摘要:
An electrical connector (11) comprises an insulating housing (13), a plurality of contact elements (10) provided in a widthwise direction of the insulating housing, at least one guide portion 917) provided at a position where no contact element is present and guiding the connector to a position for plugging with a mating electrical connector (12), and a lock portion (18) provided at a top of the guide portion. The lock portion has a shape of a substantially sphere or a shape of a polyhedron having a top view of a substantially circle and locks a plugging condition between the electrical connectors.
摘要:
An easily adhesive polyamide film has been created from unstretched or uniaxially stretched non-heated polyamide film coated with a water-base coating mixture, whose main constituents are (A) water polyurethane resin containing acetylene glycol in which each carbon atom immediately adjacent to the triple-bonded carbon atom is replaced with a hydroxyl group and a methyl group, and/or an ethylene oxide addition product of the acetylene glycol; (B) a water-soluble polyepoxy compound; and (C) particles with an average diameter between 0.001 and 1.0 &mgr;m, of which the solid-content weight ratio is 98-30/2-70/0.1-10, the coating amount after stretching is between 0.005 and 0.030 g/m2, and the film is stretched in at least one direction and then heated. This newly invented film possesses good blocking resistance and excellent adhesiveness with print ink, laminate, and other coating mixtures, and is especially suitable for boiling sterilization, retort sterilization, and packaging of liquids.
摘要:
A circuit board electrical connector for a circuit board having an attachment opening, which comprises a housing; an attachment leg having a metallic surface and projecting downwardly from the housing into the attachment opening; and a solder retention area in the attachment leg so that solder flows into an upper portion of the attaching opening.
摘要:
An inscribed character is recognized with a device including a memory for storing signals representing the shapes of plural inscribed characters, a sensor for the shapes of inscribed characters, a comparator for the stored signals and signals from the sensor, and a display. The comparator compares a signal representing the sensed shape of the inscribed character and the stored signals representing the shapes of plural characters likely to be inscribed to derive signals representing plural selected candidate characters similar in shape to the inscribed character. In response to the signals representing plural selected candidate characters similar in shape to the inscribed character the plural candidate characters are displayed on a first region of the display abutting a second region where there is a representation of the inscribed character. One of the displayed plural candidate characters that is the intended character for the inscribed character is selected by an operator pressing a stylus against the intended character. A signal indicative of which of the displayed candidate character is the selected character is derived and causes the selected character to replace the inscribed character.
摘要:
A measuring device for measuring a glow center of a display device is provided with: an image pickup device which includes a sensing surface defined by a plurality of photoelectric conversion elements arranged in a two-dimensional manner at a specified pitch and picks up a light image to produce image data; an optical system which transmits a light image displayed on a display device to the sensing surface of the image pickup device; an optical system controller which controls the optical system to transmit the light image to the sensing surface in such a manner that the maximum spatial frequency of the light image at the sensing surface of the image pickup device is smaller than the reciprocal of the pitch of the photoelectric conversion element arrangement; and a calculator which calculates a glow center of the light image on the display device based on image data produced by the image pickup device.
摘要:
A semiconductor integrated circuit device having a switching MISFET, and a capacitor element formed over the semiconductor substrate, such as a DRAM, is disclosed. In a first aspect of the present invention, the impurity concentration of the semiconductor region of the switching MISFET to which the capacitor element is connected is less than the impurity concentration of semiconductor regions of MISFETs of peripheral circuitry. In a second aspect, the Y-select signal line overlaps the lower electrode layer of the capacitor element. In a third aspect, a potential barrier layer, provided at least under the semiconductor region of the switching MISFET to which the capacitor element is connected, is formed by diffusion of an impurity for a channel stopper region. In a fourth aspect, the dielectric film of the capacitor element is co-extensive with the capacitor electrode layer over it. In a fifth aspect, the capacitor dielectric film is a silicon nitride film having a silicon oxide layer thereon, the silicon oxide layer being formed by oxidizing a surface layer of the silicon nitride under high pressure. In sixth and seventh aspects, wiring is provided. In the sixth aspect, an aluminum wiring layer and a protective (and/or barrier) layer are formed by sputtering in the same vacuum sputtering chamber without breaking the vacuum between forming the layers; in the seventh aspect, a refractory metal, or a refractory metal silicide QSI.sub.x, where Q is a refractory metal and 0
摘要:
A semiconductor integrated circuit device having first and second field-effect transistors, wherein the gate electrode of the first field-effect transistor is defined by a first-level conductor layer, while a wiring which is connected to the source or drain region of the first field-effect transistor is defined by a second-level conductor layer, and the gate electrode of the second field-effect transistor is defined by a combination of the first- and second-level conductor layers which are stacked one upon the other. Further, the respective gate electrodes of the first and second field-effect transistors are formed through respective gate insulator films which are formed on the principal surface of a semiconductor substrate in the same manufacturing step. By virtue of the above-described means, it is possible to reduce the area required for connection between the source or drain region of the first field-effect transistor and the wiring and to thereby increase the scale of integration of the device. In addition, it is possible to lower the resistance of the gate electrode of the second field-effect transistor and to thereby increase the operating speed of the device. Since the first and second field-effect transistors can be formed on a semiconductor substrate having no damage generated thereto, it is possible to increase the dielectric strength of the gate insulator film and to thereby improve the electrical reliability of the device.
摘要:
A semiconductor memory device and a method of manufacturing the device wherein a field insulation is formed in a surface of a semiconductor body except for the source, drain and channel regions, a first floating gate is self-aligned to the channel region, a second gate insulated from the first floating gate covers the first floating gate and the first insulator having a width substantially same as the length of the channel region between the source and the drain regions.
摘要:
A semiconductor integrated circuit device and a method of manufacturing the same, wherein an MIS type memory transistor of a two-layered gate electrode structure is formed on the surface of a semiconductor substrate, and an MIS type transistor for a low voltage having a comparatively thin gate oxide film and an MIS type transistor for a high voltage having a comparatively thick gate oxide film are formed around the memory transistor.
摘要:
A charge transfer semiconductor device includes charge transfer passages which are formed in the interior of a semiconductor substrate and between adjacent gate electrodes, so that when a control voltage is applied to the gate electrode, charges to be transferred are moved principally through the charge transfer passage, whereby the charges are prevented from being trapped between the gate electrodes.