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公开(公告)号:US07198561B2
公开(公告)日:2007-04-03
申请号:US11321006
申请日:2005-12-28
申请人: Hung Chih Chen , Jeonghoon Oh , Steven M. Zuniga
发明人: Hung Chih Chen , Jeonghoon Oh , Steven M. Zuniga
IPC分类号: B24B29/00
CPC分类号: B24B37/30
摘要: A flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus has a central portion with an outer surface providing a substrate receiving surface, a perimeter portion for connecting the central portion to a base of the carrier head, and at least one flap extending from an inner surface of the central portion. The flap includes a laterally extending first section and a vertically extending second section connecting the laterally extending first section to the central portion.
摘要翻译: 用于与基底化学机械抛光装置的载体头一起使用的柔性膜具有中心部分,其外表面提供基底接收表面,周边部分用于将中心部分连接到载体头部的基部,以及至少一个 翼片从中心部分的内表面延伸。 翼片包括横向延伸的第一部分和将横向延伸的第一部分连接到中心部分的垂直延伸的第二部分。
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公开(公告)号:US20200001427A1
公开(公告)日:2020-01-02
申请号:US16448980
申请日:2019-06-21
申请人: Hari Soundararajan , Shou-Sung Chang , Haosheng Wu , Jianshe Tang , Jeonghoon Oh , Rajeev Bajaj , Andrew Siordia
发明人: Hari Soundararajan , Shou-Sung Chang , Haosheng Wu , Jianshe Tang , Jeonghoon Oh , Rajeev Bajaj , Andrew Siordia
IPC分类号: B24B37/015 , B24B57/02 , B24B37/20
摘要: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface. The body supports a thermal control module positioned over the polishing pad.
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公开(公告)号:US09748125B2
公开(公告)日:2017-08-29
申请号:US13755891
申请日:2013-01-31
申请人: Banqiu Wu , Nag B. Patibandla , Toshiaki Fujita , Ralf Hofmann , Pravin K. Narwankar , Jeonghoon Oh , Srinivas Satya , Li-Qun Xia
发明人: Banqiu Wu , Nag B. Patibandla , Toshiaki Fujita , Ralf Hofmann , Pravin K. Narwankar , Jeonghoon Oh , Srinivas Satya , Li-Qun Xia
IPC分类号: C23C16/00 , H01L21/00 , H01L21/673 , H01L21/677 , C23C16/455 , C23C16/458 , C23C16/54
CPC分类号: H01L21/673 , C23C16/45546 , C23C16/4558 , C23C16/4584 , C23C16/54 , H01L21/67346 , H01L21/677
摘要: A processing chamber having a plurality of movable substrate carriers stacked therein for continuously processing a plurality of substrates is provided. The movable substrate carrier is capable of being transported from outside of the processing chamber, e.g., being transferred from a load luck chamber, into the processing chamber and out of the processing chamber, e.g., being transferred into another load luck chamber. Process gases delivered into the processing chamber are spatially separated into a plurality of processing slots, and/or temporally controlled. The processing chamber can be part of a multi-chamber substrate processing system.
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公开(公告)号:US20130196078A1
公开(公告)日:2013-08-01
申请号:US13754771
申请日:2013-01-30
申请人: Joseph Yudovsky , Nag B. Patibandla , Pravin K. Narwankar , Li-Qun Xia , Toshiaki Fujita , Ralf Hofmann , Jeonghoon Oh , Srinivas Satya , Banqiu Wu
发明人: Joseph Yudovsky , Nag B. Patibandla , Pravin K. Narwankar , Li-Qun Xia , Toshiaki Fujita , Ralf Hofmann , Jeonghoon Oh , Srinivas Satya , Banqiu Wu
IPC分类号: C23C16/458
CPC分类号: C23C16/4584 , C23C16/45519 , C23C16/45551 , C23C16/54 , H01L21/67742
摘要: A substrate processing system for processing multiple substrates is provided and generally includes at least one substrate processing platform and at least one substrate staging platform. The substrate processing platform includes a rotary track system capable of supporting multiple substrate support assemblies and continuously rotating the substrate support assemblies, each carrying a substrate thereon. Each substrate is positioned on a substrates support assembly disposed on the rotary track system and being processed through at least one shower head station and at least one buffer station, which are positioned atop the rotary track system of the substrate processing platform. Multiple substrates disposed on the substrate support assemblies are processed in and out the substrate processing platform. The substrate staging platform includes at least one dual-substrate processing station, each dual-substrate processing station includes two substrate support assemblies for supporting two substrates thereon.
摘要翻译: 提供了用于处理多个基板的基板处理系统,并且通常包括至少一个基板处理平台和至少一个基板分段平台。 基板处理平台包括能够支撑多个基板支撑组件并且连续旋转基板支撑组件的旋转轨道系统,每个基板支撑组件在其上承载基板。 每个基板定位在设置在旋转轨道系统上的基板支撑组件上,并且通过位于基板处理平台的旋转轨道系统顶部的至少一个喷头站和至少一个缓冲站进行处理。 设置在基板支撑组件上的多个基板在基板处理平台内进出处理。 衬底分级平台包括至少一个双衬底处理站,每个双衬底处理站包括用于在其上支撑两个衬底的两个衬底支撑组件。
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公开(公告)号:US08033895B2
公开(公告)日:2011-10-11
申请号:US11780335
申请日:2007-07-19
IPC分类号: B24B7/22
CPC分类号: B24B37/32 , H01L21/68721 , Y10T292/205
摘要: Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.
