公开(公告)号：US20150053388A1

公开(公告)日：2015-02-26

申请号：US14528083

申请日：2014-10-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Amilcar R. ARVELO ,  Mark A. BRANDON ,  Levi A. CAMPBELL ,  Michael J. ELLSWORTH, JR. ,  Randall G. KEMINK ,  Eric J. McKEEVER

IPC: F28F1/12 ,  H05K7/20 ,  B23P15/26

CPC classification number: F28F1/12 ,  B23P15/26 ,  F28F1/00 ,  H05K7/20763 ,  H05K7/20772 ,  Y10T29/4935

Abstract: Methods of fabricating cooling apparatuses are provided, which include providing a thermal transfer structure configured to couple to and cool one or more electronic components. The thermal transfer structure includes a thermal spreader, and at least one coolant-carrying tube coupled to the thermal spreader. The coolant-carrying tube(s) includes multiple tube lengths disposed substantially in a common plane, and an out-of-plane tube bend. The out-of-plane tube bend is couples in fluid communication first and second tube lengths of the multiple tube lengths, and extends out-of-plane from the multiple tube lengths disposed in the common plane. The first and second tube lengths may be spaced apart, with a third tube length disposed between them, and the coolant-carrying tube(s) further includes an in-plane tube bend which couples in fluid communication the third tube length and a fourth tube length of the multiple tube lengths.

Abstract translation: 提供了制造冷却装置的方法，其包括提供被配置为耦合和冷却一个或多个电子部件的热传递结构。 热传递结构包括散热器和耦合到散热器的至少一个冷却剂供给管。 冷却剂输送管包括基本上设置在公共平面中的多个管长度和外平面管弯曲。 平面外弯管耦合在多个管长度的第一和第二管段的流体连通中，并且从设置在公共平面中的多个管段延伸出来。 第一和第二管长度可以间隔开，第三管长度设置在它们之间，并且冷却剂输送管还包括平面内的管弯曲部，其将流体连通第三管长度和第四管 多管长度。

公开(公告)号：US20140246174A1

公开(公告)日：2014-09-04

申请号：US13782384

申请日：2013-03-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Amilcar R. ARVELO ,  Mark A. BRANDON ,  Levi A. CAMPBELL ,  Michael J. ELLSWORTH, JR. ,  Eric J. McKEEVER

IPC: F28F1/00 ,  B23P15/26

CPC classification number: F28F1/12 ,  B23P15/26 ,  F28F1/00 ,  H05K7/20763 ,  H05K7/20772 ,  Y10T29/4935

Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to and cool one or more electronic components. The thermal transfer structure includes a thermal spreader, and at least one coolant-carrying tube coupled to the thermal spreader. The coolant-carrying tube(s) includes multiple tube lengths disposed substantially in a common plane, and an out-of-plane tube bend. The out-of-plane tube bend is couples in fluid communication first and second tube lengths of the multiple tube lengths, and extends out-of-plane from the multiple tube lengths disposed in the common plane. The first and second tube lengths may be spaced apart, with a third tube length disposed between them, and the coolant-carrying tube(s) further includes an in-plane tube bend which couples in fluid communication the third tube length and a fourth tube length of the multiple tube lengths.

Abstract translation: 提供冷却装置和冷却剂冷却的电子组件，其包括被配置为耦合到并冷却一个或多个电子部件的热传递结构。 热传递结构包括散热器和耦合到散热器的至少一个冷却剂供给管。 冷却剂输送管包括基本上设置在公共平面中的多个管长度和外平面管弯曲。 平面外弯管耦合在多个管长度的第一和第二管段的流体连通中，并且从设置在公共平面中的多个管段延伸出来。 第一和第二管长度可以间隔开，第三管长度设置在它们之间，并且冷却剂输送管还包括平面内的管弯曲部，其将流体连通第三管长度和第四管 多管长度。

