公开(公告)号：US5812902A

公开(公告)日：1998-09-22

申请号：US555749

申请日：1995-11-09

申请人： Dong-Ho Lee

发明人： Dong-Ho Lee

IPC分类号： G03G15/00 ,  G03G21/02

CPC分类号： G03G15/55 ,  G03G15/553 ,  G03G2221/1663

摘要： A device for displaying an exchange message for a process cartridge installed within a body of an image forming apparatus informs a user when the process cartridge should be replaced. The process cartridge, which can be installed within and removed from the body, combines a photosensitive drum, a cleaning blade and a waste toner receptacle as a unitary structure. A display provides the user with predetermined messages. A video controller receives a print command from a host computer and controls a printing operation by increasing an internally stored sheet printing index value by one in response to each printed sheet, and enables output of a message indicating that the process cartridge should be exchanged through the display when the sheet printing index value is greater than a predetermined value.

摘要翻译： 用于显示安装在图像形成装置的主体内的处理盒的交换消息的装置通知用户何时更换处理盒。 可以安装在主体内和从身体移除的处理盒将感光鼓，清洁刮板和废墨粉容器组合为一体的结构。 显示器向用户提供预定的消息。 视频控制器从主计算机接收打印命令并且响应于每个打印的纸张增加内部存储的纸张打印索引值一个位置来控制打印操作，并且能够输出指示处理盒应该通过 当纸张打印指标值大于预定值时显示。

公开(公告)号：US5812745A

公开(公告)日：1998-09-22

申请号：US570562

申请日：1995-12-11

申请人： Kwang-Seuk Kim ,  Dong-Ho Lee

发明人： Kwang-Seuk Kim ,  Dong-Ho Lee

IPC分类号： B41J29/38 ,  G06F3/12 ,  G06K15/00 ,  G09G5/00 ,  G06F15/00

CPC分类号： G06K15/00 ,  G06F3/1294 ,  G06K2215/0005 ,  G06K2215/0085

摘要： An image forming device using an engine for performing a print operation, an engine controller which determines the state of the engine and generates an engine state signal, and a video controller which receives the engine state signal and determines whether data transmitted from a computer is to be received or not based on whether the engine state signal is indicative of a normal state, an abnormal state which can be recovered from, and an abnormal state which can not be recovered from. Data to be printed is received from the computer when the engine state signal is indicative of a normal state and an abnormal state which can be recovered from; data to be printed is not received from the computer when the engine state signal is indicative of an abnormal state which can not be recovered from. Received data is changed into bit map image, and during a normal state or when the abnormal state of the engine is completely recovered from during check of the engine state, the bit map image is output to the engine for printing.

摘要翻译： 一种使用发动机执行打印操作的图像形成装置，确定发动机的状态并产生发动机状态信号的发动机控制器以及接收发动机状态信号并确定从计算机发送的数据是否为 基于发动机状态信号是指示正常状态，可以恢复的异常状态和无法恢复的异常状态，是否被接收。 当发动机状态信号表示正常状态和可以恢复的异常状态时，从计算机接收要打印的数据; 当发动机状态信号表示不能恢复的异常状态时，不从计算机接收要打印的数据。 接收到的数据被改变为位图图像，并且在正常状态期间或当发动机状态的检查期间发动机的异常状态完全恢复时，位图图像被输出到发动机进行打印。

公开(公告)号：US5428427A

公开(公告)日：1995-06-27

申请号：US989828

申请日：1992-12-14

申请人： Dong-Ho Lee

发明人： Dong-Ho Lee

IPC分类号： G03G15/08 ,  G03G21/00

CPC分类号： G03G15/0856 ,  G03G15/0858

摘要： A device for informing whether fresh toner should be newly supplied into a developer (20) into an electrophotography machine comprises a sleeve (22) for delivering toner (29) to a photosensitive drum, a blade (23) for regulating the distribution of the toner deposited on the sleeve (22), an agitator (24) for agitating the toner, a hopper (21) for loading the toner, a lever (25) with an upper projection (26) and lower support (27) pivotally moved with a pivot pin (25') attached on an inside wall (21') of the hopper (21) towards the sleeve (22), a metal plate (28) supported by the lower support (27), an actuator (32) with a magnet (36) and light shield (34) pivotally moved with another pivot pin (35), and a photosensor (31). Wherein, if the hopper (21) is devoid of the toner by consuming, the magnet (36) is attracted towards the metal plate (28) so as to cause the light shield (34) to block the photosensor (31).

