公开(公告)号：US20100072649A1

公开(公告)日：2010-03-25

申请号：US12562052

申请日：2009-09-17

Applicant: Eigo Kawakami ,  Kazuyuki Kasumi ,  Hideki Ina

Inventor： Eigo Kawakami ,  Kazuyuki Kasumi ,  Hideki Ina

IPC: B29C45/80

CPC classification number: G03F7/0002 ,  B82Y10/00 ,  B82Y40/00

Abstract: An imprint apparatus molds resin dispensed on a shot region of a substrate with a mold and forms a pattern of resin on the shot region. The apparatus includes a mold stage configured to hold the mold, a substrate stage configured to hold the substrate, a drive mechanism configured to change a relative positional relationship between the mold stage and the substrate stage in an X-Y plane that defines a coordinate of the shot region and a Z-axis direction perpendicular to the X-Y plane, and a controller. The controller is configured to control the drive mechanism so that the mold and the shot region perform relative vibration, in the X-Y plane, with respect to a relative position where the mold and the shot region align, and a distance between the mold and the shot region decreases in the Z-axis direction in parallel with the vibration, and the resin is molded by the mold.

Abstract translation: 压印装置用模具模制分配在基板的注射区域上的树脂，并在注射区域上形成树脂图案。 该装置包括：模具台，其被配置为保持模具;衬底台架，其被配置为保持基板;驱动机构，其构造成在限定射击坐标的XY平面内改变模具台架和基板台架之间的相对位置关系 区域和垂直于XY平面的Z轴方向，以及控制器。 控制器被配置为控制驱动机构，使得模具和射击区域在XY平面中相对于模具和射击区域对准的相对位置以及模具和射击之间的距离执行相对振动 Z轴方向的区域与振动平行地减小，树脂由模具成型。

公开(公告)号：US07531821B2

公开(公告)日：2009-05-12

申请号：US11851006

申请日：2007-09-06

Applicant: Nobuhito Suehira ,  Junichi Seki ,  Hideki Ina ,  Koichi Sentoku

Inventor： Nobuhito Suehira ,  Junichi Seki ,  Hideki Ina ,  Koichi Sentoku

IPC: G01N21/86

CPC classification number: G03F9/7088 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/7003 ,  G03F9/7042 ,  G06K9/325

Abstract: An imprint apparatus, comprising a first holder for holding a mold having an imprint pattern; a second holder for holding a workpiece to which the imprint pattern is transferred; a first illumination system for irradiating a mark for determining a position of the mold and a mark for determining a position of the workpiece with light; a first and second optical systems for imaging the marks for the mold and workpiece at a first and second observation points respectively; an imaging optical system; a first and second image pick-up devices for observing the marks for the mold and workpiece respectively; and at least one of a first drive mechanism for moving the first image pick-up device while following movement of the first observation point and a second drive mechanism for moving the second image pick-up device while following movement of the second observation point.

Abstract translation: 一种压印装置，包括用于保持具有印记图案的模具的第一保持器; 用于保持印刷图案被转印到的工件的第二保持器; 用于照射用于确定模具的位置的标记的第一照明系统和用于用光确定工件的位置的标记; 第一和第二光学系统，用于分别在第一和第二观察点成像用于模具和工件的标记; 成像光学系统; 分别用于观察模具和工件的标记的第一和第二图像拾取装置; 以及用于在跟随第一观察点的移动的同时移动第一图像拾取装置的第一驱动机构和用于在第二观察点的移动之前移动第二图像拾取装置的第二驱动机构中的至少一个。

公开(公告)号：US07435984B2

公开(公告)日：2008-10-14

申请号：US11456115

申请日：2006-07-07

Applicant: Koichi Sentoku ,  Gaku Takahashi ,  Hideki Ina ,  Yoshinori Miwa

Inventor： Koichi Sentoku ,  Gaku Takahashi ,  Hideki Ina ,  Yoshinori Miwa

IPC: G01N21/86

CPC classification number: G03F7/70883 ,  G02B13/143 ,  G02B17/0844 ,  G03F7/70275 ,  G03F9/7096

Abstract: An imaging optical system for imaging a pattern of an object plane onto an image plane includes a first imaging optical system for imaging at a first imaging position, the first imaging optical system having a magnification α in a vacuum atmosphere, and a second imaging optical system for imaging at a second imaging position, the second imaging optical system having a magnification β in the vacuum atmosphere, wherein when an environment in which the imaging optical system is placed changes from the vacuum atmosphere to an air atmosphere or vise versa, a direction of the first imaging position that moves along an optical axis is opposite to a direction of the second imaging position that moves along the optical axis.