公开(公告)号：US20140158341A1

公开(公告)日：2014-06-12

申请号：US13783628

申请日：2013-03-04

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: F28F27/00

CPC classification number: F16K31/002 ,  F28F3/12 ,  F28F27/00 ,  F28F27/02 ,  H05K7/20781 ,  H05K7/20836

Abstract: Methods are presented for facilitating dissipation of heat generated by one or more electronic components. The methods include providing a coolant-cooled heat sink and a thermostat-controlled valve. The heat sink includes one or more coolant-carrying channels and one or more valve wells intersecting the channels. The thermostat-controlled valve is disposed, at least partially, within a respective valve well so as to intersect a respective coolant-carrying channel, and includes a valve disk and a thermal-sensitive actuator mechanically coupled to rotate the valve disk. The valve disk is rotatable between an open position where coolant is allowed to flow through the respective coolant-carrying channel, and a closed position where coolant is blocked from flowing through the respective channel. The actuator rotates the valve disk between the open position and the closed position, dependent on heating of the thermal-sensitive actuator by the electronic component(s).

Abstract translation: 提出了用于促进由一个或多个电子部件产生的热量消散的方法。 这些方法包括提供冷却剂冷却的散热器和恒温控制阀。 散热器包括一个或多个冷却剂承载通道和与通道相交的一个或多个阀井。 恒温控制阀至少部分地设置在相应的阀井内，以与相应的冷却剂承载通道相交，并且包括阀盘和机械耦合以旋转阀盘的热敏致动器。 阀盘可以在允许冷却剂流过相应的冷却剂输送通道的打开位置和阻止冷却剂流过相应通道的关闭位置之间旋转。 执行器根据电子部件对热敏致动器的加热，使阀盘在打开位置和关闭位置之间旋转。

公开(公告)号：US20140126151A1

公开(公告)日：2014-05-08

申请号：US13781993

申请日：2013-03-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: H05K7/20

CPC classification number: H05K7/2079 ,  G05D23/1934 ,  G06F1/206 ,  H05K7/20836

Abstract: Methods are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits.

Abstract translation: 提供了用于自动冷却剂流控制的方法，例如，促进多个不同电子系统的冷却。 这些方法包括例如自动控制冷却剂流到多个冷却剂回路，以及冷却剂回路的冷却剂回路i：自动确定传递到冷却剂回路i中的冷却剂的热负荷，并自动控制冷却剂流过冷却剂 电路i基于传输到冷却剂的确定的热负荷。 不同的冷却剂回路可以具有相同或不同的冷却剂流动阻抗，并且可以使用用于不同回路的不同热负荷 - 冷却剂范围来控制通过不同冷却剂回路的流量。

公开(公告)号：US20140068943A1

公开(公告)日：2014-03-13

申请号：US13788798

申请日：2013-03-07

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: B21D53/02

CPC classification number: B21D53/02 ,  F25B21/02 ,  F25B2321/0252 ,  H05K7/2079 ,  Y10T29/49359

Abstract: Thermoelectric-enhanced air and liquid cooling of an electronic system is facilitated by providing a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink.

Abstract translation: 提供一种电子系统的热电增强空气和液体冷却是通过提供一种冷却装置来实现的，所述冷却装置包括与电子部件热连通的液冷结构，以及液体 - 液体和空气 - 液体热交换器 通过冷却剂回路串联流体连通，其包括并联连接的第一和第二回路部分。 液冷结构经由第一回路部分供应冷却剂，热电阵列设置有第一和第二回路部分与阵列的第一和第二侧热接触。 热电阵列用于将热量从穿过第一环路部分的冷却剂传递到穿过第二环路部分的冷却剂，并且在冷却剂通过液冷结构之前冷却通过第一环部分的冷却剂。 通过第一和第二回路部分的冷却剂通过串联耦合的热交换器，其中一个用作散热器。

公开(公告)号：US20140053575A1

公开(公告)日：2014-02-27

申请号：US14066769

申请日：2013-10-30

Applicant: International Business Machines Corporation

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Evan G. COLGAN ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC: F25B21/02 ,  B23P15/26

CPC classification number: F25B21/02 ,  B23P15/26 ,  F25B43/00 ,  F25B43/003 ,  F25B2400/01 ,  H05K7/20809 ,  H05K7/20836 ,  Y10T29/49359

Abstract: Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter. The separator may further include a refrigerant hot filter coupled to a hot side of the thermoelectric array for further filtering the refrigerant.

