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    ABRASIVE COMPOSITION FOR ELECTROCHEMICAL MECHANICAL POLISHING
    2.
    发明申请
    ABRASIVE COMPOSITION FOR ELECTROCHEMICAL MECHANICAL POLISHING 审中-公开
    电化学机械抛光磨料组合物

    公开(公告)号：US20070254485A1

    公开(公告)日：2007-11-01

    申请号：US11735801

    申请日：2007-04-16

    申请人： Daxin Mao ,  You Wang ,  Junzi Zhao ,  Stan D. Tsai ,  Renhe Jia ,  Jie Diao ,  Yongqi Hu ,  Lakshmanan Karuppiah

    发明人： Daxin Mao ,  You Wang ,  Junzi Zhao ,  Stan D. Tsai ,  Renhe Jia ,  Jie Diao ,  Yongqi Hu ,  Lakshmanan Karuppiah

    IPC分类号： H01L21/461 ,  H01L21/302 ,  C09K13/00

    CPC分类号： H01L21/32125 ,  B23H5/08 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  C25F3/02 ,  H01L21/7684

    摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In certain embodiments, a composition for processing a substrate having a conductive material layer disposed thereon is provided wherein the composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, an amount of a pH adjusting agent sufficient to provide a pH between about 3 and about 10, anionic polymer abrasive particles, and a solvent. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

    摘要翻译： 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在某些实施方案中，提供了一种用于处理其上设置有导电材料层的基材的组合物，其中所述组合物包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，一定量的pH调节剂， 提供约3至约10个的阴离子聚合物研磨剂颗粒和溶剂之间的pH。 该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除导电材料层。

    Process for high copper removal rate with good planarization and surface finish
    3.
    发明申请
    Process for high copper removal rate with good planarization and surface finish 审中-公开
    具有良好的平坦化和表面光洁度的高铜去除率的工艺

    公开(公告)号：US20070235344A1

    公开(公告)日：2007-10-11

    申请号：US11399560

    申请日：2006-04-06

    申请人： Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Yongqi Hu ,  Zhihong Wang ,  Jie Diao ,  Stan D Tsai ,  Alpay Yilmaz ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

    发明人： Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Yongqi Hu ,  Zhihong Wang ,  Jie Diao ,  Stan D Tsai ,  Alpay Yilmaz ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

    IPC分类号： B23H5/08

    CPC分类号： B23H5/08 ,  C25F3/02 ,  H01L21/32125

    摘要： A method for electrochemical mechanical polishing (ECMP) is disclosed. The polishing rate and surface finish of the layer on the wafer are improved by controlling the surface speed of both the platen and head, controlling the current applied to the pad, and preselecting the density of the perforations on the fully conductive polishing pad. ECMP produces much higher removal rates, good surface finishes, and good planarization efficiency at a lower down force. Generally, increasing the surface speed of both the platen and the head will increase the surface smoothness. Also, increasing the current density on the wafer will increase the surface smoothness. There is virtually no difference in the smoothness of the wafer surface between the center, middle, and edge of the wafer. For copper, removal rates of 10,000 Å/min and greater can be achieved.

    摘要翻译： 公开了一种用于电化学机械抛光（ECMP）的方法。 通过控制压板和头部的表面速度，控制施加到垫的电流以及预选在全导电抛光垫上的穿孔密度来提高晶片上层的抛光速率和表面光洁度。 ECMP在较低的下压力下产生高得多的去除率，良好的表面光洁度和良好的平面化效率。 通常，增加压板和头部的表面速度将增加表面平滑度。 此外，增加晶片上的电流密度将增加表面平滑度。 在晶片的中心，中间和边缘之间的晶片表面的平滑度几乎没有差别。 对于铜，可以实现10,000 / min以上的去除率。

    Method and apparatus for electroprocessing a substrate with edge profile control
    4.
    发明授权
    Method and apparatus for electroprocessing a substrate with edge profile control 失效
    用边缘轮廓控制对基底进行电处理的方法和装置

    公开(公告)号：US07422982B2

    公开(公告)日：2008-09-09

    申请号：US11483843

    申请日：2006-07-07

    申请人： You Wang ,  Jie Diao ,  Stan D. Tsai ,  Lakshmanan Karuppiah

    发明人： You Wang ,  Jie Diao ,  Stan D. Tsai ,  Lakshmanan Karuppiah

    IPC分类号： H01L21/302 ,  H01L21/461

    CPC分类号： B23H5/08 ,  C25D17/10 ,  C25D17/12 ,  C25D21/12

    摘要： A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially inward of the first electrode with a bias that is different than the bias applied to the first electrode. In one embodiment, the first electrode is coated with an inert material and in this way the same polish rate is obtained with a lower potential level applied to the first electrode.

