公开(公告)号：US06204564B1

公开(公告)日：2001-03-20

申请号：US09196884

申请日：1998-11-20

申请人： Osamu Miyata ,  Kazutaka Shibata ,  Shigeyuki Ueda

发明人： Osamu Miyata ,  Kazutaka Shibata ,  Shigeyuki Ueda

IPC分类号： H01L2348

CPC分类号： H01L23/544 ,  H01L21/563 ,  H01L23/556 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/97 ,  H01L29/0657 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/11334 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/83951 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device comprising a film substrate and a semiconductor chip bonded to an upper surface of the film substrate is provided. The semiconductor chip has a main surface formed with a plurality of terminal pads. The film substrate has a lower surface formed with a plurality of external terminal portions in a matrix pattern, and an upper surface formed with a plurality of wiring patterns for respectively connecting with the external terminal portions. The wiring patterns formed in the upper surface of the film substrate are respectively connected to the terminal pads formed on the main surface of the semiconductor chip.

摘要翻译： 提供一种半导体器件，其包括膜基片和与该基片的上表面接合的半导体芯片。 半导体芯片具有形成有多个端子焊盘的主表面。 薄膜基板具有以矩阵图形形成有多个外部端子部的下表面，以及形成有分别与外部端子部连接的多个布线图案的上表面。 形成在薄膜基板的上表面上的布线图案分别连接到形成在半导体芯片的主表面上的端子焊盘。

公开(公告)号：US5672550A

公开(公告)日：1997-09-30

申请号：US584449

申请日：1996-01-10

申请人： Masahiro Tsuji ,  Osamu Miyata

发明人： Masahiro Tsuji ,  Osamu Miyata

IPC分类号： B29C45/02 ,  B29C45/14 ,  H01L21/56 ,  H01L21/60

CPC分类号： B29C45/14655 ,  B29C45/02 ,  H01L21/565 ,  H01L24/97 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/181

摘要： A method of manufacturing semiconductor devices in which a multi-series lead frame that is constructed so as to assemble semiconductor elements in a state that these elements are arrayed in a plurality of series along the longer sides of the lead frame, is set in a mold, and molding resin is injected into cavities of the mold, to thereby form packages for packing the semiconductor elements in a sealing manner. In the method, a resin tablet is positioned so that resin paths are extended at substantially equal lengths to the cavities on the lead frame set in the mold, and the molding resin is injected into the cavities disposed around the resin tablet by pressing the resin tablet with a plunger.

摘要翻译： 一种半导体器件的制造方法，其中，将以这些元件沿引线框架的长边排列成多个串联状态的半导体元件构造的多串联引线框架设置在模具 ，将模塑树脂注入到模具的空腔中，从而形成用于以密封方式包装半导体元件的包装。 在该方法中，树脂片被定位成使得树脂路径以与模具中的引线框架上的空腔大致相等的长度延伸，并且通过压制树脂片将成型树脂注入设置在树脂片周围的空腔中 用柱塞。

公开(公告)号：US4909210A

公开(公告)日：1990-03-20

申请号：US325156

申请日：1989-03-17

申请人： Taizo Shimada ,  Osamu Miyata ,  Tomoaki Tajima ,  Shigeo Yazawa ,  Toshio Tsuda ,  Shuichi Komuro ,  Eiji Mizote ,  Tomomi Nakagawa

发明人： Taizo Shimada ,  Osamu Miyata ,  Tomoaki Tajima ,  Shigeo Yazawa ,  Toshio Tsuda ,  Shuichi Komuro ,  Eiji Mizote ,  Tomomi Nakagawa

IPC分类号： F02B1/04 ,  F02B3/06 ,  F02B23/06 ,  F02B31/00 ,  F02B31/08 ,  F02B75/12

CPC分类号： F02B23/0603 ,  F02B23/0624 ,  F02B23/0696 ,  F02B31/00 ,  F02B31/082 ,  F02B1/04 ,  F02B2031/006 ,  F02B2075/125 ,  F02B2275/14 ,  F02B23/0657 ,  F02B23/0669 ,  F02B3/06 ,  Y02T10/125 ,  Y02T10/146

摘要： Variable swirl intake apparatus (24) controls a swirl of intake air in cylinder chamber (22) of an engine. Variable swirl intake apparatus (24) has intake port (25) which has entrance portion (25a) formed on cylinder head (23) of the engine and extending from the side surface of cylinder head (23) and swirl chamber (25b) which communicates with entrance portion (25a) and is formed to provide a swirl to a gas flow flowing from entrance portion (25a), intake valve (26), arranged on the lower surface of cylinder head (23), for opening/closing between swirl chamber (25b) and cylinder chamber (22) of the engine, swirl control path (28), one end of which is open to swirl chamber (25a) on the side of entrance portion (25a) with respect to a line connecting the axis along a piston sliding direction at the center of cylinder chamber (22) and the axis of the intake valve, and the other end of which is open to the side surface of cylinder head (23), and a control apparatus (29) for controlling a gas flow into swirl control path (28). According to variable swirl intake apparatus (24), a swirl of a gas taken in the engine can be controlled in accordance with an operating condition of the engine so as to reduce NO.sub.x and a fuel consumption rate.

公开(公告)号：US4746223A

公开(公告)日：1988-05-24

申请号：US770688

申请日：1985-08-29

申请人： Osamu Miyata ,  Takayoshi Osumi ,  Shizuma Oishi ,  Hideaki Yumoto ,  Yoshihiko Hasegawa

发明人： Osamu Miyata ,  Takayoshi Osumi ,  Shizuma Oishi ,  Hideaki Yumoto ,  Yoshihiko Hasegawa

IPC分类号： F16T1/48 ,  G01K1/14 ,  G01K3/04 ,  G01M3/02 ,  F16T1/00

CPC分类号： G01K1/143 ,  F16T1/48 ,  G01K3/04 ,  Y10T137/3052

摘要： A meter for integrating the operating time of a steam trap including an integrating instrument consisting of a transparent vessel containing an electrolyte between two columns of mercury across which a DC voltage may be applied and a thermocouple including a hot junction and a cold junction connected to said instrument, wherein temperatures sensed by the hot junction causes displacement of the mercury and movement of the electrolyte in order to provide an indication of changes in temperature in a steam trap assembly.

摘要翻译： 一种用于整合蒸汽疏水阀的操作时间的仪表，包括由包含可在其上施加直流电压的两列汞柱之间的电解质的透明容器和包括热接点的热电偶和连接到所述第一冷端的冷端的集成仪器 仪器，其中由热接点感测的温度导致汞的移位和电解质的移动，以提供蒸汽疏水阀组件中的温度变化的指示。