公开(公告)号：US06762938B2

公开(公告)日：2004-07-13

申请号：US10021936

申请日：2001-12-13

申请人： Parviz Tayebati ,  Brian Cranton ,  Daryoosh Vakhshoori ,  Masud E. Azimi ,  Kevin J. McCallion

发明人： Parviz Tayebati ,  Brian Cranton ,  Daryoosh Vakhshoori ,  Masud E. Azimi ,  Kevin J. McCallion

IPC分类号： H05K720

CPC分类号： H01S5/02415 ,  G02B26/001 ,  H01S5/02446 ,  H01S5/02476 ,  Y10S257/93

摘要： Apparatus is disclosed for providing auxiliary cooling and thermal stability to a temperature sensitive opto-electronic component. The disclosed apparatus comprising a primary thermal control system having a first thermal connection with a primary structure supporting at least one component of an optical system and a second thermal connection being thermally connected with an external environment; and an auxiliary thermal control system having a first thermal connection being thermally connected with the temperature sensitive opto-electronic component, and the auxiliary thermal control system having a second thermal connection being thermally connected with the primary thermal control system whereby the auxiliary thermal control system provides cooling to the temperature sensitive opto-electronic component and the primary thermal control system provides additional cooling to the auxiliary thermal control system through temperature regulation of the primary structure.

摘要翻译： 公开了用于向温度敏感的光电子部件提供辅助冷却和热稳定性的装置。 所公开的设备包括主热控制系统，其具有第一热连接，其具有支撑光学系统的至少一个部件的主结构和与外部环境热连接的第二热连接; 以及辅助热控制系统，其具有与所述感温光电子部件热连接的第一热连接，并且所述辅助热控制系统具有与主热控制系统热连接的第二热连接，由此所述辅助热控制系统提供 冷却到温度敏感的光电子部件，并且主要热控制系统通过一级结构的温度调节为辅助热控制系统提供额外的冷却。

公开(公告)号：US06758610B2

公开(公告)日：2004-07-06

申请号：US10016473

申请日：2001-12-10

申请人： Mehrdad Ziari ,  Robert J. Lang ,  Tanya K. Oleskevich ,  Vivek Agrawal ,  Ashok P. Kanjamala ,  Donald C. Hargreaves ,  Harrison L. Ransom ,  David Dawson ,  Radhakrishnan L. Nagarajan

发明人： Mehrdad Ziari ,  Robert J. Lang ,  Tanya K. Oleskevich ,  Vivek Agrawal ,  Ashok P. Kanjamala ,  Donald C. Hargreaves ,  Harrison L. Ransom ,  David Dawson ,  Radhakrishnan L. Nagarajan

IPC分类号： G02B642

CPC分类号： G02B6/4225 ,  G02B6/4201 ,  G02B6/4238 ,  G02B6/4257 ,  G02B6/4267 ,  G02B6/4268 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02446

摘要： An optical connection module attaches an active or passive optical component to a substrate and aligns the optical component with a first laser. The optical connection module includes a fiber submount that is attached to the substrate and that includes a thermally insulating material having a thickness greater than 20 micrometers. The optical component is soldered to the fiber submount using heat from a second laser. A laser submount is attached to the substrate. The first laser is attached to the laser submount. A fiber bonding pad is located between the thermally insulating material and the optical component. The thermally insulating material and the fiber bonding pad promote lateral heat transfer and limit vertical heat transfer to the substrate during soldering. The thermally insulating material can be integrally formed in the substrate by flame hydrolysis or by anodic bonding.

