COMPOSITE ELECTRONIC COMPONENT
    51.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT 审中-公开
    复合电子元件

    公开(公告)号:US20150042414A1

    公开(公告)日:2015-02-12

    申请号:US14454628

    申请日:2014-08-07

    CPC classification number: H01G4/40

    Abstract: A composite electronic component may include: an input terminal part receiving power converted by a power managing part; a power stabilizing part stabilizing the power and including a composite body including a capacitor and a toroidal coil and having a hexahedral shape, the capacitor including a plurality of dielectric layers, internal electrodes disposed to face each other with the respective dielectric layers interposed therebetween, and capacitor electrodes electrically coupled to the internal electrodes, and the toroidal coil being wound around the capacitor, and the capacitor and the toroidal coil being embedded in a magnetic material of the composite body; and an output terminal part supplying the stabilized power.

    Abstract translation: 复合电子部件可以包括:接收由电力管理部变换的电力的输入端子部; 功率稳定部,其稳定功率,并且包括具有电容器和环形线圈的复合体,并具有六面体形状,所述电容器包括多个电介质层,内部电极被设置为彼此面对,各介电层插入其间;以及 电耦合到内部电极的电容器电极,并且环形线圈缠绕在电容器上,电容器和环形线圈被嵌入复合体的磁性材料中; 以及提供稳定电力的输出端子部。

    COMPOSITE ELECTRONIC COMPONENT
    52.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT 审中-公开
    复合电子元件

    公开(公告)号:US20150035621A1

    公开(公告)日:2015-02-05

    申请号:US14447207

    申请日:2014-07-30

    Abstract: A composite electronic component includes an input terminal portion receiving power converted by a power management unit, a power stabilizing unit stabilizing the power and including a composite body including a capacitor and a coil and having a hexahedral shape, the capacitor including a plurality of dielectric layers, internal electrodes disposed so as to face each other with a respective dielectric layer interposed therebetween, and capacitor electrodes electrically connected to the internal electrodes, and the coil being wound so as to encompass the capacitor and being buried in a magnetic material portion, and an output terminal portion supplying the stabilized power.

    Abstract translation: 复合电子元件包括:接收由功率管理单元转换的功率的输入端子部分,稳定功率的功率稳定单元,并且包括具有六面体形状的电容器和线圈的复合体,所述电容器包括多个电介质层 设置成彼此相对的彼此相对的电介质层的内部电极和与内部电极电连接的电容电极,线圈被卷绕以包围电容器并埋入磁性材料部分中,并且 输出端子部分提供稳定的电力。

    MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN
    53.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN 有权
    多层陶瓷电子部件嵌入板和印刷电路板上嵌有多层陶瓷电子部件

    公开(公告)号:US20150021077A1

    公开(公告)日:2015-01-22

    申请号:US14067734

    申请日:2013-10-30

    Abstract: There is provided a multilayer ceramic electronic part to be embedded in a board, including: a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other; first and second internal electrodes; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first external electrode includes a first base electrode and a first terminal electrode formed on a portion of the first base electrode formed on at least one of the first and second main surfaces of the ceramic body, the second external electrode includes a second base electrode and a second terminal electrode formed on a portion of the second base electrode formed on at least one of the first and second main surfaces of the ceramic body.

    Abstract translation: 提供一种要嵌入板中的多层陶瓷电子部件,包括:陶瓷体,其包括电介质层,并且具有彼此相对的第一和第二主表面,彼此面对的第一和第二侧表面以及面对 彼此; 第一和第二内部电极; 以及形成在所述陶瓷体的两端部的第一外部电极和所述第二外部电极,其中,所述第一外部电极包括形成在所述第一基极的一部分上的第一基极和形成在所述第一和第二外部电极中的至少一个上的第一端电极 陶瓷体的主表面,第二外部电极包括形成在陶瓷体的第一和第二主表面中的至少一个上形成的第二基底电极的一部分上的第二基极和第二端电极。

    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON
    54.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON 有权
    多层陶瓷电容器及其安装板

    公开(公告)号:US20140368968A1

    公开(公告)日:2014-12-18

    申请号:US14275643

    申请日:2014-05-12

    Abstract: A multilayer ceramic capacitor may include: a ceramic body including dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; an active layer configured to form capacitance by including first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween and alternately exposed to the first or second side surface; and a first external electrode disposed on the first side surface and electrically connected to the first internal electrodes and a second external electrode disposed on the second side surface and electrically connected to the second internal electrodes. When length of the ceramic body is L and length of the first and second external electrodes in the length direction of the ceramic body is L1, 0.2≦L1/L≦0.96 is satisfied.