    摘要翻译： 提供了一种用于电子处理衬底的方法和装置。 在一个实施例中，用于对衬底进行电处理的方法包括以下步骤：偏置第一电极以在电极和衬底之间建立第一电处理区，并且以不同于第一电极的偏压来偏置设置在第一电极的径向内侧的第二电极 施加到第一电极的偏压。 在一个实施例中，第一电极被涂覆有惰性材料，并且以这种方式获得相同的抛光速率，并且施加到第一电极的较低电位电平。

    Roller assembly for a brush cleaning device in a cleaning module
    8.
    发明授权
    Roller assembly for a brush cleaning device in a cleaning module 有权
    用于清洁模块中的刷清洁装置的辊组件

    公开(公告)号：US08250695B2

    公开(公告)日：2012-08-28

    申请号：US12573500

    申请日：2009-10-05

    申请人： Lakshmanan Karuppiah ,  Dan Zhang ,  Simon Yavelberg ,  Jim K. Atkinson ,  Hung Chih Chen ,  Noel Manto ,  Jonathan Domin

    发明人： Lakshmanan Karuppiah ,  Dan Zhang ,  Simon Yavelberg ,  Jim K. Atkinson ,  Hung Chih Chen ,  Noel Manto ,  Jonathan Domin

    IPC分类号： A47L25/00

    CPC分类号： B08B1/04

    摘要： Embodiments described herein relate to an apparatus and method for a roller assembly that may be utilized in a brush cleaning module. In one embodiment, a roller assembly is described. The roller assembly includes an annular groove having at least two substantially parallel opposing sidewalls adapted to contact the major surfaces of a substrate along a periphery of the substrate, each of the opposing sidewalls comprising a compressible material having a pre-compressed dimension that is less than a thickness of the periphery of the substrate.

    摘要翻译： 本文所述的实施例涉及可用于刷清洁模块中的用于辊组件的装置和方法。 在一个实施例中，描述了辊组件。 辊组件包括具有至少两个基本上平行的相对侧壁的环形凹槽，所述至少两个基本上平行的相对侧壁适于沿着衬底的周边接触衬底的主表面，每个相对的侧壁包括具有预压缩尺寸小于 衬底的周边的厚度。

    ROLLER ASSEMBLY FOR A BRUSH CLEANING DEVICE IN A CLEANING MODULE
    9.
    发明申请
    ROLLER ASSEMBLY FOR A BRUSH CLEANING DEVICE IN A CLEANING MODULE 有权
    用于清洁模块中的清洁装置的滚子组件

    公开(公告)号：US20110079245A1

    公开(公告)日：2011-04-07

    申请号：US12573500

    申请日：2009-10-05

    申请人： Lakshmanan Karuppiah ,  Dan Zhang ,  Simon Yavelberg ,  Jim K. Atkinson ,  Hung Chih Chen ,  Noel Manto ,  Jonathan Domin

    发明人： Lakshmanan Karuppiah ,  Dan Zhang ,  Simon Yavelberg ,  Jim K. Atkinson ,  Hung Chih Chen ,  Noel Manto ,  Jonathan Domin

    IPC分类号： B08B7/00 ,  B08B1/04

    CPC分类号： B08B1/04

    摘要： Embodiments described herein relate to an apparatus and method for a roller assembly that may be utilized in a brush cleaning module. In one embodiment, a roller assembly is described. The roller assembly includes an annular groove having at least two substantially parallel opposing sidewalls adapted to contact the major surfaces of a substrate along a periphery of the substrate, each of the opposing sidewalls comprising a compressible material having a pre-compressed dimension that is less than a thickness of the periphery of the substrate.

    摘要翻译： 本文所述的实施例涉及可用于刷清洁模块中的用于辊组件的装置和方法。 在一个实施例中，描述了辊组件。 辊组件包括具有至少两个基本上平行的相对侧壁的环形凹槽，所述至少两个基本上平行的相对侧壁适于沿着衬底的周边接触衬底的主表面，每个相对的侧壁包括具有预压缩尺寸小于 衬底的周边的厚度。

    Systems and methods for substrate polishing end point detection using improved friction measurement
    10.
    发明授权
    Systems and methods for substrate polishing end point detection using improved friction measurement 有权
    使用改进摩擦测量的基板抛光终点检测的系统和方法

    公开(公告)号：US09061394B2

    公开(公告)日：2015-06-23

    申请号：US13459079

    申请日：2012-04-28

    申请人： Shou-Sung Chang ,  Hung Chih Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

    发明人： Shou-Sung Chang ,  Hung Chih Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rondum

    IPC分类号： B24B1/00 ,  B24B37/013 ,  B24B49/16

    CPC分类号： B24B37/013 ,  B24B49/16

    摘要： Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

    摘要翻译： 提供了用于抛光衬底的方法，装置和系统。 本发明包括上压板; 耦合到上压板的扭矩/应变测量仪器; 以及耦合到扭矩/应变测量仪器并适于驱动上压板旋转通过扭矩/应变测量仪器的下压板。 在其他实施例中，本发明包括一个上部托架; 耦合到上部托架的侧向力测量仪器; 以及耦合到所述侧向力测量仪器并适于支撑抛光头的下托架。 公开了许多附加方面。