摘要翻译： 光学连接模块将有源或无源光学部件附接到基板并将光学部件与第一激光器对准。 光学连接模块包括光纤基座，其附接到基板并且包括厚度大于20微米的绝热材料。 使用来自第二激光器的热量将光学部件焊接到光纤基座。 激光基座安装在基板上。 第一个激光器连接到激光器底座。 光纤接合焊盘位于绝热材料和光学部件之间。 绝热材料和纤维粘合垫促进横向热传递，并限制在焊接期间垂直的热传递到基底。 绝热材料可以通过火焰水解或通过阳极接合一体地形成在基板中。

公开(公告)号：US06693936B2

公开(公告)日：2004-02-17

申请号：US09907192

申请日：2001-07-17

申请人： Yasuo Kitaoka ,  Kiminori Mizuuchi ,  Kazuhisa Yamamoto

发明人： Yasuo Kitaoka ,  Kiminori Mizuuchi ,  Kazuhisa Yamamoto

IPC分类号： H01S500

CPC分类号： H01S5/06256 ,  G02B6/12004 ,  G02B6/4202 ,  G02B6/4224 ,  G02B6/423 ,  G02B6/4231 ,  G02B6/4238 ,  G02B6/4249 ,  G02F1/3775 ,  H01L2224/48463 ,  H01S5/0092 ,  H01S5/0224 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/02446 ,  H01S5/125

摘要： A wavelength-variable semiconductor laser includes: a submount; and a semiconductor laser chip being mounted onto the submount and having at least an active layer region and a distributed Bragg reflection region, wherein the semiconductor laser chip is mounted onto the submount in such a manner that an epitaxial growth surface thereof faces the submount and a heat transfer condition of the active layer region is different from a heat transfer condition of the distributed Bragg reflection region. Moreover, an optical integrated device includes at least a semiconductor laser and an optical waveguide device both mounted on a submount, wherein the semiconductor laser is the wavelength-variable semiconductor laser as set forth above.

摘要翻译： 波长可变半导体激光器包括：基座; 以及将半导体激光芯片安装在所述基座上并且具有至少一个有源层区域和分布式布拉格反射区域，其中所述半导体激光器芯片以使其外延生长表面面向所述基座的方式安装到所述基座上，并且 有源层区域的传热条件与分布式布拉格反射区域的传热条件不同。 此外，光学集成器件至少包括半导体激光器和安装在基座上的光波导器件，其中半导体激光器是如上所述的波长可变半导体激光器。

公开(公告)号：US06650667B2

公开(公告)日：2003-11-18

申请号：US09858330

申请日：2001-05-15

申请人： Hideyuki Nasu ,  Sumio Sugata

发明人： Hideyuki Nasu ,  Sumio Sugata

IPC分类号： H01S3131

CPC分类号： H01S5/0687 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02446 ,  H01S5/06837

摘要： A semiconductor laser apparatus comprises a light-emitting portion including a light-emitting device for outputting a laser beam, a light-receiving element for receiving the laser beam outputted from said light-emitting device, a wavelength monitoring portion including an optical system disposed between said light-emitting device and said light-receiving element, a control portion for controlling the wavelength of the laser beam outputted from said light-emitting device by controlling the temperature of said light-emitting device based on the wavelength of the laser beam detected by said wavelength monitoring portion, an optical isolator disposed on the optical path between said light-emitting device and said wavelength monitoring portion for preventing the light from returning from said wavelength monitoring portion back to said light-emitting device, and a temperature regulating portion for independently controlling the temperatures of said light-emitting portion and wavelength monitoring portion.

公开(公告)号：US20030108304A1

公开(公告)日：2003-06-12

申请号：US10016473

申请日：2001-12-10

发明人： Mehrdad Ziari ,  Robert J. Lang ,  Tanya K. Oleskevich ,  Vivek Agrawal ,  Ashok P. Kanjamala

IPC分类号： G02B006/42

CPC分类号： G02B6/4225 ,  G02B6/4201 ,  G02B6/4238 ,  G02B6/4257 ,  G02B6/4267 ,  G02B6/4268 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02446

摘要： An optical connection module attaches an active or passive optical component to a substrate and aligns the optical component with a first laser. The optical connection module includes a fiber submount that is attached to the substrate and that includes a thermally insulating material having a thickness greater than 20 micrometers. The optical component is soldered to the fiber submount using heat from a second laser. A laser submount is attached to the substrate. The first laser is attached to the laser submount. A fiber bonding pad is located between the thermally insulating material and the optical component. The thermally insulating material and the fiber bonding pad promote lateral heat transfer and limit vertical heat transfer to the substrate during soldering. The thermally insulating material can be integrally formed in the substrate by flame hydrolysis or by anodic bonding.

