公开(公告)号：US11121699B2

公开(公告)日：2021-09-14

申请号：US16279902

申请日：2019-02-19

Applicant: QUALCOMM Incorporated

Inventor： Kai Liu ,  Rui Tang ,  Changhan Hobie Yun ,  Mario Francisco Velez ,  Jonghae Kim

IPC: H03H9/54 ,  H03H9/05 ,  H03H3/02 ,  H01P1/203

Abstract: Aspects of the disclosure are directed to a bandpass filter including a first, second, third and fourth resonators, wherein the second and third resonators are in parallel, wherein the first resonator includes a first and second terminals, wherein the second resonator includes a second resonator top terminal and a second resonator bottom terminal, wherein the third resonator includes a third resonator top terminal and a third resonator bottom terminal, wherein the fourth resonator includes a third terminal and a fourth terminal; wherein the first terminal is coupled to the second resonator top terminal, wherein the second terminal is coupled to the third resonator top terminal, wherein the third terminal is coupled to the third resonator bottom terminal, wherein the fourth terminal is coupled to the second resonator bottom terminal; a first inductor coupled to the first and third terminals; and a second inductor coupled to the second and fourth terminals.

公开(公告)号：US10553671B2

公开(公告)日：2020-02-04

申请号：US15178900

申请日：2016-06-10

Applicant: QUALCOMM Incorporated

Inventor： Chengjie Zuo ,  Jonghae Kim ,  Daeik Daniel Kim ,  Changhan Hobie Yun ,  Mario Francisco Velez

IPC: H01L29/00 ,  H01L49/02 ,  H01L21/48 ,  H01F17/00 ,  H01L23/522 ,  H01L23/498 ,  H01L23/48 ,  H01L23/64 ,  H01F27/28 ,  H01L23/00

Abstract: Base pads are spaced by a pitch on a support surface. Conducting members, optionally Cu or other metal pillars, extend up from the base pads to top pads. A top pad interconnector connects the top pads in a configuration establishing an inductor current path between the base pads.

公开(公告)号：US10523253B2

公开(公告)日：2019-12-31

申请号：US16029432

申请日：2018-07-06

Applicant: QUALCOMM Incorporated

Inventor： Changhan Yun ,  Chengjie Zuo ,  Mario Velez ,  Niranjan Sunil Mudakatte ,  Shiqun Gu ,  Jonghae Kim ,  David Berdy

IPC: H04B1/16 ,  H01L21/48 ,  H01L23/522 ,  H01L23/64 ,  H01L23/00 ,  H04B1/00 ,  H05K1/16 ,  H05K1/18 ,  H05K3/46 ,  H01L23/498 ,  H01L23/66 ,  H01L27/01 ,  H01L49/02 ,  H01F17/00

Abstract: In an illustrative example, an apparatus includes a passive-on-glass (POG) device integrated within a glass substrate. The apparatus further includes a semiconductor die integrated within the glass substrate.

公开(公告)号：US10319694B2

公开(公告)日：2019-06-11

申请号：US15233902

申请日：2016-08-10

Applicant: QUALCOMM Incorporated

Inventor： Daniel Daeik Kim ,  Jie Fu ,  Manuel Aldrete ,  Jonghae Kim ,  Changhan Hobie Yun ,  David Francis Berdy ,  Chengjie Zuo ,  Mario Francisco Velez

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L21/56 ,  H01L23/48 ,  H01L23/498

Abstract: A semiconductor device according to some examples of the disclosure may include a package substrate, a semiconductor die coupled to one side of the package substrate with a first set of contacts on an active side of the semiconductor die and coupled to a plurality of solder prints with a second set of contacts on a back side of the semiconductor die. The semiconductor die may include a plurality of vias connecting the first set of contacts to the second set of contacts and configured to allow heat to be transferred from the active side of the die to the plurality of solder prints for a shorter heat dissipation path.

公开(公告)号：US10154591B2

公开(公告)日：2018-12-11

申请号：US15896959

申请日：2018-02-14

Applicant: QUALCOMM Incorporated

Inventor： Chengjie Zuo ,  David Francis Berdy ,  Daeik Daniel Kim ,  Changhan Hobie Yun ,  Mario Francisco Velez ,  Jonghae Kim

IPC: H05K5/00 ,  H05K1/18 ,  H03H7/01 ,  H05K3/10 ,  H05K3/30 ,  H05K3/40 ,  H05K1/02 ,  H05K1/14 ,  H01L21/56 ,  H01L23/12 ,  H01L23/15 ,  H01L23/28 ,  H01L23/538 ,  H01L23/552

Abstract: Passive device assembly for accurate ground plane control is disclosed. A passive device assembly includes a device substrate conductively coupled to a ground plane separation control substrate. A passive device disposed on a lower surface of the device substrate is separated from an embedded ground plane mounted on a lower surface of the ground plane separation control substrate by a separation distance. The separation distance is accurately controlled to minimize undesirable interference that may occur to the passive device. The separation distance is provided inside the passive device assembly. Conductive mounting pads are disposed on the lower surface of the ground plane separation control substrate to support accurate alignment of the passive device assembly on a circuit board. By providing sufficient separation distance inside the passive device assembly, the passive device assembly can be precisely mounted onto any circuit board regardless of specific design and layout of the circuit board.