摘要翻译： 用于通知新鲜调色剂是否应新鲜供应到显影剂（20）到电子照相机中的装置包括用于将调色剂（29）输送到感光鼓的套筒（22），用于调节调色剂分布的叶片（23） 沉积在套筒（22）上的搅拌器（24），用于搅拌调色剂的搅拌器（24），用于装载调色剂的料斗（21），具有上突起（26）和下支撑件（27）的杠杆（25） 安装在料斗（21）的内壁（21）上的枢轴销（25'）朝向套筒（22），由下支撑件（27）支撑的金属板（28），具有 磁体（36）和遮光罩（34）与另一个枢轴销（35）和光电传感器（31）枢转运动。 其中，如果料斗（21）通过消耗没有调色剂，则磁体（36）被吸引到金属板（28），以使遮光罩（34）阻挡光电传感器（31）。

公开(公告)号：US5291249A

公开(公告)日：1994-03-01

申请号：US5360

申请日：1993-01-19

申请人： Dong-Ho Lee

发明人： Dong-Ho Lee

IPC分类号： B41J29/02 ,  G03G21/18 ,  G03G15/04

CPC分类号： G03G21/1814 ,  B41J29/02 ,  G03G21/1628 ,  G03G21/1821 ,  G03G21/1842 ,  G03G2221/1636 ,  G03G2221/1651 ,  G03G2221/1654 ,  G03G2221/1684 ,  G03G2221/1687 ,  G03G2221/183

摘要： An LED printer constructed with a lower body frame, an upper body frame, a process unit having an upper leading end for mounting a photo-sensitive drum in a housing, an LED frame for supporting an LED head array beneath its right end portion, a pair of through holes formed adjacent to the right end of the LED frame, a pair of blind holes formed on the LED head array facing and aligned with the pair of through holes, and a pair of threaded bolts respectively received by the pair of through holes for connecting the LED head array to the LED frame by respectively fixing the lower ends of the pair of threaded bolts in the pair of blind holes. A pair of compression springs are interposed between the LED frame and head array and enclose corresponding ones of the pair of threaded bolts in order to exert a resilient force on the LED head array. A pair of LED positioning plates formed on both upper side ends of the housing. When an image process unit is installed inside the upper body frame, the upper leading end pushes the lever so as to pivot the LED frame together with the LED head array clockwise, so that both lower side end surfaces of the LED head array respectively contact the pair of LED positioning plates under the resilient force of the pair of compression springs and thus the gap between the photo-sensitive drum and LED head array is properly established and maintained.

摘要翻译： 一种LED打印机，其由下体框架，上体框架，具有用于将感光鼓安装在壳体中的上前端的处理单元构成，用于将LED头阵列支撑在其右端部下方的LED框架 一对与LED框架的右端相邻形成的通孔，形成在与该一对通孔对置并对准的LED头阵列上的一对盲孔，以及分别由一对通孔 用于通过将一对螺栓的下端分别固定在一对盲孔中来将LED头阵列连接到LED框架。 一对压缩弹簧插入在LED框架和头部阵列之间，并且包围一对螺栓中的相应的螺栓，以便在LED头阵列上施加弹性力。 一对LED定位板，形成在壳体的两个上端。 当图像处理单元安装在上部框架内部时，上部前端推动杠杆以使LED框架与LED头阵列顺时针方向一起转动，使得LED头阵列的下侧端面分别接触 在一对压缩弹簧的弹性力下的一对LED定位板，从而适当地建立并保持了感光鼓和LED头阵列之间的间隙。

公开(公告)号：US08887425B2

公开(公告)日：2014-11-18

申请号：US13315262

申请日：2011-12-08

申请人： Akira Hirai ,  Dong-Ho Lee ,  Seon-Chool Kim ,  Sang-Wook Lee ,  Sung-Ki Jung

发明人： Akira Hirai ,  Dong-Ho Lee ,  Seon-Chool Kim ,  Sang-Wook Lee ,  Sung-Ki Jung

IPC分类号： H05K5/00 ,  G09F9/30 ,  G02F1/1333

CPC分类号： G09F9/30 ,  G02F1/133308 ,  G02F2001/133331 ,  G02F2201/50

摘要： A display device has a cover window that is light, has good resistance against external impact, and is capable of being processed with various shapes. A display device according to the present invention includes: a display panel including a display area and a non-display area; and a cover window positioned at the front side of the display panel and including a transparent area corresponding to the display area and a non-transparent area corresponding to the non-display area, wherein the cover window includes a cover window main body formed with the transparent area and the non-transparent area, and a transparent protection layer formed at the front surface of the cover window main body. The transparent protection layer extends to the rear surface corresponding to at least a portion of the non-transparent area of the cover window main body.