摘要翻译： 光学连接模块将有源或无源光学部件附接到基板并使光学部件与第一激光器对准。 光学连接模块包括光纤基座，其附接到基板并且包括厚度大于20微米的绝热材料。 使用来自第二激光器的热量将光学部件焊接到光纤基座。 激光基座安装在基板上。 第一个激光器连接到激光器底座。 光纤接合焊盘位于绝热材料和光学部件之间。 绝热材料和纤维粘合垫促进横向热传递，并限制在焊接期间垂直的热传递到基底。 绝热材料可以通过火焰水解或通过阳极接合一体地形成在基板中。

公开(公告)号：US06572279B2

公开(公告)日：2003-06-03

申请号：US10191518

申请日：2002-07-10

申请人： Toshio Takagi

发明人： Toshio Takagi

IPC分类号： G02B636

CPC分类号： G02B6/4204 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/19107 ,  H01L2924/30111 ,  H01S5/02216 ,  H01S5/02276 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02446 ,  H01L2924/00 ,  H01L2224/45099

摘要： The present invention relates to a light-emitting module employable in optical communications. A light-emitting module 10 comprises a semiconductor light-emitting device 12, a first mounting member 14, a driving device 16, a second mounting member 18, and a housing 20. The first mounting member 14 mounts the light-emitting device 12. The driving device 16 drives the light-emitting device 12. The second mounting member 18 mounts the driving device 16. The housing 20 accommodates the light-emitting device 12, first mounting member 14, driving device 16, and second mounting member 18. The first mounting member 14 and the second mounting member 18 are disposed apart from each other within the housing 20. Since the mounting members are not directly in contact with each other, the heat generated by the driving device 16 is hard to be transmitted to the light-emitting device 12. Therefore, the light-emitting device 12 is restrained from changing its temperature, whereby its output is stabilized.

公开(公告)号：US5867513A

公开(公告)日：1999-02-02

申请号：US890339

申请日：1997-07-10

申请人： Kazuyoshi Sato

发明人： Kazuyoshi Sato

IPC分类号： H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/068 ,  H01S5/0683 ,  H01S5/0687 ,  H01S3/13

CPC分类号： H01S5/02415 ,  H01S5/0687 ,  H01S5/02216 ,  H01S5/02446 ,  H01S5/06804 ,  H01S5/0683 ,  H01S5/06837

摘要： A semiconductor laser unit includes a semiconductor laser device, a first temperature detector that detects a temperature in the vicinity of the semiconductor laser device, and an electronic cooler that heats or cools the semiconductor laser device. The semiconductor laser unit also includes first and second branching devices for extracting first and second branched lights from an oscillation light outgoing from the semiconductor laser device, a band pass filter that transmits only a light of a predetermined wavelength band among the first branched light, and an optical filter that transmits the second branched light so that a transmission loss is increased or decreased in one way with a change of the wavelength within a wavelength band where the oscillation wavelength of the semiconductor laser device can be changed, to output a second monitor light. The levels of lights which transmit each wavelength are transmitted are detected, respectively, and when the level of light that passes through the band pass filter is increased, a direction of changing the wavelength is detected according to an increase or decrease of the level of light that passes through the optical filter, and the temperature is changed by the electronic cooler to control the wavelength of the semiconductor laser device. Thus, both of the output level and the wavelength of the oscillation light from the semiconductor laser are stabilized.

