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公开(公告)号:US20100243623A1
公开(公告)日:2010-09-30
申请号:US12731479
申请日:2010-03-25
申请人: Hyun-Chul LEE , Jin-Han Park , Joon-Hyung Kim , Won-Kyu Lim , Jae-Seok Park , Cheol-Lae Roh , Yong-Jin Lee
发明人: Hyun-Chul LEE , Jin-Han Park , Joon-Hyung Kim , Won-Kyu Lim , Jae-Seok Park , Cheol-Lae Roh , Yong-Jin Lee
IPC分类号: B23K26/38
CPC分类号: C03B33/082 , B23K26/082 , B23K26/40 , B23K2103/50 , C03B33/033 , C03B33/076 , G02F1/133351 , H01L51/56 , H01L2251/566 , Y10T225/12 , Y10T225/321
摘要: A substrate cutting method includes the steps of aligning a panel including two or more substrates, along a cutting line, forming groove lines in the respective substrates of the panel along the cutting line, by oscillating respective ultraviolet UV laser beams along the cutting line, and cutting the panel along the groove lines, by applying force to the panel.
摘要翻译: 基板切割方法包括以下步骤:沿着切割线对准包括两个或更多个基板的面板,沿着切割线在所述面板的各个基板中形成凹槽线,通过沿着切割线振荡相应的紫外线UV激光束,以及 沿着凹槽线切割面板,通过向面板施加力。
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公开(公告)号:US20100147813A1
公开(公告)日:2010-06-17
申请号:US12336609
申请日:2008-12-17
IPC分类号: B23K26/38
CPC分类号: B23K26/40 , B23K2103/50 , B28D1/22 , C03B33/0222 , C03B33/04 , C03B33/082
摘要: A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.
摘要翻译: 描述了激光加工玻璃或玻璃状材料的激光加工工艺。 在一个制造操作中,该过程在具有倒角边缘的物品中加工制品或特征。 倒角边缘在玻璃和玻璃状材料中是理想的,因为它们抵抗压裂或碎裂并消除锋利的边缘。 在一个制造操作中在制品中制造物品或特征是期望的,因为通过在激光加工之后不需要将物品转移到单独的机器进行倒角,因此可以节省时间和费用。 或者,它可以允许使用较便宜的设备,因为用于加工的相同的激光可用于形成倒角,而不是具有单独的工艺来执行倒角。 使用激光加工生产倒角可以获得高品质的倒角,无需单独的抛光或精加工。
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公开(公告)号:US07732730B2
公开(公告)日:2010-06-08
申请号:US11106643
申请日:2005-04-15
IPC分类号: B23K26/00
CPC分类号: H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
摘要翻译: 一种激光束加工方法和激光束加工装置,其能够切割工件而不产生在工件表面上的预定切割线的定影和裂纹,其中脉冲激光束照射在工件的预定切割线上 在导致多光子吸收的条件下并且具有与工件内部对准的凝聚点的工作表面,并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝聚点而在工件内部形成改质区域 由此,可以用相当小的力通过从修改区域开始沿着预定切割线的工作而切割工件,并且因为辐射的脉冲激光束几乎不被吸收到工件的表面上,所以表面不熔合 即使形成了修改区域。
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公开(公告)号:US07547613B2
公开(公告)日:2009-06-16
申请号:US11106657
申请日:2005-04-15
申请人: Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人: Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
CPC分类号: H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
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公开(公告)号:US20060283304A1
公开(公告)日:2006-12-21
申请号:US11459774
申请日:2006-07-25
IPC分类号: B26D3/08
CPC分类号: C03B33/033 , B28D1/00 , B28D1/041 , B28D7/04 , B65G49/069 , B65G2249/04 , C03B29/025 , C03B33/04 , C03B33/07 , C03B33/082 , C03B33/09 , C03B33/091 , C03C17/00 , C03C17/007 , C03C17/32 , C03C17/326 , C03C17/34 , C03C17/3405 , C03C2218/355 , G11B5/8404 , Y10T83/0333 , Y10T83/0341 , Y10T83/04 , Y10T225/12 , Y10T225/325
摘要: A method for producing glass plates of any desired contour from sheet glass, comprising the following steps: scribing scribe lines into a least one face of the sheet glass along the contour down to a depth, using a cutting device, and positioning the glass plate on a support. The method is further characterized in that a defined force F is applied to the sheet glass so that it breaks along the scribe lines, said break extending through the entire thickness of the sheet glass. The flat glass may be sandwiched between two flexible plates prior to being placed on a base pad and being subjected to the breaking force.