摘要翻译: 描述具有弯曲表面的保持环。 当在抛光过程中使用保持环时,弯曲表面可防止固定磨料抛光垫的损坏。 弯曲表面位于环的底表面上,例如沿着形成在环的底部的通道的外径和/或沿着通道的侧壁。
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公开(公告)号:US20110212672A1
公开(公告)日:2011-09-01
申请号:US13104711
申请日:2011-05-10
IPC分类号: B24D11/00
CPC分类号: B24B37/30 , Y10T428/24174 , Y10T428/24182
摘要: A carrier head that has a base assembly, a retaining ring assembly, a carrier ring, and a flexible membrane is described. The flexible membrane has a main portion and an outer annular portion, wherein a junction between the main portion and the outer annular portion comprises a peripheral edge hinge and an annular recess above the hinge along the outer wall of the outer annular portion.
摘要翻译: 描述了具有基座组件,保持环组件,载体环和柔性膜的承载头。 柔性膜具有主要部分和外部环形部分,其中主要部分和外部环形部分之间的接合处包括周边边缘铰链和沿着外部环形部分的外壁的铰链上方的环形凹部。
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公开(公告)号:US07950985B2
公开(公告)日:2011-05-31
申请号:US12791808
申请日:2010-06-01
IPC分类号: B24B5/35
CPC分类号: B24B37/30 , Y10T428/24174 , Y10T428/24182
摘要: A carrier head that has a base assembly, a retaining ring assembly, a carrier ring, and a flexible membrane is described. The flexible membrane has a main portion and an outer annular portion, wherein a junction between the main portion and the outer annular portion comprises a peripheral edge hinge and an annular recess above the hinge along the outer wall of the outer annular portion.
摘要翻译: 描述了具有基座组件,保持环组件,载体环和柔性膜的承载头。 柔性膜具有主要部分和外部环形部分,其中主要部分和外部环形部分之间的接合处包括周边边缘铰链和沿着外部环形部分的外壁的铰链上方的环形凹部。
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公开(公告)号:US20100240287A1
公开(公告)日:2010-09-23
申请号:US12791808
申请日:2010-06-01
IPC分类号: B24B5/35
CPC分类号: B24B37/30 , Y10T428/24174 , Y10T428/24182
摘要: A carrier head that has a base assembly, a retaining ring assembly, a carrier ring, and a flexible membrane is described. The flexible membrane has a main portion and an outer annular portion, wherein a junction between the main portion and the outer annular portion comprises a peripheral edge hinge and an annular recess above the hinge along the outer wall of the outer annular portion.
摘要翻译: 描述了具有基座组件,保持环组件,载体环和柔性膜的承载头。 柔性膜具有主要部分和外部环形部分,其中主要部分和外部环形部分之间的接合处包括周边边缘铰链和沿着外部环形部分的外壁的铰链上方的环形凹部。
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公开(公告)号:US20090278081A1
公开(公告)日:2009-11-12
申请号:US12411261
申请日:2009-03-25
申请人: Hichem M'Saad , Lakshmanan Karuppiah , Hung Chih Chen , Jeonghoon Oh , Robert Lum , Stan D. Tsai , Cassio Conceicao , Ashish Bhatnagar , Michael Perry , Kadthala Narendrnath , Yosi Shacham-Diamand
发明人: Hichem M'Saad , Lakshmanan Karuppiah , Hung Chih Chen , Jeonghoon Oh , Robert Lum , Stan D. Tsai , Cassio Conceicao , Ashish Bhatnagar , Michael Perry , Kadthala Narendrnath , Yosi Shacham-Diamand
IPC分类号: C09K13/00
CPC分类号: B24B37/24
摘要: A method for forming a polishing media and an article of manufacture is described. The article of manufacture may be formed into a polishing article. The polishing article includes a polymer base material and a plurality of nano-scale structures disposed in or on the polymer base material.
摘要翻译: 描述了用于形成抛光介质和制造物品的方法。 制品可以形成为抛光制品。 抛光制品包括聚合物基材和设置在聚合物基材中或其上的多个纳米级结构。
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公开(公告)号:US20080119120A1
公开(公告)日:2008-05-22
申请号:US11862096
申请日:2007-09-26
IPC分类号: B24B29/00
摘要: A carrier head that has a housing, a base assembly, a retaining ring, a carrier ring, and a flexible membrane is described. The base assembly is vertically movable relative to the housing. The retaining ring is connected to and vertically movable relative to the base assembly and has a lower surface configured to contact a polishing pad and an inner surface configured to circumferentially surround the edge of a substrate to retain the substrate. The carrier ring is connected to and vertically fixed relative to the base assembly, circumferentially surrounds the retaining ring to prevent lateral motion of the retaining ring, and has a bottom surface configured to contact a polishing pad.
摘要翻译: 描述了具有壳体,基座组件,保持环,载体环和柔性膜的承载头。 基座组件相对于外壳可垂直移动。 保持环相对于基座组件连接并且可垂直移动,并且具有被配置为接触抛光垫的下表面和被配置为周向围绕衬底的边缘以保持衬底的内表面。 承载环相对于基座组件连接并且垂直固定,周向地包围保持环以防止保持环的横向运动,并且具有构造成接触抛光垫的底表面。
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