摘要:
A process comprising the steps of introducing an organic aluminum compound,including at least one of trialkylaluminum and dialkylhydriroaluminum, a copper chelate compound and a silane compound having one to three silicon atoms in the form of a gas mixture into a reactor holding a substrate heated to 250.degree. to 400.degree. C., forming an aluminum alloy thin film containing 0 to 5% copper and 0.1 to 2% silicon on the aforementioned substrate, and heat-treating the substrate formed with the aluminum thin film in an inert gas or hydrogen atmosphere at 400.degree. to 450.degree. C. In application of the present invention to a wiring technique of the semiconductor integrated circuit, it is possible to form a metallic thin film capable of completely smoothing a contact hole having a high aspect ratio.
摘要:
A method of making a memory cell having a transistor and a capacitor of a semiconductor memory device comprises the steps of: forming on a substrate on a surface of which the transistor is formed, an interlayer insulating film having a contact hole reaching a selected portion of the transistors; introducing a selected metal into a surface of the selected portion of the transistor exposed to the contact hole and a surface of the interlayer insulating film at portions thereof where a lower electrode of the capacitor is to be formed; forming a first conductive film having a pattern of the lower electrode of the capacitor by depositing a selected conductive material on the portions where the selected metal has been introduced; forming a capacitor insulating film on the first conductive film; and forming a second conductive film which provides an upper electrode of the capacitor on the capacitor insulating film; wherein the selected conductive material and the selected metal have such a relationship with each other that, when the first conductive layer is formed by depositing the selected conductive material on the portions where the selected metal has been introduced, the selected metal acts as a catalyzer to cause the selected conductive material to develop whisker crystal growth, thereby forming fine projections on an upper surface of the first conductive film.
摘要:
The present invention provides a novel form of 3-(3-{4-[3-(β-D-glucopyranosyloxy)-5-isopropyl-1H-pyrazol-4-ylmethyl]-3-methylphenoxy}propylamino)-2,2-dimethylpropionamide with improved storage stability. Since bis[3-(3-{4-[3-(β-D-glucopyranosyloxy)-5-isopropyl-1H-pyrazol-4-ylmethyl]-3-methylphenoxy}propylamino)-2,2-dimethylpropionamide]monosebacate has extremely excellent storage stability, it is useful as a drug substance. Furthermore, it shows an extremely good crystalline property and can be purified by a convenient method, and therefore is suitable for the industrial preparation.
摘要:
The present invention provides a novel form of 3-(3-{4-[3-(β-D-glucopyranosyloxy)-5-isopropyl-1H-pyrazol-4-ylmethyl]-3-methylphenoxy}propylamino)-2,2-dimethylpropionamide with improved storage stability. Since bis[3-(3-{4-[3-(β-D-glucopyranosyloxy)-5-isopropyl-1H-pyrazol-4-ylmethyl]-3-methylphenoxy}propylamino)-2,2-dimethylpropionamide] monosebacate has extremely excellent storage stability, it is useful as a drug substance. Furthermore, it shows an extremely good crystalline property and can be purified by a convenient method, and therefore is suitable for the industrial preparation.
摘要:
In an ultrasound diagnosis apparatus, a plurality of sub arrays are defined on a 2D array transducer. The sub array shape pattern of each sub array is adaptively changed in accordance with the beam scanning direction. Each sub array is composed of a plurality of groups, each of which is composed of a plurality of transducer elements. With the change of sub array shape pattern in accordance with a beam scanning direction, the group shape pattern of each group also changes. The sub array shape changes for each sub array, and a variable region is determined by the largest outer edge of the shape changed. The variable regions partially overlap with each other among a plurality of sub arrays. On a 2D array transducer, a plurality of sub arrays are always closely coupled with each other even when each sub array shape is changed.
摘要:
A noise suppression circuit encompasses an internal circuit, a bypass capacitor, first and second transistors. The internal circuit has high and low level terminals, and the low level terminal is connected to a low level power supply line. The internal circuit is supplied with enable and inverted enable signals. The first transistor has a first control electrode, and one main electrode is connected to the high level terminal. The first control electrode is supplied with the inverted enable signal. The bypass capacitor is connected between the other main electrode of the first transistor and the low level power supply line. The second transistor is connected between the other main electrode of the first transistor and a high level power supply line. The second transistor has a second control electrode supplied with the enable signal. The second transistor is not conductive when the internal circuit is active.
摘要:
A semiconductor memory device comprising: a first memory cell array including a plurality of memory cells, a first switch circuit for transferring data to be programmed to at least one of the plurality of memory cells arranged in the first memory cell array, a latch circuit for latching the data transferred from the first switch circuit, a first write selector circuit for transferring the data transferred from the latch circuit, a first bit line connected to at least one of the plurality of memory cells and receiving the data transferred from the first write selector circuit, a second memory cell array including a plurality of memory cells that are different from the plurality of memory cells arranged in the first memory cell array, a second switch circuit for transferring data to be programmed to at least one of the plurality of memory cells arranged in the second memory cell array, a second write selector circuit connected to the second switch circuit and transferring the data transferred from the second switch circuit, and a second bit line connected to at least one of the plurality of memory cells arranged in the second memory cell array.
摘要:
A semiconductor integrated circuit device comprises a semiconductor memory circuit including a memory cell array in which normal cells are integrated and a fuse circuit in which fuse cells that store operation information of the semiconductor memory circuit are integrated. The fuse cell is of a 2-transistor type memory cell which comprises a cell transistor having a charge storage layer and a selection transistor which selects the cell transistor.
摘要:
A semiconductor memory device has access transistors with a gate and a pair of impurity diffusion layers formed on a semiconductor substrate and memory capacitors with a storage node electrode and a cell plate electrode. The electrodes are connected to each other via a capacitive insulating layer made of a ferroelectric material. The storage node electrode has a surface covered with the capacitive insulating layer and is formed in a shape of column on one of the pair of impurity diffusion layers in a hole formed from an inter-layer insulating film covering the access transistor to the one of the pair of impurity diffusion layers. A upper surface of the column does not exceed the inter-layer insulating film. The storage node electrode formed in the hole face the cell plate electrode via the inter-layer insulating film.
摘要:
A plasma processing method comprises the steps of supplying a low-frequency bias to a first electrode carrying a substrate, and supplying a high-frequency power to a second electrode facing the first electrode, wherein the low-frequency bias is supplied to the first electrode in advance of starting plasma by the energy of the high-frequency power, with an electric power sufficient to form an ion-sheath on the surface of the substrate.