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    Digital camera module for detachably mounting with flex printed circuit board
    52.
    发明授权
    Digital camera module for detachably mounting with flex printed circuit board 有权
    数码相机模块，用于可拆卸地安装柔性印刷电路板

    公开(公告)号：US07361880B2

    公开(公告)日：2008-04-22

    申请号：US11478503

    申请日：2006-06-28

    Applicant: Steven Webster

    Inventor： Steven Webster

    IPC: H01L27/00 ,  H01L27/14 ,  H01L23/02 ,  H01L23/52

    CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14634 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16151 ,  H05K1/118 ,  H05K3/326 ,  H01L2924/00014

    Abstract: A digital camera module (100) includes a holder, an image sensor chip package (30), a number of conductive elements (24) and a circuit board (40). The holder defines a receiving portion. The holder is mounted on the image sensor chip package. The image sensor chip package has a number of outer pads. The outer pads are positioned in the receiving portion of the holder. The conductive elements are received in the receiving portion. One end of each of the conductive elements is connected to the inner pads, the other end of each of the conductive elements is connected to the circuit board.

    Abstract translation: 数字照相机模块（100）包括保持器，图像传感器芯片封装（30），多个导电元件（24）和电路板（40）。 保持器限定接收部分。 保持器安装在图像传感器芯片封装上。 图像传感器芯片封装具有多个外部焊盘。 外垫位于保持器的接收部分中。 导电元件被接收在接收部分中。 每个导电元件的一端连接到内部焊盘，每个导电元件的另一端连接到电路板。

    Image sensor chip package fabrication method
    54.
    发明申请
    Image sensor chip package fabrication method 有权
    图像传感器芯片封装制造方法

    公开(公告)号：US20070057149A1

    公开(公告)日：2007-03-15

    申请号：US11453456

    申请日：2006-06-14

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    IPC: H01L27/00

    CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014

    Abstract: An image sensor package method includes the steps of first, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces; Second, mounting an image sensor chip on the base and received in the cavity, the image sensor having a photosensitive area. Third, providing a plurality of wires, each electrically connects the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourth, applying an adhesive means around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover on the carrier, where an adhesive means fixes the cover in place.

    Abstract translation: 图像传感器封装方法包括以下步骤：首先提供一种包括基座（24）和引线框架（320）的载体（30）。 基座在其中具有空腔，引线框架包括多个导电件; 第二，将图像传感器芯片安装在基座上并被接纳在空腔中，图像传感器具有感光区域。 第三，提供多条导线，每个电线将图像传感器芯片和载体的相应的一个导电片电连接。 第四，在图像传感器芯片周围施加至少部分地覆盖所有电线的粘合剂装置。 最后，将透明盖子安装在托架上，粘合剂将盖子固定在适当位置。

    Image sensor chip package
    55.
    发明申请
    Image sensor chip package 审中-公开
    图像传感器芯片封装

    公开(公告)号：US20070034772A1

    公开(公告)日：2007-02-15

    申请号：US11448314

    申请日：2006-06-07

    Applicant: Steven Webster ,  Ying-Cheng Wu

    Inventor： Steven Webster ,  Ying-Cheng Wu

    IPC: C12Q1/68

    CPC classification number: H04N5/2253 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/16195 ,  H01L2924/00014

    Abstract: A digital camera module includes a barrel (10), a seat (20) and an image sensor chip package (30) in accordance with a preferred embodiment is shown. The image sensor chip package includes a carrier (32), a chip (34), a number of bonding wires (36) and a cover (38). The carrier includes a base (24). The chip is mounted on the base and has an active area. The second conductive means electronically connects the chip and the conductive means. An adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover adheres to the carrier with the adhesive means and defines a sealing space (37) for sealing the active area of the chip therein. The active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.

    Abstract translation: 示出了根据优选实施例的数字照相机模块，包括镜筒（10），座（20）和图像传感器芯片封装（30）。 图像传感器芯片封装包括载体（32），芯片（34），多个接合线（36）和盖（38）。 载体包括基部（24）。 芯片安装在基座上并具有有效区域。 第二导电装置电连接芯片和导电装置。 在芯片的有效区域周围施加粘合剂。 透明盖安装在托架的底座上。 盖子用粘合剂粘合到载体上并且限定用于密封芯片的有效区域的密封空间（37）。 芯片的有效面积被充分保护，免受小体积密封空间的污染。

    Image sensor chip package
    56.
    发明申请
    Image sensor chip package 失效
    图像传感器芯片封装

    公开(公告)号：US20070023608A1

    公开(公告)日：2007-02-01

    申请号：US11448570

    申请日：2006-06-07

    Applicant: Steven Webster ,  Ying-Cheng Wu

    Inventor： Steven Webster ,  Ying-Cheng Wu

    IPC: C12Q1/68

    CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/16195 ,  H01L2924/00014

    Abstract: A chip package (200) includes a carrier (20), a chip (22), a second conductive means (26) and a transparent cover (28). The carrier (20) includes a base (24). The chip is mounted on the base and has an active area (222). The second conductive means electronically connects the chip with the conductive means. The first adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover is adhered with the first adhesive means so as to define a sealing space (32) for sealing the active area of the chip therein. It can be seen that the active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.

    Abstract translation: 芯片封装（200）包括载体（20），芯片（22），第二导电装置（26）和透明盖（28）。 载体（20）包括基座（24）。 芯片安装在基座上并具有有效区域（222）。 第二导电装置将芯片与导电装置电连接。 第一粘合装置被施加在芯片的有效区域周围。 透明盖安装在托架的底座上。 该盖用第一粘合装置粘合以便限定用于密封芯片的有效区域的密封空间（32）。 可以看出，芯片的有效面积被充分保护，免受小体积密封空间的污染。

    Thin integrated circuit package having an optically transparent window
    59.
    发明授权
    Thin integrated circuit package having an optically transparent window 有权
    薄的集成电路封装，具有光学透明的窗口

    公开(公告)号：US06784534B1

    公开(公告)日：2004-08-31

    申请号：US10067068

    申请日：2002-02-06

    Applicant: Thomas P. Glenn ,  Vincent Di Caprio ,  Steven Webster

    Inventor： Thomas P. Glenn ,  Vincent Di Caprio ,  Steven Webster

    IPC: H01L2348

    CPC classification number: H01L31/0203 ,  H01L2924/15311

    Abstract: A thin integrated circuit package having an optically transparent window provides a small profile optical integrated circuit assembly for use in digital cameras, video cellular telephones and other devices requiring a small physical size and optical integrated circuit technology. A tape having a conductive metal layer on a surface is used to interface the optical integrated circuit die with electrical interconnects disposed on a surface of the tape opposite the die. A supporting structure surrounds the die and a glass cover is either bonded to the top of the supporting structure over the die, or the glass cover is bonded to the top of the die and the gap between the glass cover and supporting structure filled with encapsulant. The resulting assembly yields a very thin optical integrated circuit package.

    Abstract translation: 具有光学透明窗口的薄集成电路封装提供了用于数字照相机，视频蜂窝电话和需要较小物理尺寸和光学集成电路技术的其它设备的小型光学集成电路组件。 使用在表面上具有导电金属层的带将光学集成电路管芯与设置在与管芯相对的带的表面上的电互连接合。 支撑结构围绕模具，并且玻璃盖或者结合到模具上方的支撑结构的顶部，或者玻璃盖结合到模具的顶部以及玻璃盖和填充有密封剂的支撑结构之间的间隙。 所得组件产生非常薄的光学集成电路封装。

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