    Abstract translation: 多层陶瓷电容器可以包括:陶瓷体,其包括电介质层,并且具有彼此相对的第一和第二主表面,彼此相对的第一和第二侧表面以及彼此相对的第一和第二端面; 有源层,被配置为通过包括彼此相对设置的第一和第二内部电极来形成电容,所述第一和第二内部电极介于其间并交替地暴露于第一或第二侧表面; 以及第一外部电极,设置在第一侧面上并与第一内部电极电连接,第二外部电极设置在第二侧面上并电连接到第二内部电极。 当陶瓷体的长度为L,陶瓷体的长度方向上的第一外部电极和第二外部电极的长度为L1时,满足0.2≤nlE; L1 / L< nlE; 0.96。

    MULTILAYER CERAMIC CAPACITOR AND MOUNTING BOARD FOR MULTILAYER CERAMIC CAPACITOR
    55.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND MOUNTING BOARD FOR MULTILAYER CERAMIC CAPACITOR 有权
    多层陶瓷电容器多层陶瓷电容器及安装板

    公开(公告)号:US20140290998A1

    公开(公告)日:2014-10-02

    申请号:US13866786

    申请日:2013-04-19

    Abstract: There is provided multilayer ceramic capacitor including, a ceramic body including a plurality of dielectric layers laminated therein, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, with the dielectric layers interposed therebetween, and having capacitance formed therein, an upper cover layer formed on an upper portion of the active layer, a lower cover layer formed on a lower portion of the active layer and having a thickness greater than that of the upper cover layer, first and second dummy electrode terminals provided in the lower cover layer to be alternately exposed through both end surfaces of the lower cover layer, and first and second external electrodes covering the both end surfaces of the ceramic body.

    Abstract translation: 提供了多层陶瓷电容器,其包括:层叠有多个电介质层的陶瓷体,具有通过陶瓷体的两个端面交替暴露的多个第一和第二内部电极的有源层,介电层插入其间, 并且其中形成有电容,形成在有源层的上部的上覆盖层,形成在有源层的下部并且具有大于上覆盖层的厚度的下覆盖层,第一和第二伪 设置在下覆盖层中的电极端子通过下盖层的两个端面交替暴露,以及覆盖陶瓷体两端表面的第一和第二外部电极。

    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT
    56.
    发明申请
    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
    嵌入式多层陶瓷电子元件和带有嵌入式多层陶瓷电子元件的印刷电路板

    公开(公告)号:US20140182907A1

    公开(公告)日:2014-07-03

    申请号:US13770887

    申请日:2013-02-19

    Abstract: There is provided an embedded multilayer ceramic electronic component including: a ceramic body including dielectric layers, having first and second lateral surfaces opposing one another, and having a thickness equal to or less than 250 μm; a first internal electrode and a second internal electrode disposed to face one another with the dielectric layer interposed therebetween; a first external electrode formed on the first lateral surface of the ceramic body and electrically connected to the first internal electrode and a second external electrode formed on the second lateral surface and electrically connected to the second internal electrode; and metal layers formed on the first external electrode and the second external electrode, respectively, and including copper (Cu), wherein when a thickness of the metal layers is tp, tp≧5 μm may be satisfied.

    Abstract translation: 提供了一种嵌入式多层陶瓷电子部件,其包括:陶瓷体,其包括电介质层,其具有彼此相对的第一和第二侧表面,并且具有等于或小于250μm的厚度; 第一内部电极和第二内部电极,其设置成彼此面对,其间插入介电层; 第一外部电极,其形成在陶瓷体的第一侧面上并电连接到第一内部电极,第二外部电极形成在第二侧面上并电连接到第二内部电极; 以及金属层,分别形成在第一外部电极和第二外部电极上,并且包括铜(Cu),其中当金属层的厚度为tp时,可以满足tp≥5μm。

    MULTILAYERED CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME
    57.
    发明申请
    MULTILAYERED CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME 有权
    多层陶瓷电容器及其安装板

    公开(公告)号:US20140153156A1

    公开(公告)日:2014-06-05

    申请号:US13764106

    申请日:2013-02-11

    CPC classification number: H01G4/002 H01G4/012 H01G4/12 H01G4/30

    Abstract: A multilayered ceramic capacitor includes a ceramic body in which a plurality of dielectric layers having an average thickness of 0.2 to 2.0 μm are stacked; an active layer including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, to form capacitance; an upper cover layer formed above the active layer; a lower cover layer formed below the active layer and thicker than the upper cover layer; and first and second external electrodes covering both end surfaces of the ceramic body, wherein the dielectric layer is configured of dielectric grains, and when an average thickness of the dielectric layer is defined as td, an average thickness of the first and second internal electrodes is defined as te, and an average grain size of the dielectric grains is defined as Da, Da≦td/3 and 0.2 μm

