Abstract:
A method, apparatus and system are described which provide a memory device having an array of cells which may be selectively designated for either error correction code use or redundancy cell use.
Abstract:
A NAND memory architecture arranges all even bitlines of a page together, and arranges all odd bitlines of a page together, so that programming operations are carried out on adjacent bitlines on the same word line to reduce floating gate coupling. Non-connected bitlines can be used at boundaries between even and odd sections of the array to further reduce floating gate coupling.
Abstract:
A non-volatile memory is described that utilizes a cache read mode of operation, where a next page of memory is being read/sensed from the memory array by the sense amplifiers while a previously read page of memory is being read from the memory I/O buffer, wherein the next page is user selected. This random cache read mode allows for a memory with a random page read capability, in which the address of the next page of data to be read is user selectable, which benefits from the low latency of a cache read mode of operation due to concurrent data sensing and data I/O.
Abstract:
A target memory cell of a memory device is programmed by applying a programming voltage to a word line that includes the target memory cell, determining whether the target memory cell is programmed, and increasing the programming voltage by a step voltage if it is determined that the target memory cell is not programmed. An initial programming voltage and the step voltage are each selectable after fabrication of the memory device.
Abstract:
A NAND memory architecture arranges all even bitlines of a page together, and arranges all odd bitlines of a page together, so that programming operations are carried out on adjacent bitlines on the same word line to reduce floating gate coupling. Non-connected bitlines can be used at boundaries between even and odd sections of the array to further reduce floating gate coupling.
Abstract:
The method for reducing program disturb in a flash memory array biases a selected wordline at a programming voltage. One of the unselected wordlines, closer to array ground than the selected wordline, is biased at a voltage that is less than Vpass. The memory cells on this unselected wordline that are biased at this voltage block the gate induced drain leakage from the cells further up in the array. The remaining unselected wordlines are biased at Vpass. In another embodiment, a second source select gate line is added to the array. The source select gate line that is closest to the wordlines is biased at the voltage that is less than Vpass in order to block the gate induced drain leakage from the array.
Abstract:
A non-volatile memory device has the pages of a certain memory block reallocated to other blocks in order to increase decrease disturb and increase reliability. Each of the reallocation blocks that contain the reallocated pages from the desired memory block are coupled to a wordline driver. These wordline drivers have a subset of the global wordlines as inputs. The desired wordline driver is selected by an appropriate select signal from a block decoder and an indication on an appropriate global wordline. This causes the wordline driver to generate a local wordline to the desired block with the reallocated page to be accessed.
Abstract:
A standby current detecting circuit for use in a semiconductor memory device and method thereof are described. The memory device has a plurality of memory cells arranged at crossing points of a plurality of word lines and a plurality of bit lines. A plurality of switches are associated with each memory cell. A current path supplies current to each memory cell through the switch associated with each memory cell. A plurality of decoders are provided with each decoder for detecting a standby current supplied on one such current path for the memory cell. Each decoder includes control logic for selectively opening and isolating the switch associated with the memory cell in a standby current detection mode.
Abstract:
An integrated circuit memory device includes a plurality of memory cells, a plurality of data lines, a memory cell selector, and a memory cell connector. The memory cells are arranged in a matrix of rows and columns wherein the plurality of memory cells are further grouped in banks with each bank including at least two rows of memory cells. Each of the data lines extends along one of the columns of memory cells so that each of the data lines extends along memory cells from each of the banks of memory cells. The memory cell selector includes a row decoder which selects one of the plurality of rows, a column decoder which selects one of the plurality of columns, and a bank decoder which selects one of the banks. The connector connects one of the memory cells to a respective data line in response to the memory cell selector. Accordingly, data from only one of the memory cells is provided on a respective one of the data lines at any point and time.
Abstract:
Apparatus and methods are disclosed, such as those involving a flash memory device. One such apparatus includes a memory block including a plurality of columns. Each of the columns includes a bit line and a plurality of memory cells on the bit line. The plurality of columns include a plurality of groups of regular columns and a plurality of groups of redundant columns. The apparatus also includes a plurality of data latches. Each of the data latches is configured to store data read from a respective one group of regular columns. The apparatus further includes a plurality of redundant data latches. Each of the redundant data latches is configured to store data read from a respective one group of redundant columns. The apparatus also includes a multiplexer configured to selectively output data from the plurality of data latches and the plurality of redundant data latches.