摘要翻译： 显示装置具有遮光罩，光线良好，具有良好的抵抗外部冲击的能力，能够以各种形状进行加工。 根据本发明的显示装置包括：显示面板，包括显示区域和非显示区域; 以及位于所述显示面板的前侧的盖窗，其具有对应于所述显示区域的透明区域和对应于所述非显示区域的不透明区域，其中所述盖窗口包括盖窗主体， 透明区域和非透明区域，以及形成在盖窗主体的前表面处的透明保护层。 透明保护层延伸到对应于盖窗主体的不透明区域的至少一部分的后表面。

公开(公告)号：US20120129334A1

公开(公告)日：2012-05-24

申请号：US13365378

申请日：2012-02-03

申请人： Hyun-Soo CHUNG ,  Jae-Shin Cho ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang ,  Seung-Duk Baek

发明人： Hyun-Soo CHUNG ,  Jae-Shin Cho ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang ,  Seung-Duk Baek

IPC分类号： H01L21/768

CPC分类号： H01L24/91 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00

摘要： Provided are semiconductor packages and methods of manufacturing the semiconductor package. The semiconductor packages may include a substrate including a chip pad, a redistributed line which is electrically connected to the chip pad and includes an opening. The semiconductor packages may also include an external terminal connection portion, and an external terminal connection pad which is disposed at an opening and electrically connected to the redistributed line. The present general inventive concept can solve the problem where an ingredient of gold included in a redistributed line may be prevented from being diffused into an adjacent bump pad to form a void or an undesired intermetallic compound. In a chip on chip structure, a plurality of bumps of a lower chip are connected to an upper chip to improve reliability, diversity and functionality of the chip on chip structure.

摘要翻译： 提供半导体封装和制造半导体封装的方法。 半导体封装可以包括衬底，其包括芯片焊盘，电连接到芯片焊盘并且包括开口的再分布线。 半导体封装还可以包括外部端子连接部分和设置在开口处并电连接到重新分配线路的外部端子连接焊盘。 本发明的总体构思可以解决包含在再分布线中的金的成分被阻止扩散到相邻的凸块焊盘中以形成空隙或不期望的金属间化合物的问题。 在片上芯片结构中，下部芯片的多个凸起连接到上部芯片以提高片上芯片结构的可靠性，分集性和功能性。

公开(公告)号：US08053807B2

公开(公告)日：2011-11-08

申请号：US12923554

申请日：2010-09-28

申请人： Yong-Chai Kwon ,  Dong-Ho Lee

发明人： Yong-Chai Kwon ,  Dong-Ho Lee

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/3121 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2224/03

摘要： A semiconductor package may include a semiconductor pattern, a bonding pad, and a polymer insulation member. The semiconductor pattern may include a semiconductor device and first hole. The bonding pad may include a wiring pattern and plug. The wiring pattern may be formed on an upper face of the semiconductor pattern. The plug may extend from the wiring pattern to fill the first hole. The polymer insulation member may be formed on a lower face of the semiconductor pattern and may include a second hole exposing a lower end of the plug. A method of manufacturing a semiconductor package may include forming a first hole through a semiconductor substrate; forming a bonding pad and plug; attaching a supporting member to the upper face of the substrate; reducing a thickness of the substrate; forming a polymer insulation member on the lower face of the substrate; and cutting the substrate.

摘要翻译： 半导体封装可以包括半导体图案，接合焊盘和聚合物绝缘构件。 半导体图案可以包括半导体器件和第一孔。 接合焊盘可以包括布线​​图案和插头。 布线图案可以形成在半导体图案的上表面上。 插头可以从布线图案延伸以填充第一孔。 聚合物绝缘构件可以形成在半导体图案的下表面上，并且可以包括暴露插头的下端的第二孔。 制造半导体封装的方法可以包括通过半导体衬底形成第一孔; 形成焊盘和插头; 将支撑构件附接到所述基板的上表面; 减小基板的厚度; 在所述基板的下表面上形成聚合物绝缘部件; 并切割基板。

