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    SEMICONDUCTOR UNIT
    52.
    发明申请
    SEMICONDUCTOR UNIT 审中-公开
    半导体器件

    公开(公告)号：US20120057305A1

    公开(公告)日：2012-03-08

    申请号：US13216689

    申请日：2011-08-24

    Applicant: Naoto Morisaku ,  Hirokuni Akiyama

    Inventor： Naoto Morisaku ,  Hirokuni Akiyama

    IPC: H05K7/20

    CPC classification number: H01L35/30 ,  H01L2924/0002 ,  H05K1/16 ,  H05K2201/10219 ,  H01L2924/00

    Abstract: The semiconductor unit includes a wiring board, a conductor layer and a fin. The wiring board has across a thickness thereof a first surface and a second surface. The conductor layer is formed on the first surface of the wiring board. The conductor layer has a length and a width as viewed in the direction of the thickness of the wiring board. The fin is joined to the second surface of the wiring board. The fin has a bent edge that extends in the direction of the length of the conductor layer.

    Abstract translation: 半导体单元包括布线板，导体层和翅片。 布线板的厚度为第一面和第二面。 导体层形成在布线板的第一表面上。 导体层具有沿着布线板的厚度方向观察的长度和宽度。 翅片连接到布线板的第二表面。 翅片具有沿着导体层的长度方向延伸的弯曲边缘。

    THERMOELECTRIC CONVERSION MODULE AND METHOD FOR MANUFACTURING THE SAME
    53.
    发明申请
    THERMOELECTRIC CONVERSION MODULE AND METHOD FOR MANUFACTURING THE SAME 有权
    热电转换模块及其制造方法

    公开(公告)号：US20120021551A1

    公开(公告)日：2012-01-26

    申请号：US13252223

    申请日：2011-10-04

    Applicant: Yasuhiro KAWAUCHI ,  Takanori NAKAMURA

    Inventor： Yasuhiro KAWAUCHI ,  Takanori NAKAMURA

    IPC: H01L35/34

    CPC classification number: H01L35/32 ,  H01L35/34 ,  H05K1/0206 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/10219

    Abstract: A compact, high-performance thermoelectric conversion module includes a laminate having a plurality of insulating layers, p-type thermoelectric semiconductors and n-type thermoelectric semiconductors formed by a technique for manufacturing a multilayer circuit board, particularly a technique for forming a via-conductor. Pairs of the p-type thermoelectric semiconductors and the n-type thermoelectric semiconductors are electrically connected to each other in series through p-n connection conductors to define thermoelectric conversion element pairs. The thermoelectric conversion element pairs are connected in series through, for example, series wiring conductors. The thermoelectric semiconductors each have a plurality of portions in which the peak temperatures of thermoelectric figures of merit are different from each other. These portions are distributed in the stacking direction of the laminate.

    Abstract translation: 小型高性能热电转换模块包括具有多个绝缘层，p型热电半导体和通过用于制造多层电路板的技术形成的n型热电半导体的层压体，特别是形成通孔导体的技术 。 p型热电半导体和n型热电半导体的对通过p-n连接导体串联电连接以限定热电转换元件对。 热电转换元件对通过例如串联布线导体串联连接。 热电半导体各自具有多个热电元件的峰值温度彼此不同的部分。 这些部分沿层叠体的层叠方向分布。

    Thermoelectric Modules and Methods for Manufacturing Thermoelectric Modules
    54.
    发明申请
    Thermoelectric Modules and Methods for Manufacturing Thermoelectric Modules 审中-公开
    热电模块和制造热电模块的方法

    公开(公告)号：US20110256653A1

    公开(公告)日：2011-10-20

    申请号：US13088148

    申请日：2011-04-15

    Applicant: Gustavo Garcia Ramos ,  Francisco Javier Aranceta Aguirre ,  José Javier Borda Camino ,  Antonio José Barbero Merino

