利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

25 条记录 (耗时 0.02 秒)

    METHOD FOR LASER PROCESSING GLASS WITH A CHAMFERED EDGE
    1.
    发明申请
    METHOD FOR LASER PROCESSING GLASS WITH A CHAMFERED EDGE 有权
    用于激光加工玻璃与渐变边缘的方法

    公开(公告)号：US20100147813A1

    公开(公告)日：2010-06-17

    申请号：US12336609

    申请日：2008-12-17

    申请人： Weisheng Lei ,  Glenn Simenson ,  Hisashi Matsumoto ,  Guangyu Li ,  Jeffery Howerton

    发明人： Weisheng Lei ,  Glenn Simenson ,  Hisashi Matsumoto ,  Guangyu Li ,  Jeffery Howerton

    IPC分类号： B23K26/38

    CPC分类号： B23K26/40 ,  B23K2103/50 ,  B28D1/22 ,  C03B33/0222 ,  C03B33/04 ,  C03B33/082

    摘要： A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.

    摘要翻译： 描述了激光加工玻璃或玻璃状材料的激光加工工艺。 在一个制造操作中，该过程在具有倒角边缘的物品中加工制品或特征。 倒角边缘在玻璃和玻璃状材料中是理想的，因为它们抵抗压裂或碎裂并消除锋利的边缘。 在一个制造操作中在制品中制造物品或特征是期望的，因为通过在激光加工之后不需要将物品转移到单独的机器进行倒角，因此可以节省时间和费用。 或者，它可以允许使用较便宜的设备，因为用于加工的相同的激光可用于形成倒角，而不是具有单独的工艺来执行倒角。 使用激光加工生产倒角可以获得高品质的倒角，无需单独的抛光或精加工。

    Method for laser processing glass with a chamfered edge
    2.
    发明授权
    Method for laser processing glass with a chamfered edge 有权

    公开(公告)号：US09302350B2

    公开(公告)日：2016-04-05

    申请号：US12336609

    申请日：2008-12-17

    申请人： Weisheng Lei ,  Glenn Simenson ,  Hisashi Matsumoto ,  Guangyu Li ,  Jeffery Howerton

    发明人： Weisheng Lei ,  Glenn Simenson ,  Hisashi Matsumoto ,  Guangyu Li ,  Jeffery Howerton

    IPC分类号： B23K26/00 ,  B23K26/03 ,  B23K26/40 ,  C03B33/08

    摘要： A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.

    Method for laser processing glass with a chamfered edge
    3.
    发明授权
    Method for laser processing glass with a chamfered edge 有权
    激光加工具有倒角边缘的玻璃的方法

    公开(公告)号：US09346130B2

    公开(公告)日：2016-05-24

    申请号：US12336609

    申请日：2008-12-17

    申请人： Weisheng Lei ,  Glenn Simenson ,  Hisashi Matsumoto ,  Guangyu Li ,  Jeffery Howerton

    发明人： Weisheng Lei ,  Glenn Simenson ,  Hisashi Matsumoto ,  Guangyu Li ,  Jeffery Howerton

    IPC分类号： B23K26/00 ,  B23K26/03 ,  B23K26/40 ,  C03B33/08

    CPC分类号： B23K26/40 ,  B23K2103/50 ,  B28D1/22 ,  C03B33/0222 ,  C03B33/04 ,  C03B33/082

    摘要： A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step.

    摘要翻译： 描述了激光加工玻璃或玻璃状材料的激光加工工艺。 在一个制造操作中，该过程在具有倒角边缘的物品中加工制品或特征。 倒角边缘在玻璃和玻璃状材料中是理想的，因为它们抵抗压裂或碎裂并消除锋利的边缘。 在一个制造操作中在制品中制造物品或特征是期望的，因为通过在激光加工之后不需要将物品转移到单独的机器进行倒角，因此可以节省时间和费用。 或者，它可以允许使用较便宜的设备，因为用于加工的相同的激光可用于形成倒角，而不是具有单独的工艺来执行倒角。 使用激光加工生产倒角可以获得高品质的倒角，无需单独的抛光或精加工。

    METHOD FOR IMPROVED BRITTLE MATERIALS PROCESSING
    5.
    发明申请
    METHOD FOR IMPROVED BRITTLE MATERIALS PROCESSING 审中-公开
    改进的脆性材料加工方法

    公开(公告)号：US20100252959A1

    公开(公告)日：2010-10-07

    申请号：US12732020

    申请日：2010-03-25

    申请人： Weisheng Lei ,  Glenn Simenson ,  Hisashi Matsumoto ,  Guangyu Li ,  Jeffrey Howerton

    发明人： Weisheng Lei ,  Glenn Simenson ,  Hisashi Matsumoto ,  Guangyu Li ,  Jeffrey Howerton

    IPC分类号： B44C1/22 ,  B29C35/08

    CPC分类号： B23K26/40 ,  B23K2103/50

    摘要： An improved method for laser machining features in brittle materials such as glass is presented, wherein a tool path related to a feature is analyzed to determine how many passes are required to laser machine the feature using non-adjacent laser pulses. Laser pulses applied during subsequent passes are located so as to overlap previous laser spot locations by a predetermined overlap amount. In this way no single spot receives excessive laser radiation caused by immediately subsequent laser pulses being applied adjacent to a previous pulse location.