公开(公告)号：US07944539B2

公开(公告)日：2011-05-17

申请号：US10412451

申请日：2003-04-11

申请人： Dong-Ho Lee

发明人： Dong-Ho Lee

IPC分类号： G02F1/1345 ,  G02F1/1343 ,  G02F1/1339

CPC分类号： G02F1/13454 ,  G02F1/133345 ,  G02F1/1339 ,  G02F1/136227 ,  G02F1/136286 ,  G02F1/1368 ,  G02F2203/09

摘要： An LCD device provides enhanced display quality. An insulating layer is formed on a first substrate. The insulating layer covers the contact portion of a switching device in which the switching device is electrically connected to a transparent electrode and has an opening for exposing a portion of the transparent electrode. A reflection electrode is electrically connected to the transparent electrode through the opening. The insulation layer covers a first portion of a driving circuit formed on the first substrate. A sealant is interposed between the first and second substrate to engage the first and second substrate and to cover a second portion of the driving circuit. Therefore, the driver circuit may operate normally, and the distortion of the signal outputted from the driver circuit may be prevented.

摘要翻译： LCD设备提供增强的显示质量。 在第一基板上形成绝缘层。 绝缘层覆盖开关器件的接触部分，其中开关器件电连接到透明电极并且具有用于暴露透明电极的一部分的开口。 反射电极通过开口与透明电极电连接。 绝缘层覆盖形成在第一基板上的驱动电路的第一部分。 密封剂插入在第一和第二基板之间以与第一和第二基板接合并覆盖驱动电路的第二部分。 因此，驱动器电路可以正常工作，并且可以防止从驱动器电路输出的信号的失真。

公开(公告)号：US07825468B2

公开(公告)日：2010-11-02

申请号：US12003544

申请日：2007-12-28

申请人： Yong-Chai Kwon ,  Dong-Ho Lee

发明人： Yong-Chai Kwon ,  Dong-Ho Lee

IPC分类号： H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L23/04 ,  H01L23/48

CPC分类号： H01L23/3121 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2224/03

摘要： A semiconductor package may include a semiconductor pattern, a bonding pad, and a polymer insulation member. The semiconductor pattern may include a semiconductor device and first hole. The bonding pad may include a wiring pattern and plug. The wiring pattern may be formed on an upper face of the semiconductor pattern. The plug may extend from the wiring pattern to fill the first hole. The polymer insulation member may be formed on a lower face of the semiconductor pattern and may include a second hole exposing a lower end of the plug. A method of manufacturing a semiconductor package may include forming a first hole through a semiconductor substrate; forming a bonding pad and plug; attaching a supporting member to the upper face of the substrate; reducing a thickness of the substrate; forming a polymer insulation member on the lower face of the substrate; and cutting the substrate.

摘要翻译： 半导体封装可以包括半导体图案，接合焊盘和聚合物绝缘构件。 半导体图案可以包括半导体器件和第一孔。 接合焊盘可以包括布线​​图案和插头。 布线图案可以形成在半导体图案的上表面上。 插头可以从布线图案延伸以填充第一孔。 聚合物绝缘构件可以形成在半导体图案的下表面上，并且可以包括暴露插头的下端的第二孔。 制造半导体封装的方法可以包括通过半导体衬底形成第一孔; 形成焊盘和插头; 将支撑构件附接到所述基板的上表面; 减小基板的厚度; 在所述基板的下表面上形成聚合物绝缘部件; 并切割基板。

公开(公告)号：US07732328B2

公开(公告)日：2010-06-08

申请号：US11866942

申请日：2007-10-03

申请人： Yong-Chai Kwon ,  Dong-Ho Lee

发明人： Yong-Chai Kwon ,  Dong-Ho Lee

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L25/0657 ,  H01L23/481 ,  H01L23/5258 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05569 ,  H01L2224/13008 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor package structure and a method of fabricating the same are disclosed. A method of fabricating the semiconductor package structure can be characterized as including forming semiconductor chips on a semiconductor substrate. Each of the semiconductor chips includes chip pads. Through-vias are formed through the semiconductor chips. Redistribution structures and a chip selection interconnection layer are formed on the semiconductor chips, which connect the through-vias with the chip pads. The chip selection interconnection layers are patterned to form chip selection interconnection lines having different structures on at least one of the semiconductor chips. The semiconductor chips are stacked and electrically connected using the through-vias.

摘要翻译： 公开了一种半导体封装结构及其制造方法。 制造半导体封装结构的方法可以表征为包括在半导体衬底上形成半导体芯片。 每个半导体芯片包括芯片焊盘。 通孔通过半导体芯片形成。 重新分配结构和芯片选择互连层形成在将通孔与芯片焊盘连接的半导体芯片上。 芯片选择互连层被图案化以在至少一个半导体芯片上形成具有不同结构的芯片选择互连线。 半导体芯片使用贯通孔堆叠并电连接。