    Inventor： Gustavo Garcia Ramos ,  Francisco Javier Aranceta Aguirre ,  José Javier Borda Camino ,  Antonio José Barbero Merino

    IPC: H01L21/50

    CPC classification number: H01L23/38 ,  H01L35/32 ,  H01L2924/0002 ,  H05K1/056 ,  H05K1/16 ,  H05K1/181 ,  H05K2201/10219 ,  Y02P70/611 ,  H01L2924/00

    Abstract: A method for manufacturing a thermoelectric module that involves obtaining a first printed circuit board having a first dielectric layer sandwiched between a first metallic substrate and a first electrical conductive layer, obtaining a second printed circuit board that comprises a second dielectric layer sandwiched between a second metallic substrate and a second electrical conductive layer, and positioning a plurality of N-type and P-type thermoelectric elements having first ends and second ends between the first and second electrical conduction layers so that the first ends of the thermoelectric elements are situated on the first electrical conductive layer and the second ends of the thermoelectric elements are situated on the second electrical conductive layer and arranged to form an electrical circuit that alternates between the N-type and P-type thermoelectric elements.

    Abstract translation: 一种用于制造热电模块的方法，其包括获得具有夹在第一金属基板和第一导电层之间的第一电介质层的第一印刷电路板，获得第二印刷电路板，其包括夹在第二金属 衬底和第二导电层，并且将多个N型和P型热电元件定位在第一和第二导电层之间，其具有第一端和第二端，使得热电元件的第一端位于第一 导电层和热电元件的第二端位于第二导电层上并且布置成形成在N型和P型热电元件之间交替的电路。

    SEMICONDUCTOR DEVICE
    55.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号：US20100243872A1

    公开(公告)日：2010-09-30

    申请号：US12725806

    申请日：2010-03-17

    Applicant: Ryosuke AMANO

    Inventor： Ryosuke AMANO

    IPC: H01L31/024

    CPC classification number: H01L27/14618 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/42 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14636 ,  H01L31/0203 ,  H01L31/024 ,  H01L2023/4056 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/16195 ,  H05K1/021 ,  H05K1/0215 ,  H05K2201/10121 ,  H05K2201/10219 ,  H05K2201/10356 ,  H05K2201/10409 ,  H05K2201/10689 ,  H01L2924/00014

    Abstract: A semiconductor device includes: a semiconductor element having an imaging function, one surface of which serves as a light-receiving surface; a package having a recess containing the semiconductor element with the light-receiving surface facing outward; a light-transmitting plate closing the recess of the package containing the semiconductor element; a conductor provided at the package, electrically connected to the semiconductor element, and electrically connected to an external circuit; a heat conductive member provided to protrude from another surface of the semiconductor element; and a printed circuit board on which the external circuit is provided, on which the semiconductor element is mounted in electrical connection with the external circuit, and which is formed with an opening to serve as a clearance for the heat conductive member.

    Abstract translation: 半导体器件包括：具有成像功能的半导体元件，其一个表面用作光接收表面; 具有包含所述半导体元件的凹部的封装，所述光接收表面面向外; 封闭包含半导体元件的封装的凹部的透光板; 设置在所述封装件处的导体，电连接到所述半导体元件并且电连接到外部电路; 设置成从所述半导体元件的另一表面突出的导热构件; 以及印刷电路板，其上设置有外部电路，半导体元件与外部电路电连接，并且其形成有用作导热构件的间隙的开口。

    Flexible interconnect structures for electrical devices and light sources incorporating the same
    58.
    发明授权
    Flexible interconnect structures for electrical devices and light sources incorporating the same 失效
    用于电气设备和包含其的光源的柔性互连结构

    公开(公告)号：US07273987B2

    公开(公告)日：2007-09-25

    申请号：US10063104

    申请日：2002-03-21

    Applicant: Charles Adrian Becker ,  Stanton Earl Weaver ,  Thomas Elliot Stecher

    Inventor： Charles Adrian Becker ,  Stanton Earl Weaver ,  Thomas Elliot Stecher

    IPC: H05K1/16

    CPC classification number: H05K1/0204 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/185 ,  H05K1/189 ,  H05K3/4611 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10219 ,  H05K2201/10416 ,  H01L2924/00

