Abstract:
A composite electronic component may include: an input terminal part receiving power converted by a power managing part; a power stabilizing part stabilizing the power and including a composite body including a capacitor and a toroidal coil and having a hexahedral shape, the capacitor including a plurality of dielectric layers, internal electrodes disposed to face each other with the respective dielectric layers interposed therebetween, and capacitor electrodes electrically coupled to the internal electrodes, and the toroidal coil being wound around the capacitor, and the capacitor and the toroidal coil being embedded in a magnetic material of the composite body; and an output terminal part supplying the stabilized power.
Abstract:
A composite electronic component includes an input terminal portion receiving power converted by a power management unit, a power stabilizing unit stabilizing the power and including a composite body including a capacitor and a coil and having a hexahedral shape, the capacitor including a plurality of dielectric layers, internal electrodes disposed so as to face each other with a respective dielectric layer interposed therebetween, and capacitor electrodes electrically connected to the internal electrodes, and the coil being wound so as to encompass the capacitor and being buried in a magnetic material portion, and an output terminal portion supplying the stabilized power.
Abstract:
There is provided a multilayer ceramic electronic part to be embedded in a board, including: a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other; first and second internal electrodes; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first external electrode includes a first base electrode and a first terminal electrode formed on a portion of the first base electrode formed on at least one of the first and second main surfaces of the ceramic body, the second external electrode includes a second base electrode and a second terminal electrode formed on a portion of the second base electrode formed on at least one of the first and second main surfaces of the ceramic body.
Abstract:
A multilayer ceramic capacitor may include: a ceramic body including dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; an active layer configured to form capacitance by including first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween and alternately exposed to the first or second side surface; and a first external electrode disposed on the first side surface and electrically connected to the first internal electrodes and a second external electrode disposed on the second side surface and electrically connected to the second internal electrodes. When length of the ceramic body is L and length of the first and second external electrodes in the length direction of the ceramic body is L1, 0.2≦L1/L≦0.96 is satisfied.
Abstract:
There is provided multilayer ceramic capacitor including, a ceramic body including a plurality of dielectric layers laminated therein, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, with the dielectric layers interposed therebetween, and having capacitance formed therein, an upper cover layer formed on an upper portion of the active layer, a lower cover layer formed on a lower portion of the active layer and having a thickness greater than that of the upper cover layer, first and second dummy electrode terminals provided in the lower cover layer to be alternately exposed through both end surfaces of the lower cover layer, and first and second external electrodes covering the both end surfaces of the ceramic body.
Abstract:
There is provided an embedded multilayer ceramic electronic component including: a ceramic body including dielectric layers, having first and second lateral surfaces opposing one another, and having a thickness equal to or less than 250 μm; a first internal electrode and a second internal electrode disposed to face one another with the dielectric layer interposed therebetween; a first external electrode formed on the first lateral surface of the ceramic body and electrically connected to the first internal electrode and a second external electrode formed on the second lateral surface and electrically connected to the second internal electrode; and metal layers formed on the first external electrode and the second external electrode, respectively, and including copper (Cu), wherein when a thickness of the metal layers is tp, tp≧5 μm may be satisfied.
Abstract:
A multilayered ceramic capacitor includes a ceramic body in which a plurality of dielectric layers having an average thickness of 0.2 to 2.0 μm are stacked; an active layer including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, to form capacitance; an upper cover layer formed above the active layer; a lower cover layer formed below the active layer and thicker than the upper cover layer; and first and second external electrodes covering both end surfaces of the ceramic body, wherein the dielectric layer is configured of dielectric grains, and when an average thickness of the dielectric layer is defined as td, an average thickness of the first and second internal electrodes is defined as te, and an average grain size of the dielectric grains is defined as Da, Da≦td/3 and 0.2 μm
Abstract:
There is provided an embedded multilayer ceramic electronic component, including: a ceramic body including dielectric layers; first and second internal electrodes facing each other with the dielectric layers interposed therebetween; a first external electrode and a second external electrode formed on external surfaces of the ceramic body, the first external electrode being electrically connected to the first internal electrodes and the second external electrode being electrically connected to the second internal electrodes; and a plating layer formed on the first external electrode and the second external electrode, wherein a surface roughness of the ceramic body is 500 nm or greater and not greater than a thickness of a ceramic cover sheet and a surface roughness of the plating layer is 300 nm or greater and not greater than a thickness of the plating layer.
Abstract:
There is provided a multilayered ceramic capacitor, including: a ceramic body having a plurality of dielectric layers laminated therein; an active layer including a plurality of internal electrodes having the respective dielectric layers interposed therebetween; an upper cover layer; a lower cover layer; external electrodes; and a plurality of dummy electrodes, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as the thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as the thickness of the upper cover layer, a ratio of deviation between a center portion of the active layer and a center portion of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745.
Abstract:
There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; a plurality of first and second internal electrodes each formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes respectively including first and second lead parts extended therefrom to be exposed through one surface of the ceramic element; and first and second external electrodes formed on one surface of the ceramic element, and electrically connected to the first and second internal electrodes through exposed portions of the first and second lead parts, respectively, wherein a ratio of a width of the first or second lead part to a width of the first or second external electrode is 10 to 85%.