公开(公告)号：US20240072530A1

公开(公告)日：2024-02-29

申请号：US18337382

申请日：2023-06-19

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Jiri FOREJTEK ,  Petr ROZSYPAL

IPC分类号： H02H3/087 ,  H02H9/04 ,  H03K17/082

CPC分类号： H02H3/087 ,  H02H9/041 ,  H03K17/0822 ,  H03K2217/0027

摘要： An electronic fuse that includes a clamp circuit to enhance the protection provided by the electronic fuse. The clamp circuit can detect a short circuit condition quickly and transmit a trigger signal to a controller so that a power transistor of the electronic fuse can be turned-OFF before the current through the power transistor causes overheating or damage. The clamp circuit is a dedicated circuit for short-circuit detection that can work with other current control circuits of the electronic fuse. The clamp circuit does not increase the power consumed by the electronic fuse while not in the short circuit condition. The clamp circuit is small and fast because it can use low-voltage devices, even as high voltages are present at the input and output of the electronic fuse.

公开(公告)号：US20240072009A1

公开(公告)日：2024-02-29

申请号：US18490270

申请日：2023-10-19

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Chee Hiong CHEW ,  Erik Nino TOLENTINO ,  Vemmond Jeng Hung NG ,  Shutesh KRISHNAN

IPC分类号： H01L25/07 ,  H01L23/00 ,  H01L23/373 ,  H01L25/00 ,  H01L25/18

CPC分类号： H01L25/072 ,  H01L23/3735 ,  H01L24/40 ,  H01L24/84 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/4001 ,  H01L2224/40137 ,  H01L2224/4052 ,  H01L2224/40991 ,  H01L2224/8484 ,  H01L2224/84931 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0503 ,  H01L2924/1203 ,  H01L2924/13055

摘要： Implementations of semiconductor packages may include one or more die coupled over a substrate, an electrically conductive spacer coupled over the substrate, and a clip coupled over and to the one or more die and the electrically conductive spacer. The clip may electrically couple the one or more die and the electrically conductive spacer.

公开(公告)号：US20240064944A1

公开(公告)日：2024-02-22

申请号：US18364330

申请日：2023-08-02

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Roveendra PAUL ,  Hyungsoo KIM

IPC分类号： H05K7/20

CPC分类号： H05K7/20927

摘要： A package includes a power electronics module disposed between a first bracket and a second bracket with the power electronics module covering openings in the first bracket and the second bracket. Leak-proof joints are formed between surfaces of the power electronics module and the first bracket and the second bracket. A first cover beam is disposed on, and joined to, the first bracket to enclose a first cooling fluid channel for cooling fluid flow over the power electronics module. A second cover beam is disposed on, and joined to, the second bracket to enclose a second cooling fluid channel for cooling fluid flow over the power electronics module. The package includes end connectors that have input and output ports for cooling fluid flow through the first cooling fluid channel and the second cooling fluid channel.

公开(公告)号：US20240061800A1

公开(公告)日：2024-02-22

申请号：US18162972

申请日：2023-02-01

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Marek HUSTAVA

IPC分类号： G06F13/40

CPC分类号： G06F13/404

摘要： Accordingly, there is disclosed herein host device and bus communication method that enables fast sensor device reinitialization that minimizes outage time associated with an unexpected device reset. One illustrative bus communication method includes: providing each of one or more slave devices with a dynamically-determined bus address; querying each of the dynamically-determined bus addresses to obtain a unique device identifier associated with that dynamically-determined bus address; receiving a sequence of data frames each having time-division multiplexed data from the one or more slave devices; and between data frames in the sequence, checking to determine whether any of the one or more slave devices has been reset.

公开(公告)号：US11908840B2

公开(公告)日：2024-02-20

申请号：US17823164

申请日：2022-08-30

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Chee Hiong Chew ,  Atapol Prajuckamol ,  Stephen St. Germain ,  Yusheng Lin

IPC分类号： H01L25/07 ,  H01L25/00 ,  H01L23/367 ,  H01L23/00

CPC分类号： H01L25/071 ,  H01L23/367 ,  H01L24/32 ,  H01L25/50 ,  H01L2224/32245

摘要： Implementations of semiconductor packages may include: a first substrate having two or more die coupled to a first side, a clip coupled to each of the two or more die on the first substrate and a second substrate having two or more die coupled to a first side of the second substrate. A clip may be coupled to each of the two or more die on the second substrate. The package may include two or more spacers coupled to the first side of the first substrate and a lead frame between the first substrate and the second substrate and a molding compound. A second side of each of the first substrate and the second substrate may be exposed through the molding compound. A perimeter of the first substrate and a perimeter of the second substrate may not fully overlap when coupled through the two or more spacers.

