公开(公告)号：US20080157357A1

公开(公告)日：2008-07-03

申请号：US11754555

申请日：2007-05-29

申请人： Sung Min Kim ,  Min Suk Suh

发明人： Sung Min Kim ,  Min Suk Suh

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L21/76898 ,  H01L24/11 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/16235 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73203 ,  H01L2224/90 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2224/29075 ,  H01L2224/83851 ,  H01L2224/05099

摘要： A stack package includes an upper semiconductor chip having a plurality of first bonding pads which are formed on an upper surface of the upper semiconductor chip and via-holes which are defined in the upper semiconductor chip under the respective first bonding pads; and a lower semiconductor chip attached to a lower surface of the upper semiconductor chip and having a plurality of second bonding pads which are formed on an upper surface of the lower semiconductor chip and bumps which are formed on the respective second bonding pads and are inserted into the respective via-holes to be come into the respective first bonding pads.

摘要翻译： 堆叠封装包括上半导体芯片，其具有形成在上半导体芯片的上表面上的多个第一焊盘和在相应的第一焊盘下方的上半导体芯片中限定的通孔; 以及下半导体芯片，其安装在上半导体芯片的下表面，并且具有多个第二焊盘，其形成在下半导体芯片的上表面上，并且形成在各个第二焊盘上并被插入 各个通孔将进入相应的第一接合焊盘。

公开(公告)号：US07056838B2

公开(公告)日：2006-06-06

申请号：US11197090

申请日：2005-08-04

申请人： Jae Hoon Shim ,  Sung Min Kim ,  Bong Ok Kim ,  No Gil Park ,  Mi Young Kwak ,  Young Kwan Kim

发明人： Jae Hoon Shim ,  Sung Min Kim ,  Bong Ok Kim ,  No Gil Park ,  Mi Young Kwak ,  Young Kwan Kim

IPC分类号： H01L21/31

CPC分类号： H01L51/0516 ,  H01L51/0036 ,  H01L51/0052 ,  H01L51/0545

摘要： Provided is a method for fabricating an organic semiconductor transistor having an organic polymeric gate insulating layer. The method includes forming an organic gate insulating layer on a substrate by a vapor deposition method using organic monomer sources, and causing a polymerization reaction to occur in the organic gate insulating layer to complete an organic polymeric gate insulating layer. Since the vapor deposition method, which is a low-temperature dry-type technique, is employed, the organic polymeric gate insulating layer can be uniformly formed on a large-area substrate by a simplified in-situ process.

公开(公告)号：US09640285B2

公开(公告)日：2017-05-02

申请号：US13335197

申请日：2011-12-22

申请人： Jung Cheol Shin ,  Sang Kyun Woo ,  Yong Chan Kim ,  Sung Min Kim ,  Chae Joon Lim

发明人： Jung Cheol Shin ,  Sang Kyun Woo ,  Yong Chan Kim ,  Sung Min Kim ,  Chae Joon Lim

IPC分类号： G21C17/06

CPC分类号： G21C17/06

摘要： Provided are a probe and an apparatus for measuring a thickness of an oxide layer of a fuel rod, capable of testing claddings of inner and outer fuel rods of a nuclear fuel assembly without disassembling the nuclear fuel assembly. The probe includes a fuel rod transfer region on which an eddy current sensor capable of continuously testing claddings of outer fuel rods of a fixed nuclear fuel assembly is mounted. Further, the apparatus includes a frame in which a cylinder driven in upward and downward directions is mounted, a first probe connected to one side of the cylinder in order to test claddings of outer fuel rods of a nuclear fuel assembly, and a second probe connected to the other side of the cylinder in order to test claddings of inner fuel rods of the nuclear fuel assembly.

公开(公告)号：US09416953B2

公开(公告)日：2016-08-16

申请号：US14113126

申请日：2012-04-19

申请人： Sung Min Kim ,  Kwang Jae Lee

发明人： Sung Min Kim ,  Kwang Jae Lee

IPC分类号： F21V29/02 ,  F21V29/00 ,  F21K99/00 ,  F21V29/77 ,  F21Y101/02

CPC分类号： F21V29/773 ,  F21K9/23 ,  F21K9/232 ,  F21V29/004 ,  F21Y2101/00 ,  F21Y2115/10

摘要： Provided is an LED lighting apparatus. The LED lighting apparatus include an LED, a socket part supplying a power into the LED, a heat sink body having one side on which the LED is mounted and the other side to which the socket part is coupled, and a heat sink pin disposed along a circumference of the heat sink body, the heat sink pin having one side extending downward from the heat sink body. The heat sink body may be modified in shape to reduce a weight and improve heat dissipation performance.

