MEMS Capacitive Bending and Axial Strain Sensor
    52.
    发明申请
    MEMS Capacitive Bending and Axial Strain Sensor 有权
    MEMS电容弯曲和轴向应变传感器

    公开(公告)号:US20070256502A1

    公开(公告)日:2007-11-08

    申请号:US11552547

    申请日:2006-10-25

    CPC classification number: G01L1/148

    Abstract: A three-dimensional micro-electro-mechanical-systems (MEMS) capacitive bending and axial strain sensor capacitor is described. Two independent comb structures, incorporating suspended polysilicon interdigitated fingers, are fabricated simultaneously on a substrate that can displace independently of each other while attached to a substrate undergoing bending or axial deformation. A change in spacing between the interdigitated fingers will output a change in capacitance of the sensor and is the primary mode of operation of the device. On the bottom and to the end of each comb structure, a glass pad is attached to the comb structure to allow for ample surface area for affixing the sensor to a substrate. During fabrication, tethers are used to connect each comb structure to maintain equal spacing between the fingers before attachment to the substrate. After attachment, the tethers are broken to allow independent movement of each comb structure.

    Abstract translation: 描述了三维微电子机械系统(MEMS)电容弯曲和轴向应变传感器电容器。 两个独立的梳形结构,并入悬浮的多晶硅叉指,同时被制造在基板上,该基板可以在连接到经历弯曲或轴向变形的基板上时彼此独立地移位。 交叉指状物之间的间距变化将输出传感器的电容变化,并且是器件的主要操作模式。 在每个梳结构的底部和末端,玻璃垫连接到梳状结构以允许足够的表面积将传感器固定到基底上。 在制造过程中,系绳用于连接每个梳状结构,以在连接到基底之前在指状物之间保持相等的间隔。 连接后,系绳被破坏以允许每个梳结构的独立移动。

    Organic semiconductor sensor device

    公开(公告)号:US07141839B2

    公开(公告)日:2006-11-28

    申请号:US11021063

    申请日:2004-12-22

    Abstract: Sensor cells are arranged in an array in an organic semiconductor layer. Row and column select circuitry addresses the cells of the array one cell at a time to determine the presence of an object, such as a fingerprint ridge or valley, contacting or proximate to a sensing surface above each cell. Control circuitry can be provided in a companion silicon chip or in a second layer of organic semiconductor material to communicate with the array and an associated system processor. The array of sensor cells can be fabricated using a flexible polymer substrate that is peeled off and disposed of after contacts have been patterned on the organic semiconductor layer. The organic semiconductor layer can be used with a superimposed reactive interface layer to detect specific chemical substances in a test medium.

    Micro-electromechanical sensor
    54.
    发明申请

    公开(公告)号:US20060117857A1

    公开(公告)日:2006-06-08

    申请号:US11329765

    申请日:2006-01-10

    CPC classification number: G01L1/148 G01L9/0073

    Abstract: A force or pressure transducer is disclosed. In one embodiment, the transducer has a substrate, a dielectric material disposed on the substrate, a spacing member disposed on the dielectric material, and a resilient element disposed on the dielectric material and the spacing member. A portion of the resilient element is separated from the dielectric material, and a portion of the resilient element is in contact with the dielectric material. The contact area between the resilient element and the dielectric material varies in response to movement of the resilient element. Changes in the contact area alter the capacitance of the transducer, which can be measured by circuit means.

    Apparatus for detecting a physical quantity acting as an external force and method for testing and manufacturing this apparatus
    55.
    发明申请
    Apparatus for detecting a physical quantity acting as an external force and method for testing and manufacturing this apparatus 失效
    用于检测作为外力的物理量的装置和用于测试和制造该装置的方法

    公开(公告)号:US20040189340A1

    公开(公告)日:2004-09-30

    申请号:US10816548

    申请日:2004-04-01

    Inventor: Kazuhiro Okada

    Abstract: A sensor comprises a semiconductor pellet (10) including a working portion (11) adapted to undergo action of a force, a fixed portion (13) fixed on the sensor body, and a flexible portion (13) having flexibility formed therebetween, a working body (20) for transmitting an exterted force to the working portion, and detector means (60-63) for transforming a mechanical deformation produced in the semiconductor pellet to an electric signal to thereby detect a force exerted on the working body as an electric signal. A signal processing circuit is applied to the sensor. This circuit uses analog multipliers (101-109) and analog adders/subtracters (111-113), and has a function to cancel interference produced in different directions. Within the sensor, two portions (E3, E4-E8) located at positions opposite to each other and producing a displacement therebetween by action of a force are determined. By exerting a coulomb force between both the portions, the test of the sensor is carried out. Further, a pedestal (21, 22) is provided around the working body (20). The working body and the pedestal are located with a predetermined gap or spacing therebetween. A displacement of the working body is caused to limitatively fall within a predetermined range Corresponding to the spacing. The working body and the pedestal are provided by cutting a same common substrate (350, 350null).

