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公开(公告)号：US20210234512A1
公开(公告)日：2021-07-29
申请号：US17230269
申请日：2021-04-14
摘要： Fast envelope tracking systems are provided herein. In certain embodiments, an envelope tracking system for a power amplifier includes a switching regulator and a differential error amplifier configured to operate in combination with one another to generate a power amplifier supply voltage for the power amplifier based on an envelope of a radio frequency (RF) signal amplified by the power amplifier. The envelope tracking system further includes a differential envelope amplifier configured to amplify a differential envelope signal to generate a single-ended envelope signal that changes in relation to the envelope of the RF signal. Additionally, the differential error amplifier generates an output current operable to adjust a voltage level of the power amplifier supply voltage based on comparing the single-ended envelope signal to a reference signal.
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公开(公告)号：US10985711B2
公开(公告)日：2021-04-20
申请号：US16814807
申请日：2020-03-10
摘要： High bandwidth envelope trackers are provided herein. In certain embodiments, an envelope tracking system for a power amplifier includes a switching regulator that operates in combination with a high bandwidth amplifier to generate a power amplifier supply voltage for the power amplifier based on an envelope of a radio frequency (RF) signal amplified by the power amplifier. The high bandwidth amplifier includes an output that generates an output current for adjusting the power amplifier supply voltage, a first input that receives a reference signal, and a second input that receives an envelope signal indicating the envelope of the RF signal. The second input has lower input impedance than the first input to provide a rapid transient response and high envelope tracking bandwidth.
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公开(公告)号：US10985703B2
公开(公告)日：2021-04-20
申请号：US16682410
申请日：2019-11-13
摘要： Fast envelope tracking systems are provided herein. In certain embodiments, an envelope tracking system for a power amplifier includes a switching regulator and a differential error amplifier configured to operate in combination with one another to generate a power amplifier supply voltage for the power amplifier based on an envelope of a radio frequency (RF) signal amplified by the power amplifier. The envelope tracking system further includes a differential envelope amplifier configured to amplify a differential envelope signal to generate a single-ended envelope signal that changes in relation to the envelope of the RF signal. Additionally, the differential error amplifier generates an output current operable to adjust a voltage level of the power amplifier supply voltage based on comparing the single-ended envelope signal to a reference signal.
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54.发明授权公开(公告)号：US10277177B2
公开(公告)日：2019-04-30
申请号：US16000877
申请日：2018-06-05
摘要： A variable load power amplifier that improves the performance of a power amplifier that provides both envelope tracking (ET) and average power tracking (APT). The variable load power amplifier can include a plurality of amplifiers that are each selectively connectable into one of a plurality of parallel combinations, each of the plurality of parallel combinations characterized by a corresponding load line. The variable load power amplifier can also include a plurality of control elements arranged to selectively connect one or more of the plurality of amplifiers into one of the plurality of parallel combinations, each of the plurality of control elements having a respective input terminal provided to receive a respective control signal, each of the plurality of control elements responsive to the respective control signal.
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公开(公告)号：US10141901B2
公开(公告)日：2018-11-27
申请号：US15262377
申请日：2016-09-12
发明人： Guohao Zhang , Hardik Bhupendra Modi , Jaydutt Jagdish Joshi , Bhuvaneshwaran Vijayakumar , Dinhphuoc Vu Hoang
IPC分类号： H03F3/72 , H01L23/66 , H01L25/00 , H03F1/02 , H03F1/56 , H03F3/195 , H03F3/21 , H03F3/24 , H04B1/04 , H04W52/02
摘要： Disclosed are devices and methods for improving power added efficiency and linearity of radio-frequency power amplifiers implemented in flip-chip configurations. In some embodiments, a harmonic termination circuit can be provided so as to be separate from an output matching network configured to provide impedance matching at a fundamental frequency. The harmonic termination circuit can be configured to terminate at a phase corresponding to a harmonic frequency of the power amplifier output. Such a configuration of separate fundamental matching network and harmonic termination circuit allows each to be tuned separately to thereby improve performance parameters such as power added efficiency and linearity.
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公开(公告)号：US20180337458A1
公开(公告)日：2018-11-22
申请号：US15982155
申请日：2018-05-17
摘要： Reconfigurable antenna systems with ground tuning pads are provided herein. In certain configurations, an antenna system includes a module substrate including a ground plane and a ground tuning pad configured to receive a ground voltage from the ground plane. The antenna system further includes an antenna element and a tuning conductor that is spaced apart from the antenna element and operable to load the antenna element. Furthermore, a switch is electrically connected between the tuning conductor and the ground tuning pad, and operates to selectively connect the tuning conductor to the ground plane by way of the ground tuning pad to provide tuning to the antenna element.