Abstract translation: 提供了便于冷却电子部件的装置和方法。 该装置包括蒸气压缩式制冷系统，其包括膨胀部件，蒸发器，压缩机和流体连通的冷凝器。 蒸发器与电子部件联接并冷却。 该装置还包括与制冷剂流动路径流体连通的污染物分离器。 分离器包括制冷剂冷滤器和热电阵列。 通过制冷剂流路的制冷剂的至少一部分通过冷过滤器，并且热电阵列向冷过滤器提供冷却以冷却通过过滤器的制冷剂。 通过冷却通过过滤器的制冷剂，污染物从制冷剂中固化，并沉积在冷过滤器中。 分离器还可以包括耦合到热电阵列的热侧的制冷剂热过滤器，用于进一步过滤制冷剂。

公开(公告)号：US20200178422A1

公开(公告)日：2020-06-04

申请号：US16749134

申请日：2020-01-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: H05K7/20 ,  G05B15/02 ,  G05D23/19

Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

公开(公告)号：US20170303429A1

公开(公告)日：2017-10-19

申请号：US15131180

申请日：2016-04-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Milnes P. DAVID ,  Dustin W. DEMETRIOU ,  Michael J. ELLSWORTH, JR.

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20145 ,  G06F1/20 ,  G06F1/203 ,  H05K7/20409 ,  H05K7/20727 ,  H05K7/20745

Abstract: Electronics cooling assemblies are provided which include an air-cooled heat sink, an auxiliary air-moving device, and an airflow-blocking mechanism. The heat sink couples to one or more heat-generating electronic components, and dissipates heat from the electronic component(s) to a cooling airflow passing across the heat sink. The auxiliary air-moving device provides, when active, an increased flow rate of the cooling airflow across the heat sink. The airflow-blocking mechanism toggles between a passive airflow position and an active airflow position. In the passive airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the heat sink without passing through the air-moving device, and in the active airflow position, the airflow-blocking mechanism allows the cooling airflow to exhaust from the auxiliary air-moving device.

公开(公告)号：US20160345466A1

公开(公告)日：2016-11-24

申请号：US14717009

申请日：2015-05-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Amilcar R. ARVELO ,  Alan F. BENNER ,  Michael J. ELLSWORTH, JR. ,  Eric J. McKEEVER

IPC: H05K7/20 ,  F16L21/08

CPC classification number: H05K7/20627 ,  F16L15/08 ,  F16L37/107 ,  H05K7/20272 ,  H05K7/20772

Abstract: Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting.

公开(公告)号：US20160143185A1

公开(公告)日：2016-05-19

申请号：US14546159

申请日：2014-11-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Milnes P. DAVID ,  Dustin W. DEMETRIOU ,  Michael J. ELLSWORTH, JR. ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC: H05K7/20

CPC classification number: H05K7/20218 ,  H01L23/34 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20254 ,  H05K7/20281 ,  H05K7/20327 ,  H05K7/2039 ,  H05K7/20436 ,  H05K7/20509 ,  H05K7/20772 ,  H01L2924/00

Abstract: Liquid-cooled heat sink assemblies are provided which include: a thermally conductive base structure having a sidewall surface and a main heat transfer surface; and a manifold structure attached to the base structure, with the base structure residing at least in part within a recess in the manifold structure. Together, the base and manifold structures define a coolant-carrying compartment through which liquid coolant flows, at least in part, in a direction substantially parallel to the main heat transfer surface of the base structure, and at least one of the sidewall surface of the thermally conductive base structure or an opposing surface thereto of the manifold structure includes a continuous groove. A sealing member is disposed, at least in part, within the continuous groove, and provides a fluid-tight seal between the thermally conductive base structure and the manifold structure.