中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

114 records (took 0.019 seconds)

    Molded package and light emitting device
    53.
    发明授权
    Molded package and light emitting device 有权
    成型包装和发光装置

    公开(公告)号：US09357641B2

    公开(公告)日：2016-05-31

    申请号：US13744586

    申请日：2013-01-18

    Applicant: NICHIA CORPORATION

    Inventor： Shimpei Sasaoka ,  Takuya Nakabayashi

    IPC: H01L33/00 ,  H01L21/00 ,  H05K1/03 ,  H01L33/38 ,  H01L33/48 ,  H01L33/62

    CPC classification number: H01L33/62 ,  H01L33/38 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/18301 ,  H05K1/0313 ,  H01L2924/00014

    Abstract: A molded package includes a molded resin and a lead. The molded resin has a recess portion provided on an upper surface of the molded resin to accommodate a light emitting component. The lead is partially exposed from a bottom surface of the recess portion of the molded resin to be electrically connected to the light emitting component and extends below a side wall of the recess portion. The lead has a groove formed on a surface of the lead at least partially along the side wall. The groove has an inside upper edge and an outside upper edge and is filled with the molded resin so that the inside upper edge is exposed from the bottom surface of the recess portion and the outside upper edge is embedded within the molded resin.

    Abstract translation: 模制包装包括模制树脂和铅。 模制树脂具有设置在模制树脂的上表面上以容纳发光部件的凹部。 引线部分地从模塑树脂的凹部的底表面暴露以与发光部件电连接并且在凹部的侧壁下方延伸。 引线具有至少部分地沿着侧壁形成在引线的表面上的凹槽。 该槽具有内上边缘和外上边缘，并且填充有模制树脂，使得内侧上边缘从凹部的底面露出，外侧上边缘嵌入模制树脂内。

    Light emitting device and method of producing light emitting device
    55.
    发明授权
    Light emitting device and method of producing light emitting device 有权

    公开(公告)号：US11948925B2

    公开(公告)日：2024-04-02

    申请号：US17938017

    申请日：2022-10-04

    Applicant: NICHIA CORPORATION

    Inventor： Takuya Nakabayashi ,  Tadaaki Ikeda ,  Tetsuya Ishikawa

    IPC: H01L25/13 ,  H01L33/52 ,  H01L33/62

    CPC classification number: H01L25/13 ,  H01L33/52 ,  H01L33/62 ,  H01L2933/0066

    Abstract: A light emitting device includes a substrate including first, second, third and fourth wiring portions on a top surface of a base member and arrayed in a first direction, and a connection wiring portion connecting the second and third wiring portions. The connection wiring portion includes first and second connection ends respectively connected with the second and third wiring portions, and a connection central portion connecting the first and second connection ends and having a maximum width in a second direction different from each of a maximum width of the first connection end and a maximum width of the second connection end. In the second direction, at least a part of the connection wiring portion has a width narrower than each of a maximum width of the second wiring portion and a maximum width of the third wiring portion.

    Light-emitting module
    56.
    发明授权
    Light-emitting module 有权

    公开(公告)号：US11808966B2

    公开(公告)日：2023-11-07

    申请号：US18166356

    申请日：2023-02-08

    Applicant: NICHIA CORPORATION

    Inventor： Takuya Nakabayashi ,  Daisuke Kasai ,  Takao Nakauchi

    IPC: F21V8/00

    CPC classification number: G02B6/0038 ,  G02B6/0055 ,  G02B6/0068

    Abstract: A light-emitting module includes: a plurality of light sources; and a lightguide plate including a plurality of light source placement sections, in each of which at least one light source is arranged, arrayed in a first direction and a second direction orthogonal to the first direction. The lightguide plate defines at least one first-A light control groove and at least one first-B light control groove that extend parallel to the second direction between a first light source placement section and a second light source placement section adjacent to the first light source placement section in the first direction, and at least one second-A light control groove and at least one second-B light control groove that extend parallel to the first direction between the first light source placement section and a third light source placement section adjacent to the first light source placement section in the second direction.