公开(公告)号：US10141353B2

公开(公告)日：2018-11-27

申请号：US15161152

申请日：2016-05-20

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie Yun ,  Daeik Daniel Kim ,  Jonghae Kim ,  Mario Francisco Velez ,  Chengjie Zuo ,  David Francis Berdy

IPC: H01L27/13 ,  H03H7/01 ,  H01L21/84 ,  H01L49/02 ,  H01L23/498 ,  H03H1/00

Abstract: The present disclosure provides integrated circuit apparatuses and methods for manufacturing integrated circuit apparatuses. An integrated circuit apparatus may include a first insulator, the first insulator being substantially planar and having a first top surface and a first bottom surface opposite the first top surface, a first conductor disposed on the first insulator, a second insulator, the second insulator being substantially planar and having a second top surface and a second bottom surface opposite the second top surface, a second conductor disposed on the second insulator, and a dielectric layer disposed between the first bottom conductor of the first insulator and the second top conductor of the second insulator.

公开(公告)号：US10103703B2

公开(公告)日：2018-10-16

申请号：US15161138

申请日：2016-05-20

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie Yun ,  David Francis Berdy ,  Chengjie Zuo ,  Daeik Daniel Kim ,  Jonghae Kim ,  Mario Francisco Velez ,  Niranjan Sunil Mudakatte ,  Robert Paul Mikulka

IPC: H03H7/01 ,  H01F5/00 ,  H01F41/04 ,  H01P1/203 ,  H03H7/09 ,  H05K1/18 ,  H03H1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00 ,  H05K3/18 ,  H05K3/40 ,  H01P1/213 ,  H01P5/12 ,  H03H7/46

Abstract: The present disclosure provides circuits and methods for fabricating circuits. A circuit may include an insulator having a first surface, a second surface, a periphery, a first subset of circuit elements disposed on the first surface, a second subset of circuit elements disposed on the second surface, and at least one conductive sidewall disposed on the periphery, wherein the conductive sidewall electrically couples the first subset of circuit elements to the second subset of circuit elements.

公开(公告)号：US10051741B2

公开(公告)日：2018-08-14

申请号：US14073756

申请日：2013-11-06

Applicant: QUALCOMM Incorporated

Inventor： Young Kyu Song ,  Daeik Daniel Kim ,  Xiaonan Zhang ,  Ryan David Lane ,  Jonghae Kim

IPC: H05K1/18 ,  H05K1/16 ,  H05K1/14

Abstract: An embedded layered inductor is provided that includes a first inductor layer and a second inductor layer coupled to the first inductor layer. The first inductor layer comprises a patterned metal layer that may also be patterned to form pads. The second inductor layer comprises metal deposited in a dielectric layer adjacent the patterned metal layer.

公开(公告)号：US10044390B2

公开(公告)日：2018-08-07

申请号：US15216615

申请日：2016-07-21

Applicant: QUALCOMM Incorporated

Inventor： Changhan Yun ,  Chengjie Zuo ,  Mario Velez ,  Niranjan Sunil Mudakatte ,  Shiqun Gu ,  Jonghae Kim ,  David Berdy

IPC: H01L23/28 ,  H03H7/46 ,  H04B1/401 ,  H05K1/18 ,  H04B1/16 ,  H01L27/01 ,  H01L49/02 ,  H01L23/498 ,  H01L23/66 ,  H01L21/48

Abstract: In an illustrative example, an apparatus includes a passive-on-glass (POG) device integrated within a glass substrate. The apparatus further includes a semiconductor die integrated within the glass substrate.

公开(公告)号：US20180145062A1

公开(公告)日：2018-05-24

申请号：US15861140

申请日：2018-01-03

Applicant: QUALCOMM Incorporated

Inventor： Je-Hsiung Jeffrey Lan ,  Niranjan Sunil Mudakatte ,  Changhan Hobie Yun ,  Daeik Daniel Kim ,  Chengjie Zuo ,  David Francis Berdy ,  Mario Francisco Velez ,  Jonghae Kim

IPC: H01L27/01 ,  H01L49/02 ,  H01L23/522 ,  H01L23/15

CPC classification number: H01L27/01 ,  H01G2/02 ,  H01G4/005 ,  H01L21/4846 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5223 ,  H01L23/5227 ,  H01L28/10 ,  H01L28/75 ,  H01L2224/11

Abstract: A device includes a glass substrate and a capacitor. The capacitor includes a first metal coupled to a first electrode, a dielectric structure, and a via structure comprising a second electrode of the capacitor. The first metal structure is separated from the via structure by the dielectric structure.