Abstract translation: 用于将物平面图案成像到图像平面上的成像光学系统包括用于在第一成像位置成像的第一成像光学系统，具有在真空气氛中的α倍的第一成像光学系统和第二成像光学系统 为了在第二成像位置进行成像，第二成像光学系统在真空气氛中具有放大率β，其中当放置成像光学系统的环境从真空气氛改变到空气气氛或反之亦然时，方向 沿着光轴移动的第一成像位置与沿着光轴移动的第二成像位置的方向相反。

公开(公告)号：US07271882B2

公开(公告)日：2007-09-18

申请号：US11130073

申请日：2005-05-17

Applicant: Hideki Ina ,  Koichi Sentoku ,  Takahiro Matsumoto

Inventor： Hideki Ina ,  Koichi Sentoku ,  Takahiro Matsumoto

IPC: G01N21/00

CPC classification number: G01Q30/02 ,  B24B37/005 ,  B24B37/042 ,  B24B49/10 ,  B24B49/12 ,  G01B11/2441 ,  G01B21/20 ,  Y10S977/868

Abstract: A shape measuring method for measuring a shape of a surface of an object. The method includes a first measuring step for measuring the surface of the object by detecting light from the object, and a second measuring step for measuring the surface of the object by relatively scanning a probe and the object. A scanning speed changes on the basis of the result of the first measurement step.

Abstract translation: 一种用于测量物体表面形状的形状测量方法。 该方法包括：第一测量步骤，用于通过检测来自物体的光来测量物体的表面;以及第二测量步骤，用于通过相对扫描探针和物体来测量物体的表面。 基于第一测量步骤的结果，扫描速度改变。

公开(公告)号：US20060279004A1

公开(公告)日：2006-12-14

申请号：US11448009

申请日：2006-06-07

Applicant: Nobuhito Suehira ,  Junichi Seki ,  Masao Majima ,  Atsunori Terasaki ,  Hideki Ina

Inventor： Nobuhito Suehira ,  Junichi Seki ,  Masao Majima ,  Atsunori Terasaki ,  Hideki Ina

IPC: H01L23/544

CPC classification number: G03F9/7084 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/7076

Abstract: A pattern forming method for forming a pattern includes: preparing a mold 104 provided with a first surface including a pattern area 1000, a second surface located opposite from the first surface, and an alignment mark 2070 provided at a position at which the alignment mark 2070 is away from the second surface and is close to the first surface; contacting the pattern area 1000 of the mold 104 with the coating material disposed on a substrate 5000; obtaining information about positions of the mold 104 and the substrate 5000 by using the alignment mark 2070 and a mark 5300 provided to the substrate 5000 in a state in which the coating material is disposed on the substrate 5000 at a portion where the alignment mark 2070 and the substrate 5000 are opposite to each other; and effecting alignment of the substrate 5000 with the mold 104 with high accuracy on the basis of the information.

Abstract translation: 用于形成图案的图案形成方法包括：准备设置有包括图案区域1000的第一表面的模具104，与第一表面相对的第二表面和设置在对准标记2070的位置处的对准标记2070 远离第二个表面并且靠近第一个表面; 使模具104的图案区域1000与设置在基底5000上的涂层材料接触; 通过使用对准标记2070和设置在基板5000上的标记5300，获得关于模具104和基板5000的位置的信息，其中涂布材料在对准标记2070和 基板5000彼此相对; 并基于该信息高精度地进行基板5000与模具104的对准。

公开(公告)号：US07103497B2

公开(公告)日：2006-09-05

申请号：US11190168

申请日：2005-07-27

Applicant: Takahiro Matsumoto ,  Hideki Ina

Inventor： Takahiro Matsumoto ,  Hideki Ina

IPC: G01B11/00

CPC classification number: G03F9/7088 ,  G03F7/70633 ,  G03F9/7003 ,  G03F9/7046 ,  G03F9/7065 ,  G03F9/7069 ,  G03F9/7092

Abstract: A position detection method for detecting the position of marks includes the following steps: a step for detecting first information relating to the position of the mark by detecting light from the mark under first measurement conditions; a step for detecting second information relating to the position of the mark by detecting light from the mark under second measurement conditions which differ from the first measurement conditions; and a step for detecting the position of the mark based on the first and second information, thereby providing a high-precision position detecting method and device serving as an alignment or overlaying detection device in an exposure apparatuses used in manufacturing semiconductor devices, wherein position detection precision is not lost even in the event that the alignment marks are not symmetrical or there are irregularities in the non-symmetry of multiple alignment marks within the same wafer.

Abstract translation: 用于检测标记位置的位置检测方法包括以下步骤：用于通过在第一测量条件下检测来自标记的光来检测与标记的位置有关的第一信息的步骤; 通过在与第一测量条件不同的第二测量条件下检测来自标记的光来检测与标记的位置有关的第二信息的步骤; 以及基于第一和第二信息来检测标记的位置的步骤，从而在用于制造半导体器件的曝光装置中提供用于对准或重叠检测装置的高精度位置检测方法和装置，其中位置检测 即使在对准标记不对称或在同一晶片内的多个对准标记的非对称性中存在不规则性的情况下，精度也不会降低。

公开(公告)号：US20060076488A1

公开(公告)日：2006-04-13

申请号：US11249295

申请日：2005-10-12

Applicant: Hideki Ina

Inventor： Hideki Ina

IPC: G21K7/00

CPC classification number: G01Q20/02 ,  G01Q70/06 ,  G03F9/7034 ,  G03F9/7061 ,  G03F9/7088

Abstract: An apparatus measures a surface position of an object. The apparatus includes an array of members, each of which comprises a probe for an atomic force from the object and is configured to move in accordance with the atomic force, an optical system configured to project a measurement light onto each of the array of members and to receive the measurement light reflected off each of the array of members, and a detector configured to detect the measurement light directed through the optical system with respect to each of the array of members.