公开(公告)号：US20240047498A1

公开(公告)日：2024-02-08

申请号：US18490217

申请日：2023-10-19

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Shou-Chian HSU

IPC分类号： H01L27/146 ,  H01L23/00

CPC分类号： H01L27/14636 ,  H01L27/14618 ,  H01L27/14687 ,  H01L24/13 ,  H01L2224/13147 ,  H01L2224/13024

摘要： Implementations of semiconductor packages may include: a semiconductor die having a first side and a second side and an active area on the second side of the die. The semiconductor packages may also include two or more bumps coupled to two or more die pads on a second side of the die. The semiconductor packages may include an optically transmissive lid coupled to the semiconductor die through an adhesive, two or more bumps, and a first redistribution layer (RDL). The semiconductor package may include a second redistribution layer (RDL) coupled with the first RDL on the second side of the semiconductor die. The second RDL may extend to the first side of the semiconductor die. The first RDL may extend to an edge of the semiconductor die.

公开(公告)号：US11894245B2

公开(公告)日：2024-02-06

申请号：US16862294

申请日：2020-04-29

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Michael J. Seddon ,  Francis J. Carney

IPC分类号： H01L21/67 ,  B21D11/10 ,  H01L21/02

CPC分类号： H01L21/67092 ,  B21D11/10 ,  H01L21/02035

摘要： Implementations of a packaging system may include a wafer; and a curvature adjustment structure coupled thereto where the curvature adjustment structure may be configured to alter a curvature of a largest planar surface of the wafer.

公开(公告)号：US11894234B2

公开(公告)日：2024-02-06

申请号：US17813351

申请日：2022-07-19

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Francis J. Carney ,  Chee Hiong Chew ,  Soon Wei Wang ,  Eiji Kurose

IPC分类号： H01L21/302 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48 ,  H01L23/00 ,  H01L21/78 ,  H01L23/12

CPC分类号： H01L21/302 ,  H01L21/48 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/12 ,  H01L23/3185 ,  H01L24/04 ,  H01L24/26 ,  H01L2224/94

摘要： Implementations of a semiconductor device may include a semiconductor die including a first largest planar surface, a second largest planar surface and a thickness between the first largest planar surface and the second largest planar surface; and one of a permanent die support structure, a temporary die support structure, or any combination thereof coupled to one of the first largest planar surface, the second largest planar surface, the thickness, or any combination thereof where the semiconductor die may be coupled with one of a substrate, a leadframe, an interposer, a package, a bonding surface, or a mounting surface. The thickness may be between 0.1 microns and 125 microns.

公开(公告)号：US20240039410A1

公开(公告)日：2024-02-01

申请号：US17815984

申请日：2022-07-29

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Margaret SPILLANE ,  Kevin KELLIHER ,  Owen CREGG ,  Paul J. HARRIMAN

IPC分类号： H02M3/158 ,  H02M1/32

CPC分类号： H02M3/1584 ,  H02M1/327

摘要： A multiphase power stage that includes addressing and communication techniques to read temperatures of the phases for thermal load balancing is disclosed. The disclosure describes driver modules that can be assigned addresses for serial communication on a common communication bus by temporarily communicating the addresses over dedicated pulse width modulation connections between the driver modules and the controller. After assignment, a temperature request message, addressed to a driver module, can trigger the driver module to transmit an analog temperature signal to a common temperature bus coupled between the driver modules and the controller. The temperatures of the driver modules may be collected in order to activate and deactivate driver modules based on their temperatures, which can balance a thermal load on the multiphase power stage.

公开(公告)号：US20240038805A1

公开(公告)日：2024-02-01

申请号：US18487611

申请日：2023-10-16

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Yu-Te HSIEH

IPC分类号： H01L27/146

CPC分类号： H01L27/14625 ,  H01L27/14614 ,  H01L27/14634

摘要： According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, a light transmitting member, and a plurality of pillar members disposed between and contacting the image sensor die and the light transmitting member. A height of the plurality of pillar members defines a gap height between an active region of the image sensor die and the light transmitting member. The image sensor package including a bonding material that couples the light transmitting member to the image sensor. The bonding material contacts a side of a pillar member, of the plurality of pillar members, that extends between a first end contacting the light transmitting member and a second end contacting the image sensor die.