    摘要翻译： 提出了一种用于脆性材料如玻璃中的激光加工特征的改进方法，其中分析与特征相关的刀具路径，以确定使用不相邻的激光脉冲激光加工特征所需的通过数量。 在后续通过期间施加的激光脉冲被定位成与先前的激光光斑位置重叠预定的重叠量。 以这种方式，没有单个点接收由紧邻的先前脉冲位置施加的紧随其后的激光脉冲引起的过多的激光辐射。

    Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
    8.
    发明申请
    Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories 有权
    通过以圆形和螺旋形轨迹移动精确定时的激光脉冲来处理孔的方法

    公开(公告)号：US20060027544A1

    公开(公告)日：2006-02-09

    申请号：US10912525

    申请日：2004-08-04

    申请人： Robert Pailthorp ,  Weisheng Lei ,  Hisashi Matsumoto ,  Glenn Simenson ,  David Watt ,  Mark Unrath ,  William Jordens

    发明人： Robert Pailthorp ,  Weisheng Lei ,  Hisashi Matsumoto ,  Glenn Simenson ,  David Watt ,  Mark Unrath ,  William Jordens

    IPC分类号： B23K26/38

    CPC分类号： H05K3/0026 ,  B23K26/389 ,  H05K2201/09063

    摘要： High speed removal of material from a specimen employs a beam positioner for directing a laser beam axis along various circular and spiral laser tool patterns. A preferred method of material removal entails causing relative movement between the axis of the beam and the specimen, directing the beam axis at an entry segment acceleration and along an entry trajectory to an entry position within the specimen at which laser beam pulse emissions are initiated, moving the beam axis at a circular perimeter acceleration within the specimen to remove material along a circular segment of the specimen, and setting the entry segment acceleration to less than twice the circular perimeter acceleration.

    摘要翻译： 从样品高速去除材料采用光束定位器，用于沿着各种圆形和螺旋形激光工具图案引导激光束轴线。 优选的材料去除方法需要引起梁的轴线和样品之间的相对运动，将束轴线以入口段加速度并沿着入口轨迹引导到在激光束脉冲发射开始的样本内的入口位置， 沿着试样中的圆周边加速度移动光束轴，以沿着试样的圆形段移除材料，并将进入段加速度设置为小于圆周边加速度的两倍。

    Multiple laser wavelength and pulse width process drilling
    10.
    发明授权
    Multiple laser wavelength and pulse width process drilling 失效
    多激光波长和脉冲宽度工艺钻孔

    公开(公告)号：US08116341B2

    公开(公告)日：2012-02-14

    申请号：US11756507

    申请日：2007-05-31

    申请人： Weisheng Lei ,  Yunlong Sun ,  Yasu Osako ,  John Davignon ,  Glenn Simenson ,  Hisashi Matsumoto

    发明人： Weisheng Lei ,  Yunlong Sun ,  Yasu Osako ,  John Davignon ,  Glenn Simenson ,  Hisashi Matsumoto

    IPC分类号： H01S3/109 ,  H01S3/10 ,  B23K26/38

    CPC分类号： H05K3/0038 ,  B23K26/389 ,  H01S3/0092 ,  H01S3/082 ,  H01S3/107 ,  H01S3/109 ,  H01S3/117 ,  H05K1/0366 ,  H05K3/0035 ,  H05K2203/108

    摘要： Dual-beam laser outputs, preferably derived from a single laser beam, improve the quality of the sidewalls of vias drilled in a target material, such as printed circuit board, comprising fiber-reinforced resin. Two embodiments each use two laser output components to remove a portion of target material from a target material location of a workpiece and rapidly clean remnants of the target material bonded to a metal layer underlying the target material location at a material removal rate. A first embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and second wavelengths. A second embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and pulse widths.

    摘要翻译： 优选地衍生自单个激光束的双光束激光输出提高了在包括纤维增强树脂的目标材料（例如印刷电路板）中钻出的通孔的侧壁质量。 两个实施例各自使用两个激光输出部件来从工件的目标材料位置移除目标材料的一部分，并以材料去除速率快速地清洁与目标材料位置下方的金属层粘合的残留物。 第一实施例需要引导入射到目标材料位置处的目标材料的一部分，处理激光输出具有由相应的第一和第二波长表征的第一和第二分量。 第二实施例需要引导在目标材料位置处的目标材料的一部分上的入射，该处理激光输出具有由相应的第一和第二脉冲宽度表征的第一和第二分量。