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57.发明申请公开(公告)号：US20180294569A1
公开(公告)日：2018-10-11
申请号：US15943416
申请日：2018-04-02
发明人： Dinhphuoc Vu Hoang , Robert Francis Darveaux , Anthony James LoBianco , Lori Ann DeOrio , Hoang Mong Nguyen , Ki Wook Lee , Hardik Bhupendra Modi , Foad Arfaei Malekzadeh , Stephen Joseph Kovacic , René Rodriguez
摘要： An antenna structure can include a printed circuit board module and a mold compound disposed on a side of the printed circuit board module. A planar antenna is defined by a conformal shield layer disposed on a first surface of the mold compound such that the mold compound is disposed between the printed circuit board module and the conformal shield layer. The mold compound has a cavity defined therein between the planar antenna and the printed circuit board module, the cavity filled with a material different than the mold compound material. Optionally, the cavity can be filled with air. The thickness of the mold compound layer and the shape of the conformal shield layer can be varied to optimize a performance of the antenna.
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公开(公告)号：US10090812B2
公开(公告)日：2018-10-02
申请号：US15482321
申请日：2017-04-07
发明人： Hardik Bhupendra Modi , Sandra Louise Petty-Weeks , Hongxiao Shao , Weimin Sun , Peter J. Zampardi, Jr. , Guohao Zhang
IPC分类号： H03F3/14 , H03F3/213 , H01L29/20 , H01L23/498 , H01L21/48 , H01L29/08 , H01L23/31 , H01L21/8249 , H01L21/78 , H01L21/56 , H01L21/66 , H01L23/48 , H01L21/768 , H03F3/19 , H03F3/24 , H01L29/36 , H01L29/66 , H01L29/812 , H01L29/205 , H01L21/8252 , H01L27/06 , H01L23/552 , H01L23/66 , H01L23/00 , H01L23/50 , H03F3/195 , H03F3/60 , H03F1/02 , H03F3/21 , H03F3/45 , H01L29/737 , H01L29/06 , H01L29/10 , H01L29/8605 , H01L27/092 , H03F3/187 , H03F3/347
摘要： One aspect of this disclosure is a power amplifier module that includes a power amplifier die, a first bonding pad on a conductive trace, and a second bonding pad on a conductive trace. The die includes an on-die passive device and a power amplifier. The first bonding pad is electrically connected to the on-die passive device by a first wire bond. The second bonding pad is in a conductive path between the first bonding pad and a radio frequency output of the power amplifier module. The second bonding pad includes a nickel layer having a thickness that is less than 0.5 um, a palladium layer over the nickel layer, and a gold layer over the palladium layer and bonded to a second wire bond that is electrically connected to an output of the power amplifier. Other embodiments of the module are provided along with related methods and components thereof.
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公开(公告)号：US09876473B2
公开(公告)日：2018-01-23
申请号：US15222746
申请日：2016-07-28
CPC分类号： H03F1/0227 , H03F3/19 , H03F3/245 , H03F3/45179 , H03F3/45192 , H03F3/68 , H03F2200/102 , H03F2200/336 , H03F2200/451 , H04W52/0261 , Y02B70/30 , Y02D70/00 , Y02D70/1262 , Y02D70/142 , Y02D70/26
摘要： Apparatus and methods for wideband envelope tracking systems are disclosed herein. In certain implementations, an envelope tracker includes a DC-to-DC converter, a current digital-to-analog converter (DAC), an error amplifier, a feedback circuit, and an AC combiner. The current DAC receives a digital envelope signal, and uses the digital envelope signal to generate an envelope current. The feedback circuit is connected between an output and an inverting input of the error amplifier, and the envelope current is provided to the error amplifier's inverting input. Additionally, the AC combiner generates a power amplifier supply voltage by combining an output of the DC-to-DC converter and an output of the error amplifier.
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公开(公告)号：US20170301647A1
公开(公告)日：2017-10-19
申请号：US15593176
申请日：2017-05-11
CPC分类号： H01L24/85 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2223/6611 , H01L2223/6655 , H01L2223/6677 , H01L2224/32225 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48159 , H01L2224/48227 , H01L2224/48465 , H01L2224/48644 , H01L2224/48844 , H01L2224/73265 , H01L2224/85444 , H01L2924/00011 , H01L2924/00012 , H01L2924/01015 , H01L2924/01047 , H01L2924/10329 , H01L2924/12042 , H01L2924/1305 , H01L2924/13051 , H01L2924/1421 , H01L2924/1423 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/3011 , H05K1/0243 , H05K3/244 , H05K2201/0341 , H01L2924/00014 , H01L2924/00
摘要： This disclosure relates to a radio frequency (RF) transmission line for high performance RF applications. The RF transmission line includes a conductive layer and finish plating on the conductive layer. The finish plating includes a gold layer, a palladium layer proximate the gold layer, and a nickel layer proximate the palladium layer. The nickel layer has a thickness that allows a radio frequency signal received at the gold layer to penetrate the nickel layer and propagate in the conductive layer.
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