    Abstract translation: 传感器包括半导体颗粒(10),其包括适于承受力的作用部分(11),固定在传感器主体上的固定部分(13)和在其之间形成柔性的柔性部分(13),工作 用于向工作部分传递消除的力的主体(20)和用于将半导体芯片中产生的机械变形变换为电信号的检测器装置(60-63),从而检测施加在工作体上的力作为电信号 。 信号处理电路被应用于传感器。 该电路使用模拟乘法器(101-109)和模拟加法器/减法器(111-113),并具有消除在不同方向产生的干扰的功能。 在传感器内,确定位于彼此相对的位置并通过力的作用产生位移之间的两个部分(E3,E4-E8)。 通过在两个部分之间施加库仑力,进行传感器的测试。 此外,在工作体(20)的周围设置基座(21,22)。 工作体和基座以其间具有预定的间隙或间隔而定位。 导致工作体的位移被限制地落在预定范围内对应于间隔。 通过切割相同的公共衬底(350,350')来提供工作体和基座。

    Micro-electromechanical sensor
    56.
    发明申请
    Micro-electromechanical sensor 有权
    微机电传感器

    公开(公告)号:US20030072127A1

    公开(公告)日:2003-04-17

    申请号:US10198304

    申请日:2002-07-17

    CPC classification number: G01L1/148 G01L9/0073

    Abstract: A force or pressure transducer is disclosed. In one embodiment, the transducer has a substrate, a dielectric material disposed on the substrate, a spacing member disposed on the dielectric material, and a resilient element disposed on the dielectric material and the spacing member. A portion of the resilient element is separated from the dielectric material, and a portion of the resilient element is in contact with the dielectric material. The contact area between the resilient element and the dielectric material varies in response to movement of the resilient element. Changes in the contact area alter the capacitance of the transducer, which can be measured by circuit means.

    Abstract translation: 公开了一种力或压力传感器。 在一个实施例中,换能器具有衬底,设置在衬底上的电介质材料,设置在电介质材料上的间隔构件和设置在电介质材料和间隔构件上的弹性元件。 弹性元件的一部分与介电材料分离,弹性元件的一部分与电介质材料接触。 弹性元件和电介质材料之间的接触面积随弹性元件的移动而变化。 接触面积的变化会改变传感器的电容,可以通过电路来测量。

    Capacitive strain sensor and method for using the same
    57.
    发明授权
    Capacitive strain sensor and method for using the same 失效
    电容应变传感器及其使用方法

    公开(公告)号:US06532824B1

    公开(公告)日:2003-03-18

    申请号:US09786944

    申请日:2001-03-08

    Abstract: A capacitive strain sensor comprises a substrate (119) and a pair of interdigital electrode capacitors (209, 209A) formed on the substrate. A dielectric thick film (129) having a uniform thickness and made of a material the dielectric constant of which varies with strain is provided on an elastic body having a flat or curved surface on the substrate (119). A block (318) for preventing strain from being produced is secured to one end of the substrate (119); a weight (329) is secured to the other end. The capacitors (209, 209A) are formed by interdigitally arranging a pair of electrodes being parallel linear electrodes of linear conductors on the substrate.

    Abstract translation: 电容式应变传感器包括基板(119)和形成在基板上的一对叉指电极电容器(209,209A)。 具有均匀厚度并由其介电常数随应变变化的材料制成的电介质厚膜(129)设置在基板(119)上具有平坦或弯曲表面的弹性体上。 用于防止产生应变的块(318)被固定到基板(119)的一端; 重物(329)固定在另一端。 电容器(209,209A)通过在基板上以直线方式布置成线状导体的平行线状电极的一对电极而形成。

    Process for the separation of at least two elements of a structure in contact with one another by ion implantation
    58.
    发明授权
    Process for the separation of at least two elements of a structure in contact with one another by ion implantation 失效
    通过离子注入使至少两个彼此接触的结构元件分离的方法

    公开(公告)号:US06225190B1

    公开(公告)日:2001-05-01

    申请号:US08970077

    申请日:1997-11-13

    CPC classification number: G01L9/0073 C30B29/36 C30B31/22 C30B33/00 G01L1/148

    Abstract: A process for separating at least two elements of a structure. The two elements are in contact with one another along an interface and are fixed to one another by interatomic bonds at their interface. An ion implantation is performed in order to introduce ions into the structure with an adequate energy for them to reach the interface and with an adequate dose to break the interatomic bonds. This brings about at the interface, the formation of a gaseous phase having an adequate pressure to permit the separation of the two elements.

    Abstract translation: 用于分离结构的至少两个元件的方法。 两个元件沿着界面彼此接触并且通过其界面处的原子间键彼此固定。 进行离子注入以便将离子以足够的能量引入结构中,以使它们到达界面并以足够的剂量破坏原子间键。 这在界面处产生具有足够压力以允许两个元件分离的气相的形成。

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