摘要:
A defective pixel examination method includes the steps of applying different voltages to a capacitive element of a first pixel section and a capacitive element of a second pixel section among the plurality of pixel sections; turning on a switch provided between an input electrode of a pixel transistor in the first pixel section and an input electrode of a pixel transistor in the second pixel section and short-circuiting the input electrode of the first pixel transistor and the input electrode of the second pixel transistor; reading a voltage of the capacitive element of the first pixel section and a voltage of the capacitive element of the second pixel section; and detecting defects of a pixel section on the basis of the result of the comparison between the voltage of the capacitive element of the first pixel section and the voltage of the capacitive element of the second pixel section.
摘要:
The present invention provides a microgel having a mean particle size of 0.1-1,000 μm, the microgel being produced from a gel which is formed by use of a hydrophilic compound capable of forming a gel. An external composition containing the microgel provides an excellent sensation during use; i.e., the composition provides neither sticky sensation during use nor frictional sensation. Furthermore, even when a large amount of a pharmaceutical ingredient, such as a whitening ingredient, or a salt is incorporated into the composition, the viscosity of the composition is not lowered, and the composition exhibits excellent viscosity increasing property. In addition, the composition exhibits long-term stability, without inviting separation of water.
摘要:
The present invention is an eye lens material wherein phosphorylcholine groups of a specific structure are covalently bonded onto the material surface by means of an after-treatment in which a phosphorylcholine-containing chemical compound is reacted with an eye lens material.The object of the present invention is to provide a contact lens that prevents protein adsorption and a method of manufacturing thereof.
摘要:
The present invention is a phosphorylcholine-containing chemical compound represented by the following formula (1) or (2). (CH3)3N+CH2CH2PO4−CH2COOH (1) (CH3)3N+CH2CH2PO4−CH2COONa (2) The object of the present invention is to provide a new phosphorylcholine-containing compound that is useful as a surface treatment agent or a source material of a surface treatment agent. Another object is to provide a manufacturing method that has a high industrial utility value.
摘要:
The present invention is affinity particles that are characterized by having phosphorylcholine groups represented by the following formula (1) covalently bonded onto the surface of organic particles and also by having ligands having specific affinity with a certain target substance covalently bonded or adsorbed onto the surface of organic particles. The object of the present invention is to provide an affinity separation method that uses affinity particles utilizing organic particles and is capable of separating the target substance easily and with high accuracy.
摘要:
The present invention is affinity particles that are characterized by having phosphorylcholine groups represented by the following formula (1) covalently bonded onto the surface of inorganic powder and also by having ligands having specific affinity with a certain target substance covalently bonded or adsorbed onto the surface of inorganic powder. The object of the present invention is to provide an affinity separation method that uses affinity particles utilizing inexpensive inorganic particles and is capable of separating the target substance easily and with high accuracy.
摘要:
A polysiloxane having a phosphorylcholine group represented by the following general formula (1). To develop a method to obtain a polysiloxane having a phosphorylcholine group with ease and great versatility and provide a polysiloxane having a phosphorylcholine group in order to obtain a polysiloxane that has a wide range of application as a biocompatible material and a cosmetic material.
摘要:
In a nonvolatile semiconductor memory device in which a plurality of threshold values are set to store multi-level data in a memory cell, bits of multi-bit data are separately written into a memory cell according to an address signal or a control signal to effect the reading and erasing. Concretely, the memory array is so constituted that it can be accessed by three-dimensional address of X, Y and Z, and multi-bit data in the memory cell is discriminated by the Z-address.
摘要:
A copolymer having silyl groups with at least one reactive functional group bonded thereto. The copolymer comprises a monomer (A) shown by the following Formula (I): wherein R1 is hydrogen atom or methyl; R2 is alkylene group having 1-6 carbon atoms; and R3, R4 and R5 each is a reactive functional group which can cross-link molecules of the copolymer by hydrolyzing. Further, the copolymer preferably comprises, as a constituent monomer, an alkyl (meth)acrylate and a siloxane-containing (meth)acrylate. A coating-forming method comprises hydrolyzing the composition on a material to be treated to cross-link molecules of the copolymer when on the material. A coating of the cross-linked copolymer has resistance to washing. This coating can modify the nature of hair, improve make-up retention, and provide skin-protecting. It can impart water-repellency, resistance to fouling, suitability as a sizing and crease resistance to fibers. Further, it can improve a skin-cleaning effect, applicability, strippability and coating-strength of a peeling-off type cosmetic pack.
摘要:
A resin-encapsulated semiconductor package and a packaging structure, make it possible to provide for a high density mounting arrangement. Specifically, outer leads protrude from the two long sides of a rectangular package. The inner leads in the package, connected to the outer leads protruding from one long side, are connected through wires to the bonding pads of a semiconductor chip encapsulated in the package, whereas the inner leads in the package, connected to the outer leads protruding from the other long side, are in an electrically floating state in the package. The semiconductor packages are arranged in a direction on a card-shaped mounting board, and the opposed outer leads of adjoining semiconductor packages are electrically connected by wiring on the mounting board. The wirings are laid below the semiconductor packages so that they extend generally linearly.