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    METHOD FOR PRODUCING AN OPTOELECTRONIC DEVICE AND OPTOELECTRONIC DEVICE
    51.
    发明申请
    METHOD FOR PRODUCING AN OPTOELECTRONIC DEVICE AND OPTOELECTRONIC DEVICE 失效
    制造光电器件和光电器件的方法

    公开(公告)号：US20110285017A1

    公开(公告)日：2011-11-24

    申请号：US13126096

    申请日：2009-11-02

    申请人： Patrick Ninz ,  Herbert Brunner

    发明人： Patrick Ninz ,  Herbert Brunner

    IPC分类号： H01L23/498 ,  H01L21/50

    CPC分类号： H01L33/483 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L33/58 ,  H01L2924/0002 ,  H01S5/02272 ,  H01L2924/00

    摘要： A method for producing an optoelectronic device includes providing a carrier, applying at least one first metal layer on the carrier, providing at least one optical component, applying at least one second metal layer on the at least one optical component, and mechanically connecting the carrier to the at least one optical component by the at least one first and the at least one second metal layer, wherein the connecting includes friction welding or is friction welding.

    摘要翻译： 一种制造光电子器件的方法包括提供载体，在载体上施加至少一个第一金属层，提供至少一个光学部件，在至少一个光学部件上施加至少一个第二金属层，以及机械连接载体 通过所述至少一个第一和所述至少一个第二金属层到所述至少一个光学部件，其中所述连接包括摩擦焊接或者是摩擦焊接。

    High-efficiency led-based illumination system with improved color rendering
    55.
    发明授权
    High-efficiency led-based illumination system with improved color rendering 有权
    高效率的led照明系统具有改进的显色性能

    公开(公告)号：US07825574B2

    公开(公告)日：2010-11-02

    申请号：US10574021

    申请日：2004-09-24

    申请人： Herbert Brunner ,  Tim Fiedler ,  Frank Jermann ,  Martin Zachau

    发明人： Herbert Brunner ,  Tim Fiedler ,  Frank Jermann ,  Martin Zachau

    IPC分类号： H01J1/62 ,  H01J63/04

    CPC分类号： C09K11/7728 ,  F21V23/005 ,  F21V31/04 ,  F21Y2113/17 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/50 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H05B33/0857 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The illumination system makes simultaneous use of the color-mixing principle from blue, green and red (RGB mixing) and the principle of converting of a primary radiation emitted by an LED into light with a longer wavelength by a phosphor which absorbs this radiation, with at least two LEDs being used, of which a first LED emits primarily in the range from 340 to 470 nm (dominant wavelength) and a second LED emits in the red region at 600 to 700 nm (dominant wavelength), wherein the green component is produced by the primary radiation of the first LED being at least partially converted by a green-emitting phosphor, the green-emitting phosphor used being a phosphor from the class of the oxynitridosilicates, having a cation M and the empirical formula M(1−c)Si2O2N2:Dc, M comprising Sr as a constituent and D being doped with divalent europium, where M=Sr or M=Sr(1−x−y)BayCax with x+y

    摘要翻译： 照明系统同时使用蓝色，绿色和红色（RGB混合）的混色原理，以及通过吸收该辐射的荧光体将由LED发射的初级辐射转换成具有较长波长的光的原理， 使用至少两个LED，其中第一LED主要在340至470nm（主波长）的范围内发射，并且第二LED在600至700nm（主波长）的红色区域中发射，其中绿色分量为 由第一LED的初级辐射产生的至少部分地由绿色发光的磷光体转换，所使用的绿色发光荧光体是来自氧化硅硅酸盐的荧光体，具有阳离子M和经验式M（1-c ）Si 2 O 2 N 2：Dc，M，其包含Sr作为组分，D掺杂有二价铕，其中M = Sr或M = Sr（1-x-y）BayCax，x + y <0.5，所述氧氮硅酸盐完全或主要包含 高温稳定 e修改HT。

    Process for the production of light-emitting diode light sources with a luminescence conversion element
    57.
    发明授权
    Process for the production of light-emitting diode light sources with a luminescence conversion element 有权
    具有发光转换元件的发光二极管光源的制造方法

    公开(公告)号：US07223620B2

    公开(公告)日：2007-05-29

    申请号：US10735507

    申请日：2003-12-11

    申请人： Harald Jäger ,  Herbert Brunner

    发明人： Harald Jäger ,  Herbert Brunner

    IPC分类号： H01L21/027

    CPC分类号： B29C45/14639 ,  B29L2011/00 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/00014

    摘要： A plurality of light-emitting diode light sources of the same kind are produced simultaneously. Each light source includes a light-emitting diode chip and a luminescence conversion element, which converts the wavelength of at least part of an electromagnetic radiation emitted by the light-emitting diode chip. In a first process, a layer composite with a light-emitting diode layer sequence applied to a carrier substrate is provided. The wafer is provided with trenches and then inserted into a cavity of a mold. A molding compound, which contains a luminescence conversion material, is driven in, so that the trenches are at least partly filled with the molding compound. The mold is then removed and the light-emitting diode light sources are separated from the layer composite. In a second process, instead of the layer composite, a plurality of light-emitting diode chips which are applied to a common carrier in a regular arrangement are provided.

    摘要翻译： 同时产生同一种类的多个发光二极管光源。 每个光源包括发光二极管芯片和发光转换元件，其转换由发光二极管芯片发射的电磁辐射的至少一部分的波长。 在第一种方法中，提供了一种施加到载体衬底的发光二极管层序列的层复合物。 晶片设置有沟槽，然后插入模具的空腔中。 包含发光转换材料的模塑料被驱入，使得沟槽至少部分地被模塑料填充。 然后去除模具，并且发光二极管光源与层复合物分离。 在第二过程中，提供以规则排列施加到公共载体的多个发光二极管芯片代替层复合物。

    Diode housing
    58.
    发明申请
    Diode housing 有权
    二极管外壳

    公开(公告)号：US20070034889A1

    公开(公告)日：2007-02-15

    申请号：US11584956

    申请日：2006-10-23

    申请人： Gunther Waitl ,  Herbert Brunner

    发明人： Gunther Waitl ,  Herbert Brunner

    IPC分类号： H01L33/00 ,  H01L31/0203 ,  H01L23/02

    CPC分类号： H01L33/486 ,  H01L24/45 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas. By minimizing the area of the conductor exposed to the window, delamination brought about by the different thermal expansions of the window and conductor are minimized and/or eliminated. Likewise, with a reflective housing covering the base of the cavity that accommodates the window, internal radiation reflection is increased over that which was achieved with an exposed conductor.

    摘要翻译： 设置容纳半导体芯片的壳体。 外壳和芯片可用于发送和/或接收辐射。 外壳的热门应用可能在发光二极管中。 壳体包括被冲压成两个电隔离部分的导体条。 壳体还包括从壳体的顶部向内延伸的腔体。 导体部分包括暴露在空腔底部的相应区域。 半导体芯片被接合到一个暴露区域，并且引线将芯片连接到第二暴露区域。 导体部分也终止在暴露的电极中，这允许芯片与外部装置的电连接。 在空腔中形成窗口，并且形成空腔的壳体的壁可以由反射材料制成。 电极保持未暴露于窗口，但是对于芯片周围的任何残留区域以及在第一和第二暴露区域内的接合线。 通过使暴露于窗户的导体的面积最小化，窗口和导体的不同热膨胀引起的分层被最小化和/或消除。 类似地，通过覆盖容纳窗口的空腔的基部的反射壳体，内部辐射反射增加超过用暴露的导体实现的内部辐射反射。