    Light-emitting unit and surface-emission light source
    57.
    发明授权
    Light-emitting unit and surface-emission light source 有权

    公开(公告)号：US11799064B2

    公开(公告)日：2023-10-24

    申请号：US17842925

    申请日：2022-06-17

    Applicant: NICHIA CORPORATION

    Inventor： Takuya Nakabayashi ,  Toshinobu Katsumata ,  Noriaki Hiraide

    IPC: H01L33/62 ,  H01L33/48 ,  H01L33/50 ,  H05K1/18 ,  H01L33/60 ,  H01L27/15

    CPC classification number: H01L33/62 ,  H01L27/156 ,  H01L33/486 ,  H01L33/502 ,  H01L33/60 ,  H05K1/189

    Abstract: A light-emitting unit includes: a wiring board; a plurality of light-emitting elements provided on the wiring board and electrically coupled with a wire layer of the wiring board; a light reflecting member provided on the wiring board, the light reflecting member covering a lateral surface of each of the plurality of light-emitting elements; a light diffusing layer covering the plurality of light-emitting elements and the light reflecting member; a wavelength conversion layer located on or above the light diffusing layer; and a plurality of light reflecting layers located between the light diffusing layer and the wavelength conversion layer, each of the light reflecting layers being located above a corresponding one of the plurality of light-emitting elements. An upper surface of the light reflecting member has a recess which includes at least one concave surface, and there is a space between the concave surface and the light diffusing layer.

    Method of producing light source device comprising joining a wiring portion of a light emitting device and a support substrate by a solder member
    58.
    发明授权
    Method of producing light source device comprising joining a wiring portion of a light emitting device and a support substrate by a solder member 有权

    公开(公告)号：US11799062B2

    公开(公告)日：2023-10-24

    申请号：US17450621

    申请日：2021-10-12

    Applicant: NICHIA CORPORATION

    Inventor： Takuya Nakabayashi

    IPC: H01L33/62 ,  H01L33/56

    CPC classification number: H01L33/62 ,  H01L33/56 ,  H01L2933/0066

    Abstract: A method of producing a light source device includes providing a light emitting device having a substrate including a base member that includes a bottom surface and a recess. The substrate further including a wiring portion in the recess. The method further including providing a support substrate having a support base member, a first wiring pattern on a top surface of the support base member and including a joining region, and an insulating region, and applying a solder member such that the solder member on the insulating region has a volume larger than that of the solder member on the joining region. The light emitting device is placed on the support substrate while the solder member is separate from a portion of the wiring portion positioned in the vicinity of the bottom surface and the wiring portion is joined to the joining region.

    Light-emitting unit and surface-emission light source
    59.
    发明授权
    Light-emitting unit and surface-emission light source 有权

    公开(公告)号：US11594665B2

    公开(公告)日：2023-02-28

    申请号：US16945046

    申请日：2020-07-31

    Applicant: NICHIA CORPORATION

    Inventor： Takuya Nakabayashi ,  Toshinobu Katsumata ,  Noriaki Hiraide

    IPC: H01L33/62 ,  H01L27/15 ,  H01L33/10 ,  H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H05K1/18

    Abstract: A light-emitting unit includes: a wiring board; light-emitting elements on the wiring board; a light reflecting member on the wiring board, the light reflecting member covering a lateral surface of each of the light-emitting elements; wavelength conversion layers each provided on or above an emission surface of a corresponding one of the plurality of light-emitting elements; light reflecting layers on the wavelength conversion layers, respectively; and a protecting layer configured to transmit light and provided on the light reflecting member. The light-transmitting protecting layer covers at least a lateral surface of the wavelength conversion layers and at least a lateral surfaces of the light reflecting layers. An upper surface of the protecting layer has a first recess in a region where the plurality of light reflecting layers are not present in a top view. The first recess includes at least one concave surface.

    Light emitting module and planar light source
    60.
    发明授权
    Light emitting module and planar light source 有权

    公开(公告)号：US11480319B2

    公开(公告)日：2022-10-25

    申请号：US17169094

    申请日：2021-02-05

    Applicant: NICHIA CORPORATION

    Inventor： Takuya Nakabayashi ,  Toru Hashimoto ,  Keiji Emura

    IPC: F21V14/06 ,  F21V5/04 ,  G02F1/13357 ,  G02F1/1335 ,  F21V8/00 ,  F21V9/08 ,  F21V13/14 ,  F21Y105/16

    Abstract: A light emitting module includes: a light guide member including: an emission region defined by a sectioning groove, a light source placement part located in the emission region, and a light adjusting hole that, in a schematic top view, is located between the sectioning groove and the light source placement part; and a light source located in the light source placement part. A refractive index of an inside of the light adjusting hole is lower than a refractive index of the light guide member. In the schematic top view, the light adjusting hole is not positioned on a first straight line connecting a center of the light source and a farthest point in the sectioning groove, the farthest point being farthest from the center of the light source.

Patent Agency Ranking