摘要:
In a replacement gate approach for forming high-k metal gate electrodes in semiconductor devices, a tapered configuration of the gate openings may be accomplished by using a tensile stressed dielectric material provided laterally adjacent to the gate electrode structure. Consequently, superior deposition conditions may be achieved while the tensile stress component may be efficiently used for the strain engineering in one type of transistor. Furthermore, an additional compressively stressed dielectric material may be applied after providing the replacement gate electrode structures.
摘要:
Contact elements of sophisticated semiconductor devices may be formed by lithographical patterning, providing a spacer element for defining the final critical width in combination with increasing a width of the contact opening prior to depositing the spacer material. The width may be increased, for instance by ion sputtering, thereby resulting in superior process conditions during the deposition of a contact metal. As a result, the probability of generating contact failures for contact elements having critical dimensions of approximately 50 nm and less may be significantly reduced.
摘要:
By forming a non-oxidizable liner in an isolation trench and selectively modifying the liner within the isolation trench, the stress characteristics of the isolation trench may be adjusted. In one embodiment, a high compressive stress may be obtained by treating the liner with an ion bombardment and subsequently exposing the device to an oxidizing ambient at elevated temperatures, thereby incorporating silicon dioxide into the non-oxidizable material. Hence, an increased compressive stress may be generated within the non-oxidizable layer.
摘要:
In a “via first/trench last” approach for forming metal lines and vias in a metallization system of a semiconductor device, a combination of two hard masks may be used, wherein the desired lateral size of the via openings may be defined on the basis of spacer elements, thereby resulting in significantly less demanding lithography conditions compared to conventional approaches.
摘要:
By forming a protection layer prior to the application of the planarization layer during a dual damascene strategy for first patterning vias and then trenches, enhanced etch fidelity may be accomplished. In other aspects disclosed herein, via openings and trenches may be patterned in separate steps, which may be accomplished by different etch behaviors of respective dielectric materials and/or the provision of an appropriate etch stop layer, while filling the via opening and the trench with a barrier material and a highly conductive metal may be achieved in a common fill sequence. Hence, the via opening may be formed on the basis of a reduced aspect ratio, while nevertheless providing a highly efficient overall process sequence.
摘要:
A method for the detection of leaks in a heat exchanger having discrete flow paths for working fluid and heat exchange fluid, respectively, the method comprises introduction of a detection fluid within one of said flow paths and allowing air to flow through the other of said flow paths causing the detection fluid to pass in different directions in said one flow path, and detecting any detection fluid which has leaked from one flow path to said other flow path.
摘要:
The present disclosure facilitates the interoperability between different local applications. Related local data objects are referenced via global objects or reference containers within a global data model or a global address space of an integration solution. The present disclosure assumes that the integration solution is per default in a consistent state, e.g., an engineered or initially configured global address space is regarded as consistent, and all software components that operate within this space assume that the information they access is valid and likewise consistent. The local applications are the only components that can interact with the global address space and introduce invalidations, they are continuously monitored for changes. Invalidation and subsequent synchronization or restoration of consistency is performed upon a particular triggering event related to a change in a local application object (such as an insertion or removal of an object or a modification of an attribute thereof) or related to a changing application or adapter status (component shutdown/startup).
摘要:
By forming a conductive material within an etch mask for an anisotropic etch process for patterning openings, such as vias, in a dielectric layer of a metallization structure, the probability for arcing events may be reduced, since excess charge may be laterally distributed. For example, an additional sacrificial conductive layer may be formed or an anti-reflecting coating (ARC) may be provided in the form of a conductive material in order to obtain the lateral charge distribution.
摘要:
By providing a protective layer in an intermediate manufacturing stage, an increased surface protection with respect to particle contamination and surface corrosion may be achieved. In some illustrative embodiments, the protective layer may be used during an electrical test procedure, in which respective contact portions are contacted through the protective layer, thereby significantly reducing particle contamination during a respective measurement process.
摘要:
Attribute consistency works on the comparison of a reference value against the online value of the attributes, which are retrieved from the corresponding system. In order to know which attributes need to be considered for consistency, a list of relevant attributes of each entity type in each application is stored together with the reference value of the entity. This attribute list is used by the consistency service. Therefore several attribute values of one entity in one system can be included in a combined “hash” value. At start-up or in the engineering phase, this reference value is computed out of the defined attribute list. At the time of a consistency check, the values of the attributes are read and a “hash” value is calculated with the same algorithm as the reference value. If those two values differ, an inconsistency occurred. The inventive method allows validating consistency of attributes of an entity in one of the participating applications. Any inconsistency can be propagated to all other participating applications which then may trigger functionality accordingly.