摘要翻译： 半导体激光器单元包括半导体激光器件，检测半导体激光器件附近的温度的第一温度检测器和加热或冷却半导体激光器件的电子冷却器。 半导体激光单元还包括用于从半导体激光器件出射的振荡光中提取第一和第二分支光的第一和第二分支器件，仅透射第一分支光中的预定波长带的光的带通滤波器，以及 透射第二分支光的光学滤波器，使得随着可以改变半导体激光器件的振荡波长的波长带内的波长的变化，以一种方式增加或减少传输损耗，以输出第二监视光 。 分别检测发送各波长的光的电平，并且当通过带通滤波器的光的水平增加时，根据光的水平的增加或减少来检测波长的变化方向 其通过滤光器，并且电子冷却器改变温度以控制半导体激光器件的波长。 因此，来自半导体激光器的振荡光的输出电平和波长都稳定。

公开(公告)号：US5699377A

公开(公告)日：1997-12-16

申请号：US640417

申请日：1996-04-30

申请人： Jing-Jong Pan

发明人： Jing-Jong Pan

IPC分类号： G02B6/42 ,  H01S5/022 ,  H01S5/14 ,  H01S3/08 ,  G02B6/00

CPC分类号： G02B6/0218 ,  G02B6/4208 ,  G02B6/4215 ,  G02B6/424 ,  H01S5/147 ,  G02B6/4265 ,  G02B6/4269 ,  G02B6/4271 ,  G02B6/4286 ,  H01S3/1053 ,  H01S3/1055 ,  H01S5/0064 ,  H01S5/02216 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02446

摘要： A semiconductor laser source having a laser diode and a fiber Bragg grating is described. The laser diode has first and second facets from which output light is emitted. A first end of the fiber Bragg grating is located near the second facet to receive output light from the laser diode. The fiber Bragg grating has a very narrow linewidth about a selected wavelength and reflects output light in the selected narrow linewidth back into the laser diode through its second facet. The output light emitted from the first facet has a very narrow linewidth about the selected linewidth.

摘要翻译： 描述了具有激光二极管和光纤布拉格光栅的半导体激光源。 激光二极管具有从其输出光的第一和第二小平面。 光纤布拉格光栅的第一端位于第二面附近以接收来自激光二极管的输出光。 光纤布拉格光栅具有围绕所选波长的非常窄的线宽，并将所选窄线宽中的输出光通过其第二面反射回激光二极管。 从第一小面发射的输出光线对于所选择的线宽具有非常窄的线宽。

公开(公告)号：US4910741A

公开(公告)日：1990-03-20

申请号：US203310

申请日：1988-06-06

申请人： Allen D. Pillsbury ,  Michael F. Richardson ,  David Welford

发明人： Allen D. Pillsbury ,  Michael F. Richardson ,  David Welford

IPC分类号： H01S5/022 ,  H01S5/024 ,  H01S5/062 ,  H01S5/0683

CPC分类号： H01S5/02453 ,  H01S5/02288 ,  H01S5/02446 ,  H01S5/06804

摘要： A frequency tunable, athermal, laser diode source assembly, having a collimating lens coupled via a thermally compensating apparatus to a laser diode, the lens and diode mounted in a temperature compensating structure. A temperature controller controls the operating temperature and frequency of the diode. The assembly is ruggedized for hostile environments.

公开(公告)号：US20180109072A1

公开(公告)日：2018-04-19

申请号：US15719946

申请日：2017-09-29

申请人： FANUC CORPORATION

发明人： Tetsuhisa TAKAZANE

IPC分类号： H01S5/022 ,  H01S5/40 ,  H01S5/024 ,  H01S5/042

CPC分类号： H01S5/02288 ,  H01S5/005 ,  H01S5/02216 ,  H01S5/02252 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02438 ,  H01S5/02446 ,  H01S5/042 ,  H01S5/4012

摘要： To provide a laser oscillator allowing the use of a plastic lens in a semiconductor laser module for a high-output laser oscillator while being unlikely to reduce the efficiency of coupling to an optical fiber even if a laser output changes. A laser oscillator comprises a semiconductor laser module with multiple semiconductor laser elements. The laser oscillator comprises: multiple lenses in a first group provided in the semiconductor laser module for causing laser beams from the semiconductor laser elements to pass through; and a lens in a second group provided in the semiconductor laser module for causing all beams having passed through the multiple lenses in the first group to pass through. The lenses in the first group are plastic lenses. The lens in the second group is a glass lens.