公开(公告)号：US06999893B2

公开(公告)日：2006-02-14

申请号：US10662408

申请日：2003-09-16

Applicant: Takahiro Matsumoto ,  Hideki Ina

Inventor： Takahiro Matsumoto ,  Hideki Ina

IPC: G01C3/00

CPC classification number: G03F9/7088 ,  G03F7/70633 ,  G03F9/7003 ,  G03F9/7046 ,  G03F9/7065 ,  G03F9/7069 ,  G03F9/7092

Abstract: A position detection method for detecting the position of marks comprises the following steps: a step for detecting first information relating to the position of the mark by detecting light from the mark under first measurement conditions; a step for detecting second information relating to the position of the mark by detecting light from the mark under second measurement conditions which differ from the first measurement conditions; and a step for detecting the position of the mark based on the first and second information, thereby providing a high-precision position detecting method and device serving as an alignment or overlaying detection device in an exposure apparatuses used in manufacturing semiconductor devices, wherein position detection precision is not lost even in the event that the alignment marks are not symmetrical or there are irregularities in the non-symmetry of multiple alignment marks within the same wafer.

Abstract translation: 用于检测标记位置的位置检测方法包括以下步骤：通过在第一测量条件下检测来自标记的光来检测与标记的位置有关的第一信息的步骤; 通过在与第一测量条件不同的第二测量条件下检测来自标记的光来检测与标记的位置有关的第二信息的步骤; 以及用于基于第一和第二信息检测标记的位置的步骤，从而在用于制造半导体器件的曝光装置中提供用作对准或重叠检测装置的高精度位置检测方法和装置，其中位置检测 即使在对准标记不对称或在同一晶片内的多个对准标记的非对称性中存在不规则性的情况下，精度也不会降低。

公开(公告)号：US20050270504A1

公开(公告)日：2005-12-08

申请号：US11142964

申请日：2005-06-01

Applicant: Atsushi Takagi ,  Hideki Ina ,  Koichi Sentoku ,  Hiroshi Morohoshi

Inventor： Atsushi Takagi ,  Hideki Ina ,  Koichi Sentoku ,  Hiroshi Morohoshi

IPC: G03F7/20 ,  G03B27/68 ,  H01L21/027

CPC classification number: G03F7/706

Abstract: A measurement method for measuring a distortion of a projection optical system that projects a pattern, used by an exposure apparatus that exposes the reticle pattern onto an object to be exposed, the measurement method includes the steps of a first exposing step for exposing a mark pattern onto the object to be exposed, the mark pattern having a mark on or near an optical axis of the projection optical system and a mark beside the optical axis, and being arranged at a position of the reticle, a second exposing step for only exposing a mark on or near the optical axis of the projection optical system in the mark pattern, measuring step for measuring a shape of the mark formed on the object to be exposed via the first and second exposing steps, and calculating step for calculating the distortion of the projection optical system from the shape of the mark measured by the measuring step.

Abstract translation: 一种测量方法，用于测量投影光学系统的变形，所述投影光学系统将曝光所述掩模版图案的曝光装置所使用的图案投影到待曝光的物体上，所述测量方法包括以下步骤：第一曝光步骤，用于曝光标记图案 在待曝光的物体上，标记图案在投影光学系统的光轴上或其附近具有标记，并且在光轴旁边具有标记，并且被布置在光罩的位置处，第二曝光步骤仅用于曝光 在标记图案中的投影光学系统的光轴上或附近标记的测量步骤，用于测量经由第一和第二曝光步骤在待曝光的物体上形成的标记的形状的测量步骤，以及用于计算第 投影光学系统从由测量步骤测量的标记的形状。

公开(公告)号：US06965435B2

公开(公告)日：2005-11-15

申请号：US10207799

申请日：2002-07-31

Applicant: Hideki Ina

Inventor： Hideki Ina

IPC: G01B9/02 ,  G01B11/24 ,  G02B27/28

CPC classification number: G01B9/02039 ,  G01B9/02057 ,  G01B11/2441 ,  G01B2290/70

Abstract: Disclosed is an interferometer that enables high-speed and high-precision measurement of a surface shape of an article and a method of producing such interferometer. Also disclosed is a method of measuring a surface shape of an article by use of such interferometer. The interferometer includes an optical system having an optical element being effective to make, into an aspherical wave, a wavefront of light to be projected on the article to be inspected, and also being arranged to be replaceable by another optical element.

Abstract translation: 公开了一种能够高速高精度地测量制品的表面形状的干涉仪，以及这种干涉仪的制造方法。 还公开了通过使用这种干涉仪来测量物品的表面形状的方法。 干涉仪包括具有光学元件的光学系统，该光学元件有效地使非球面波形能够投影到被检查物品上的波前，并且还被布置成可由另一光学元件替代。