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公开(公告)号:US20050173387A1
公开(公告)日:2005-08-11
申请号:US11101543
申请日:2005-04-08
申请人: Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
发明人: Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Toshimitsu Wakuda , Kazuhiro Atsumi , Kenichi Muramatsu
IPC分类号: B28D5/00 , B23K26/073 , B23K26/38 , B23K101/40 , C03B33/023 , C03B33/08 , C03B33/10 , C03C23/00 , G02F1/1368 , H01L21/301 , B23K26/14 , B23K26/16 , G01B9/02
CPC分类号: H01L21/78 , B23K20/023 , B23K20/16 , B23K20/233 , B23K20/26 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/046 , B23K26/0624 , B23K26/066 , B23K26/073 , B23K26/0853 , B23K26/16 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B65G2249/04 , C03B33/023 , C03B33/082 , C03B33/102 , C03C23/0025 , G02F1/1368 , H01L21/6836 , H01L2221/68327 , Y02P40/57 , Y10T29/49144 , Y10T83/0341
摘要: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
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公开(公告)号:US06864460B2
公开(公告)日:2005-03-08
申请号:US10187881
申请日:2002-07-02
申请人: Michael Cummings , Glover Ruiz , Cecil Archibald
发明人: Michael Cummings , Glover Ruiz , Cecil Archibald
IPC分类号: B28D5/00 , B23K26/00 , B23K26/04 , B23K26/38 , B23K26/40 , B28D1/22 , C03B33/08 , C03B33/09 , C03C23/00 , H05K3/00
CPC分类号: C03B33/0207 , B23K26/382 , B23K26/40 , B23K2103/50 , B23K2103/52 , B28D1/221 , B65G49/068 , C03B33/0222 , C03B33/082 , C03C23/0025 , H05K3/0029
摘要: A method of ablating a hole into a hard, non-metallic substrate is disclosed. At least on laser assembly capable of generating a laser beam in an axis having a focus that is moveable relative to said axis is provided. A focus of the laser beam is positioned adjacent at least one surface of the substrate. A first layer of the substrate is ablated by the laser beam. The focus is moved relative to the axis corresponding to the depth of the substrate thereby enabling ablation of successive layers of the substrate. Successive layers of the substrate are ablated to generate a hole into the substrate.
摘要翻译: 公开了将孔烧蚀成硬质非金属基材的方法。 至少提供能够在具有可相对于所述轴线移动的焦点的轴上产生激光束的激光组件。 激光束的焦点位于衬底的至少一个表面附近。 基板的第一层被激光束烧蚀。 焦点相对于对应于衬底的深度的轴移动,从而能够消除衬底的连续层。 衬底的连续层被消融以在衬底中产生孔。
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公开(公告)号:US20030019897A1
公开(公告)日:2003-01-30
申请号:US10053158
申请日:2002-01-15
发明人: Ta-Ko Chuang , Sakae Tanaka
IPC分类号: B26F003/00
CPC分类号: C03B33/076 , B23K26/40 , B23K2103/16 , B23K2103/50 , B28D1/225 , B28D5/0011 , B28D5/0029 , B28D5/0035 , C03B33/033 , C03B33/082 , Y10T225/12 , Y10T225/371
摘要: A method for separating a brittle material is provided. First, a brittle material, having a first surface and a second surface, is provided. Then, a reference line is scribed on a predetermined position of the first surface of the brittle material along a first direction by laser. Finally, a soft-breaker is provided, and the soft-breaker separates the brittle material along a second direction by strikes the second surface of the brittle material. Thus, the quality of the brittle material, separated based on the method of this invention, is maintained at a certain level so that the processes subsequent to the separation process are reduced.
摘要翻译: 提供了分离脆性材料的方法。 首先,提供具有第一表面和第二表面的脆性材料。 然后,通过激光沿着第一方向在脆性材料的第一表面的预定位置刻划参考线。 最后,提供软断路器,软断路器通过撞击脆性材料的第二表面沿第二方向分离脆性材料。 因此,基于本发明的方法分离的脆性材料的质量保持在一定水平,使得分离过程之后的方法降低。
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公开(公告)号:US20030019243A1
公开(公告)日:2003-01-30
申请号:US10171866
申请日:2002-06-17
IPC分类号: C03B033/09
CPC分类号: C03C17/001 , C03B33/023 , C03B33/082 , C03B33/102 , Y02P40/57 , Y10T83/0414 , Y10T225/12
摘要: The invention concerns a procedure to mark groove traces of laser-induced grooves of glass components by optical visualization. The invention is characterized by the fact that the optical visualization is created by a at least partial application of a coating on the groove trace.
摘要翻译: 本发明涉及通过光学可视化来标记玻璃部件的激光诱导凹槽的凹槽迹线的步骤。 本发明的特征在于,光学可视化是通过在凹槽迹线上的涂层的至少部分应用产生的。
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公开(公告)号:US06362453B1
公开(公告)日:2002-03-26
申请号:US09267683
申请日:1999-03-15
申请人: Jun Wang , Hiroyuki Niino , Akira Yabe
发明人: Jun Wang , Hiroyuki Niino , Akira Yabe
IPC分类号: B23K2612
CPC分类号: C03C23/0025 , B23K26/0624 , B23K26/066 , B23K26/1224 , B23K26/18 , B23K26/361 , B23K26/40 , B23K2103/50 , B28D1/221 , C03B33/0207 , C03B33/082 , C03C15/00
摘要: A method of etching a surface of a transparent solid material with a laser beam, wherein the surface is irradiated with the laser beam having a fluence of 0.01-100 J/cm2/pulse while maintaining a fluid capable of absorbing the laser beam in contact with an opposite surface of the solid material.
摘要翻译: 一种用激光束蚀刻透明固体材料的表面的方法,其中用能量为0.01-100J / cm 2 /脉冲的激光束照射该表面,同时保持能够吸收激光束的流体与 固体材料的相对表面。
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