Abstract:
Epoxy laminates, e.g. CEM-1 laminates, include polymeric particles, particularly core-shell particles having an average diameter of about 0.05 to 30 μm, which reduce the dust produced during manufacture of printed circuit boards.
Abstract:
A copper foil pattern is formed such that mountain portions and valley portions thereof are continuous to be substantially orthogonal to a forward direction of a printed circuit board at the time of solder immersion, and a non-copper foil pattern portion free of a copper foil is provided to be opposed to this copper foil pattern, whereby a peak of the mountain portion is cooled quickly. Thus, a temperature gradient is generated, and a heat is transferred at the time of solder immersion. With this heat transfer, outgases are guided to the peak of the mountain portion, and the guided outgases are easily discharged from a non-copper foil pattern portion in the vicinity of this peak.
Abstract:
A paper base material is impregnated in advance with a Composition containing an alkoxysilane derivative and/or condensate of an alkoxysilane derivative. The paper base material is then impregnated with a thermosetting resin composition containing a phenolic resin, followed by heating and drying to obtain a prepreg. A laminate and a printed wiring board are produced with the use of the prepreg. The prepreg is halogen free and is excellent in heat resistance, flame retardancy, punching processability, and insulation.
Abstract:
The invention concerns a manufacturing process for a contactless smart card (or ticket) which includes the following steps: a manufacturing process for an antenna consisting in screen-printing turns of an electrically conductive polymer ink onto a transfer paper sheet, and then subjecting said support to heat treatment in order to bake and polymerize said conductive ink, connection of a chip 14, provided with contacts, to the antenna 12, lamination consisting in making the transfer paper sheet integral with a layer of plastic material 16 which constitutes the support for the antenna, by hot press molding, in such a way that the screen-printed antenna and the chip are both embedded within the layer of plastic material, removal of the transfer paper sheet, and lamination of the card body onto the antenna support by welding at least one layer of plastic material (18, 20) by hot press molding on each side of the support.
Abstract:
This device for manufacture of an electronic circuit forms a desired circuit pattern P by permeating liquid material (10, 40) including a material for circuit pattern formation into a permeable electronic substrate (100). This device for manufacture comprises an ink jet type head (20, 50) which discharges liquid material (10, 40) against an electronic substrate (100), and a shifting device (70) which relatively shifts the ink jet type head (20, 50) and the electronic substrate (100) with respect to one another.
Abstract:
In a single-sided paper phenolic resin copper-clad laminate composed of a phenolic resin impregnated paper base having copper foils laminated on and resists applied on the face side thereof, resists formed of the same material as the resists on the face side are applied also on the reverse side of the phenolic resin impregnated paper base, so that the face side and the reverse side match approximately with each other in thermal expansibility. The single-sided paper phenolic resin copper-clad laminate warps only slightly even when the peak temperature is raised to a degree suitable for lead-free solder in the reflow process for mounting electronic components.
Abstract:
A method of laser-assisted pressing is used to adjust the pressing position with a laser projector and an impressible element while pressing an opaque object. The apparatus in this invention is characterized by a platform, a pressing unit with at least one press head, and at least one laser projector for projecting a laser beam to form a light area. The press head presses the impressible element to form a pressure mark indicating the pressing position. The light area is then adjusted to match the pressure mark. Finally, the relative positioning of the platform and the pressing unit is adjusted to match the light area with the area to be pressed. Thus the pressing position will be accurate in the pressing process.
Abstract:
The present invention is for providing a rigid-printed wiring board capable of preventing the burst or void phenomenon of a copper paste, and a production method of the rigid-printed wiring board. A rigid-printed wiring board comprising copper clad laminates with a paper phenol or a paper epoxy used as a base, wherein a through hole is provided in the vicinity of a via hole for filling the copper paste, is provided.
Abstract:
A method of applying an edge electrode pattern to a touch screen. The method includes depositing, on a first surface of a decal strip, conductive material in the form of an edge electrode pattern, placing the first surface of the decal strip on one edge of a touch screen, applying heat and pressure to an opposite surface of the decal strip until the edge electrode pattern is transferred from the first surface of the decal strip to the touch screen; and removing the decal strip.
Abstract:
A method of laser-assisted pressing is used to adjust the pressing position with a laser projector and an impressible element while pressing an opaque object. The apparatus in this invention is characterized by a platform, a pressing unit with at least one press head, and at least one laser projector for projecting a laser beam to form a light area. The press head presses the impressible element to form a pressure mark indicating the pressing position. The light area is then adjusted to match the pressure mark. Finally, the relative positioning of the platform and the pressing unit is adjusted to match the light area with the area to be pressed. Thus the pressing position will be accurate in the pressing process.