    Abstract translation: 多层陶瓷电容器包括陶瓷体,其中堆叠平均厚度为0.2至2.0μm的多个电介质层; 活性层,包括交替暴露于陶瓷体的两端面的多个第一和第二内部电极,其间插入有电介质层,形成电容; 形成在有源层上方的上覆盖层; 形成在有源层下面并且比上覆盖层厚的下覆盖层; 以及覆盖陶瓷体的两端面的第一外部电极和第二外部电极,其中介电层由电介质晶粒构成,当电介质层的平均厚度定义为td时,第一和第二内部电极的平均厚度为 定义为te,并且电介质晶粒的平均晶粒尺寸被定义为Da,Da& nlE; td / 3和0.2μm

    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT THEREIN
    58.
    发明申请
    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT THEREIN 审中-公开
    嵌入式多层陶瓷电子元件及其制造方法以及具有嵌入式多层陶瓷电子元件的印刷电路板

    公开(公告)号:US20140151101A1

    公开(公告)日:2014-06-05

    申请号:US13770971

    申请日:2013-02-19

    CPC classification number: H01G4/12 H05K1/185 H05K2201/10636 Y02P70/611

    Abstract: There is provided an embedded multilayer ceramic electronic component, including: a ceramic body including dielectric layers; first and second internal electrodes facing each other with the dielectric layers interposed therebetween; a first external electrode and a second external electrode formed on external surfaces of the ceramic body, the first external electrode being electrically connected to the first internal electrodes and the second external electrode being electrically connected to the second internal electrodes; and a plating layer formed on the first external electrode and the second external electrode, wherein a surface roughness of the ceramic body is 500 nm or greater and not greater than a thickness of a ceramic cover sheet and a surface roughness of the plating layer is 300 nm or greater and not greater than a thickness of the plating layer.

    Abstract translation: 提供了一种嵌入式多层陶瓷电子部件,包括:包括电介质层的陶瓷体; 第一和第二内部电极彼此面对,介电层插入其间; 形成在所述陶瓷体的外表面上的第一外部电极和第二外部电极,所述第一外部电极与所述第一内部电极电连接,所述第二外部电极与所述第二内部电极电连接; 以及形成在所述第一外部电极和所述第二外部电极上的镀层,其中,所述陶瓷体的表面粗糙度为500nm以上且不大于陶瓷覆盖片的厚度,并且所述镀层的表面粗糙度为300 nm以上且不大于镀层的厚度。

    MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING MULTILAYERED CERAMIC CAPACITOR THEREON, AND PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR
    59.
    发明申请
    MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING MULTILAYERED CERAMIC CAPACITOR THEREON, AND PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR 有权
    多层陶瓷电容器,具有多层陶瓷电容器的电路板的安装结构以及多层陶瓷电容器的包装单元

    公开(公告)号:US20140138136A1

    公开(公告)日:2014-05-22

    申请号:US13764131

    申请日:2013-02-11

    Abstract: There is provided a multilayered ceramic capacitor, including: a ceramic body having a plurality of dielectric layers laminated therein; an active layer including a plurality of internal electrodes having the respective dielectric layers interposed therebetween; an upper cover layer; a lower cover layer; external electrodes; and a plurality of dummy electrodes, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as the thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as the thickness of the upper cover layer, a ratio of deviation between a center portion of the active layer and a center portion of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745.

    Abstract translation: 提供了一种多层陶瓷电容器,包括:陶瓷体,其中层压有多个电介质层; 包括多个内部电极的有源层,所述多个内部电极具有介于其间的各个介电层; 上盖层; 下覆盖层; 外部电极; 以及多个虚拟电极,其中当A定义为陶瓷体的总厚度的1/2时,B定义为下覆盖层的厚度,C定义为有源层的总厚度的1/2, 和D定义为上覆盖层的厚度,有源层的中心部分和陶瓷体的中心部分(B + C)/ A之间的偏差比满足1.063≦̸(B + C )/A≦̸1.745。

    MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME
    60.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME 有权
    多层陶瓷电子部件及其制造方法

    公开(公告)号:US20130314843A1

    公开(公告)日:2013-11-28

    申请号:US13670002

    申请日:2012-11-06

    Abstract: There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; a plurality of first and second internal electrodes each formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes respectively including first and second lead parts extended therefrom to be exposed through one surface of the ceramic element; and first and second external electrodes formed on one surface of the ceramic element, and electrically connected to the first and second internal electrodes through exposed portions of the first and second lead parts, respectively, wherein a ratio of a width of the first or second lead part to a width of the first or second external electrode is 10 to 85%.

    Abstract translation: 提供了一种多层陶瓷电子部件,其包括:陶瓷元件,其中层叠有多个电介质层; 多个第一和第二内部电极,各自形成在所述陶瓷元件内的所述多个介电层中的每一个的至少一个表面上,所述第一和第二内部电极分别包括从其延伸的第一和第二引线部分, 陶瓷元件; 以及形成在陶瓷元件的一个表面上的第一和第二外部电极,分别通过第一和第二引线部分的暴露部分与第一和第二内部电极电连接,其中第一或第二引线的宽度 第一或第二外部电极的一部分宽度为10〜85%。

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