摘要翻译： 提供了一种LED照明装置。 LED照明装置包括LED，向LED提供电力的插座部分，具有LED的一侧的散热体和与插座部分耦合的另一侧，以及沿着 所述散热体的周边，所述散热片的一侧从所述散热体本体向下延伸。 散热体的形状可以被改变以减轻重量并改善散热性能。

公开(公告)号：US20140112006A1

公开(公告)日：2014-04-24

申请号：US14113126

申请日：2012-04-19

申请人： Sung Min Kim ,  Kwang Jae Lee

发明人： Sung Min Kim ,  Kwang Jae Lee

IPC分类号： F21V29/00

CPC分类号： F21V29/773 ,  F21K9/23 ,  F21K9/232 ,  F21V29/004 ,  F21Y2101/00 ,  F21Y2115/10

摘要： Provided is an LED lighting apparatus. The LED lighting apparatus include an LED, a socket part supplying a power into the LED, a heat sink body having one side on which the LED is mounted and the other side to which the socket part is coupled, and a heat sink pin disposed along a circumference of the heat sink body, the heat sink pin having one side extending downward from the heat sink body. The heat sink body may be modified in shape to reduce a weight and improve heat dissipation performance.

摘要翻译： 提供了一种LED照明装置。 LED照明装置包括LED，向LED提供电力的插座部分，具有LED的一侧的散热体和与插座部分耦合的另一侧，以及沿着 所述散热体的周边，所述散热片的一侧从所述散热体本体向下延伸。 散热体的形状可以被改变以减轻重量并改善散热性能。

公开(公告)号：US08619091B2

公开(公告)日：2013-12-31

申请号：US13062183

申请日：2009-09-04

申请人： Sung Min Kim

发明人： Sung Min Kim

IPC分类号： G09G5/02

CPC分类号： G09G5/10 ,  G09G3/28 ,  G09G2320/0271 ,  G09G2320/0626 ,  G09G2320/066 ,  G09G2360/16

摘要： The present invention relates to a video display apparatus. More specifically, the present invention relates to a brightness adjusting device of a video display apparatus that is able to improve perceived contrast ratio by brightness of a video signal input to the video display apparatus having a plasma display panel applied thereto.

摘要翻译： 视频显示装置技术领域本发明涉及一种视频显示装置。 更具体地，本发明涉及一种视频显示装置的亮度调节装置，其能够通过输入到具有应用于其的等离子体显示面板的视频显示装置的视频信号的亮度来提高感知对比度。

公开(公告)号：US20130028490A1

公开(公告)日：2013-01-31

申请号：US13519470

申请日：2012-02-01

申请人： Sung Min Kim ,  Kwang Yong Shin ,  Young Ho Park ,  Hyeon Chang Lee ,  So Ra Cho ,  Eui Chul Lee ,  Gang Ryung Park

发明人： Sung Min Kim ,  Kwang Yong Shin ,  Young Ho Park ,  Hyeon Chang Lee ,  So Ra Cho ,  Eui Chul Lee ,  Gang Ryung Park

IPC分类号： G06K9/00

CPC分类号： G06T5/50 ,  G06T5/003 ,  G06T2207/10048 ,  G06T2207/20221 ,  G06T2207/30101

摘要： A method of processing a blood vessel image is provided. The method includes (a) sharpening an original blood vessel image using a Gabor filter in consideration of various directions and thicknesses of blood vessels included in the blood vessel and (b) detecting edges according to a change in brightness in a blood vessel domain and a non-blood vessel domain of the original blood vessel image and the blood vessel image on which the Gabor filtering step is completed, using an edge extraction method based on a first-order differentiation or second-order differentiation.

