the first part and the second part form two condensers with the bottom plate, and a first group of acoustic holes are provided in the first part of the top plate.
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公开(公告)号：US20200006924A1
公开(公告)日：2020-01-02
申请号：US16465376
申请日：2016-12-05
Applicant: Goertek, Inc.
Inventor： Quanbo Zou , Zhe Wang
Abstract: A micro laser diode display device and an electronics apparatus are disclosed. The micro laser diode display device comprises: a substrate (213)/receiving substrate (513). wherein first type electrodes (214, 514) are arranged on the substrate (213)/receiving substrate (513); a micro laser diode (200r, 200g, 200b, 400r, 400g, 400b, 500r, 500g, 500b) array of at least one color bonded on the substrate (213)/receiving substrate (513), wherein a first side of micro laser diodes (200r, 200g, 200b, 400r, 400g, 400b, 500r, 500g, 500b) in the micro laser diode array is connected to the first type electrodes (214, 514); and second type electrodes (211, 311, 511) connected to a second side of the micro laser diodes (200r, 200g, 200b, 400r, 400g, 400b, 500r, 500g, 500b).
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