    Abstract: A flexible interconnect structure allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements, such as light-emitting diodes (“LEDs”) and/or laser diodes. The flexible interconnect structure comprises: (1) at least one flexible dielectric film on which circuit traces and, optionally, electrical circuit components are formed and at least a portion of which is removed through its thickness; and (2) at least a heat sink attached to one surface of the flexible dielectric film opposite to the surface on which circuit traces are formed. The flexible interconnect structure can include a plurality of such flexible dielectric films, each supporting circuit traces and/or circuit components, and each being attached to another by an electrically insulating layer. Electrical devices or light sources having complex shapes are formed from such flexible interconnect structures and light-emitting elements attached to the heat sinks so to be in thermal contact therewith.

    Abstract translation: 灵活的互连结构允许从包括诸如发光二极管（“LED”）和/或激光二极管的发光元件的电气设备产生的热量的快速散热。 柔性互连结构包括：（1）至少一个柔性电介质膜，电路迹线和任选的电路部件形成在其上，其至少一部分通过其厚度去除; 和（2）至少一个附着在与形成电路迹线的表面相对的柔性电介质膜的一个表面上的散热片。 柔性互连结构可以包括多个这样的柔性介电膜，每个支撑电路迹线和/或电路部件，并且每个通过电绝缘层附接到另一个。 具有复杂形状的电气设备或光源由这种柔性互连结构和附接到散热器的发光元件形成为与其热接触。

    Flexible interconnect structures for electrical devices and light sources incorporating the same
    60.
    发明申请
    Flexible interconnect structures for electrical devices and light sources incorporating the same 失效
    用于电气设备和包含其的光源的柔性互连结构

    公开(公告)号：US20030179548A1

    公开(公告)日：2003-09-25

    申请号：US10063104

    申请日：2002-03-21

    Applicant: General Electric Company

    Inventor： Charles Adrian Becker ,  Stanton Earl Weaver ,  Thomas Elliot Stecher

    IPC: H05K007/20 ,  F25D023/12 ,  H01L023/10 ,  H01L023/34

    CPC classification number: H05K1/0204 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/185 ,  H05K1/189 ,  H05K3/4611 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10219 ,  H05K2201/10416 ,  H01L2924/00

    Abstract: A flexible interconnect structure allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements, such as light-emitting diodes (nullLEDsnull) and/or laser diodes. The flexible interconnect structure comprises: (1) at least one flexible dielectric film on which circuit traces and, optionally, electrical circuit components are formed and at least a portion of which is removed through its thickness; and (2) at least a heat sink attached to one surface of the flexible dielectric film opposite to the surface on which circuit traces are formed. The flexible interconnect structure can include a plurality of such flexible dielectric films, each supporting circuit traces and/or circuit components, and each being attached to another by an electrically insulating layer. Electrical devices or light sources having complex shapes are formed from such flexible interconnect structures and light-emitting elements attached to the heat sinks so to be in thermal contact therewith.

    Abstract translation: 灵活的互连结构允许从包括诸如发光二极管（“LED”）和/或激光二极管的发光元件的电气设备产生的热量的快速散热。 柔性互连结构包括：（1）至少一个柔性电介质膜，电路迹线和任选的电路部件形成在其上，其至少一部分通过其厚度去除; 和（2）至少一个附着在与形成电路迹线的表面相对的柔性电介质膜的一个表面上的散热片。 柔性互连结构可以包括多个这样的柔性介电膜，每个支撑电路迹线和/或电路部件，并且每个通过电绝缘层附接到另一个。 具有复杂形状的电气设备或光源由这种柔性互连结构和附接到散热器的发光元件形成为与其热接触。

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