摘要翻译： 提供了一种处理血管图像的方法。 该方法包括：（a）考虑血管中包含的血管的各种方向和厚度，使用Gabor滤波器来锐化原始血管图像，（b）根据血管结构域的亮度变化检测边缘， 使用基于一阶微分或二次微分的边缘提取方法，原始血管图像的非血管结构域和完成了Gabor滤波步骤的血管图像。

公开(公告)号：US20120177912A1

公开(公告)日：2012-07-12

申请号：US13346117

申请日：2012-01-09

申请人： Sung Min Kim ,  InKyu Song

发明人： Sung Min Kim ,  InKyu Song

IPC分类号： B32B3/00 ,  B32B7/12 ,  C09J175/16

CPC分类号： C09J175/16 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/318 ,  C09J2433/00 ,  C09J2475/00 ,  Y10T428/26 ,  Y10T428/2896

摘要： Disclosed is an adhesive composition for optical use and, more particularly, an adhesive composition which includes; 30 to 80 wt. % of a mono-functional urethane acrylate oligomer having a weight average molecular weight of 10,000 and 35,000, 10 to 60 wt. % of an acrylate monomer; and 0.1 to 10 wt. % of a free radical photo-initiator, so as to retain physical properties of the adhesive composition such as coating property and adhesiveness and, in addition, reduce incurring of setting shrinkage during photo-polymerization, thereby exhibiting a uniform thickness and excellent surface appearance, durability such as heat resistance and moist heat resistance, and storage elasticity. Moreover, the inventive composition does not contain an alternative solvent, thus enabling manufacturing of a thick film type adhesive film.

摘要翻译： 公开了一种用于光学用途的粘合剂组合物，更具体地，涉及一种粘合剂组合物，其包括： 30〜80重量％ ％的重均分子量为10,000和35,000的单官能聚氨酯丙烯酸酯低聚物，10至60重量％ ％的丙烯酸酯单体; 和0.1〜10wt。 ％的自由基光引发剂，以保持粘合剂组合物的物理性能如涂布性能和粘合性，并且另外减少光聚合期间凝固收缩的发生，从而表现出均匀的厚度和优异的表面外观， 耐久性如耐热性和耐湿热性以及储存弹性。 此外，本发明的组合物不含有替代溶剂，因此能够制造厚膜型粘合剂膜。

公开(公告)号：US20120104940A1

公开(公告)日：2012-05-03

申请号：US13262359

申请日：2010-03-19

申请人： Hyo-Nim Shin ,  Chi Sik Kim ,  Young Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

发明人： Hyo-Nim Shin ,  Chi Sik Kim ,  Young Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

IPC分类号： H05B33/14 ,  C07C13/62 ,  C07C211/60 ,  C07F7/10 ,  C07D487/14

CPC分类号： C09K11/06 ,  H01L51/0055 ,  H01L51/0059 ,  H01L51/006 ,  H01L51/0072 ,  H01L51/0077 ,  H01L51/0081 ,  H01L51/0085 ,  H01L51/0094 ,  H01L51/5016 ,  H01L51/5048 ,  H01L51/5052 ,  H01L51/5088 ,  H05B33/20 ,  Y02E10/549 ,  Y02P70/521

摘要： The present invention relates to novel compounds for organic electronic material, and organic electronic devices and organic solar cells using the same. The compounds for organic electronic material may be included in a hole transport layer, electron transport layer or hole injection layer, or may be used as host or dopant. With good luminous efficiency and excellent life property of the material, they may be used to manufacture OLEDs having very good operation life.

摘要翻译： 本发明涉及用于有机电子材料的新型化合物，以及使用该化合物的有机电子器件和有机太阳能电池。 有机电子材料的化合物可以包括在空穴传输层，电子传输层或空穴注入层中，或者可以用作主体或掺杂剂。 具有良好的发光效率和优异的材料寿命，它们可用于制造具有非常好的使用寿命的OLED。

公开(公告)号：US08067839B2

公开(公告)日：2011-11-29

申请号：US12900900

申请日：2010-10-08

申请人： Sung Min Kim

发明人： Sung Min Kim

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L25/0657 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/3128 ,  H01L24/24 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/0557 ,  H01L2224/13009 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/821 ,  H01L2224/83 ,  H01L2224/9202 ,  H01L2224/92244 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2224/05552

摘要： Disclosed are a stacked semiconductor package and a method for manufacturing the same. The method for manufacturing a stacked semiconductor package includes preparing a substrate formed with a seed metal layer; laminating semiconductor chips having via holes aligned with one another on the seed metal layer to form a semiconductor chip module; and growing a conductive layer inside of the via holes using the seed metal layer to form a conductive growth layer inside of the via holes.

摘要翻译： 公开了层叠半导体封装及其制造方法。 层叠半导体封装的制造方法包括：准备形成有种子金属层的基板; 层叠具有在种子金属层上彼此对准的通孔的半导体芯片，以形成半导体芯片模块; 以及使用所述种子金属层在所述通孔内部生长导电层，以在所述通孔内部形成导电生长层。